Embodiments of the present disclosure are directed to coated glass articles which reduce glass particle formation caused by glass to glass contact in pharmaceutical glass filling lines.

A photosensitive and via-forming circuit board comprising a laminate unit, a conductor unit, and a cover layer unit is provided. The laminate unit includes an insulating layer, a first conductive wiring layer and a second conductive wiring layer formed at two opposite sides of the insulating layer, respectively, and at least one through-hole surface defining a through hole extending from the upper surface of the first conductive wiring layer through the insulating layer to the lower surface of the second conductive wiring layer. The conductor unit is formed on the at least one through-hole surface. The cover layer unit is formed from a photosensitive composition comprising an epoxy group-containing compound and a photosensitive polyimide capable of reacting with the epoxy group of the epoxy group-containing compound, and includes a first cover layer formed on the first conductive wiring layer and extending into and filling the through hole.

An insulated wire has a conductor, and an insulating film including a first insulating layer covering the conductor and a second insulating layer covering the first insulating layer. The second insulating layer contains a polyimide or a polyamideimide as a main component. The first insulating layer contains a reaction product of a carboxylic acid dianhydride and a diamine as an adhesive component and a component that is the same as the main component in the second insulating layer. At least one of the carboxylic acid dianhydride and the diamine has a carbonyl group.

Various embodiments provide random copolyimides that may possess the mechanical, thermal, chemical and optical properties associated with polyimides yet achieve a low energy surface. In various embodiments, the copolyimides may be prepared using a minor amounts of a diamino terminated fluorinated alkyl ether oligomer and a diamino terminated siloxane oligomer. The various embodiments include processes for making the copolyimides containing fluorine and silicon surface modifying agents and anisotropic coatings and articles of manufacture from them. Thus the coatings and articles of manufacture made with the copolyimides of the various embodiments may be characterized as having an anisotropic fluorine and silicon composition and low surface energy.

Embodiments in accordance with the present invention encompass polyamic acid or polyimide polymers containing a reactive maleimide end group as well as photosensitive compositions made therefrom which are useful for forming films that can be patterned to create structures for microelectronic devices, microelectronic packaging, microelectromechanical systems, optoelectronic devices and displays. In some embodiments the compositions of this invention are shown to feature excellent hitherto unachievable mechanical properties. The negative images formed therefrom exhibit improved thermo-mechanical properties, among other property enhancements.

Embodiments in accordance with the present invention encompass polyamic acid or polyimide polymers containing a reactive unsaturated cyclic anhydride end group as well as photosensitive compositions made therefrom which are useful for forming films that can be patterned to create structures for microelectronic devices, microelectronic packaging, microelectromechanical systems, optoelectronic devices and displays. In some embodiments the compositions of this invention are shown to feature excellent hitherto unachievable mechanical properties. The negative images formed therefrom exhibit improved thermo-mechanical properties, among other property enhancements.

A dual-cure method for forming a solid polymeric structure is provided. An end-capped, imide-terminated prepolymer is combined with at least one photopolymerizable olefinic monomer, at least one photoinitiator, and a diamine, to form a curable resin composition, which, in a first step, is irradiated under conditions effective to polymerize the at least one olefinic monomer, thus forming a scaffold composed of the prepolymer and the polyolefin with the diamine trapped therein. The irradiated composition is then thermally treated at a temperature effective to cause a transimidization reaction to occur between the prepolymer and the diamine, thereby releasing the end caps of the prepolymer and providing the solid polymeric structure. A curable resin composition comprising an end-capped, imide-terminated prepolymer, at least one photopolymerizable olefinic monomer, at least one photoinitiator, and a diamine, is also provided, as are related methods of use.

[Problems to be solved] The present invention provides a novel diamine compound which allows for the synthesis of a polyimide compound having a high solubility in an organic solvent and a high melt moldability.

[Solution] The diamine compound according to the present invention is characterized by being represented by the following general formula (1):

##STR00001##

(wherein R.sub.1 to R.sub.8 are each independently selected from the group consisting of a hydrogen atom, a fluorine atom, a substituted or unsubstituted alkyl group, and a substituted or unsubstituted aromatic group; and at least one of R.sub.1 to R.sub.8 is a substituted or unsubstituted aromatic group).

[Problems to be Solved] The present invention provides a novel diamine compound which allows for the synthesis of a polyimide compound having a high solubility in an organic solvent and a high melt moldability.

[Solution] The diamine compound according to the present invention is characterized by being represented by the following general formula (1):

##STR00001##

(wherein R.sub.1 to R.sub.8 are each independently selected from the group consisting of a hydrogen atom, a fluorine atom, a substituted or unsubstituted alkyl group, and a substituted or unsubstituted aromatic group; and at least one of R.sub.1 to R.sub.8 is a substituted or unsubstituted aromatic group).

The invention relates to a process for producing aromatic polyimides, comprising the following steps: (a) preparation of one or more solid salt(s) by reacting one or more aromatic tetracarboxylic acid(s) and one or more diamine(s) according to a mole ratio ranging from 0.95 to 1.05; (b) drying of the solid salt(s), (c) addition, to the dry salt resulting from step (b), of one or more compound(s) (C) comprising one or more group(s) chosen from a carboxylic acid group, an anhydride group, an ester group and an acyl chloride group; (d) solid-state polymerization of said solid salt(s) in the presence of the compound(s) (C).