The present invention provides a polyimide-based copolymer and electronic component and field effect transistor comprising the same. The polyimide-based copolymer comprises a copolymer of dianhydride and heterocyclic diamine, wherein the heterocyclic diamine has two benzene rings, and there are two ether bonds, two thioether bonds, or one ether bond and one thioether bond between the two benzene rings. The novel polyimide-based copolymer of the invention has excellent thermal-mechanical stability, has potential application prospects, and can be used as a substrate for flexible electronics.

The present disclosure is directed to a base film having a chemically converted polyimide, a particulate polyimide matting agent and a low conductivity carbon black. The particulate polyimide matting agent is present in an amount from 1.6 to 9 weight percent of the base film.

Provided are a liquid crystal alignment agent, a liquid crystal alignment film and a liquid crystal display element. The liquid crystal alignment agent at least comprises one of a polyamic acid solution and a polyimide solution. The polyamic acid solution is obtained by means of a polymerization reaction of diamine compound component A and dianhydride compound component B in a solvent, and the polyimide solution is obtained from the polyamic acid solution via a dehydration imidization treatment. The diamine component A at least comprises one of the diamine compounds represented by “formula 1”. The obtained liquid crystal alignment agent has a better liquid crystal alignment capability, an excellent effect on image sticking, and the effect that decomposition products resulting from light alignment are easy to remove.

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Phenolic-terminated and phenolic pendent curable polyimides with very good dielectric properties have been prepared. These materials in combination with epoxy resins and other co-curable resins are ideal for being transformed into flexible films that are ready to be laminated for example between copper foils for applications such as copper-clad laminates for a variety of electronics applications.

A polymer and a resin composition thereof are provided. The polymer includes a first repeat unit represented by Formula (I) and a second repeat unit represented by Formula (II)

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wherein A.sup.1 is C.sub.24-48 alkylene, C.sub.24-48 alkenylene, C.sub.24-48 alkynylene, C.sub.24-48 alicyclic alkylene, C.sub.24-48 alicyclic alkenylene, or C.sub.24-48 alicyclic alkynylene. A.sup.2 and A.sup.4, independently having at least one reactive group, are independently C.sub.6-25 arylene, C.sub.4-8 cycloalkylene, C.sub.5-25 heteroarylene, divalent C.sub.7-25 alkylaryl, divalent C.sub.7-25 acylaryl, divalent C.sub.6-25 aryl ether, divalent C.sub.7-25 acyloxyaryl, or divalent C.sub.6-25 sulfonylaryl; and, A.sup.3 is substituted or unsubstituted C.sub.6-25 arylene, C.sub.4-8 cycloalkylene, C.sub.5-25 heteroarylene, divalent C.sub.7-25 alkylaryl, divalent C.sub.7-25 acylaryl, divalent C.sub.6-25 aryl ether, divalent C.sub.7-25 acyloxyaryl, or divalent C.sub.6-25 sulfonylaryl.

A dual-cure method for forming a solid polymeric structure is provided. An end-capped, imide-terminated prepolymer is combined with at least one photopolymerizable olefinic monomer, at least one photoinitiator, and a diamine, to form a curable resin composition, which, in a first step, is irradiated under conditions effective to polymerize the at least one olefinic monomer, thus forming a scaffold composed of the prepolymer and the polyolefin with the diamine trapped therein. The irradiated composition is then thermally treated at a temperature effective to cause a transimidization reaction to occur between the prepolymer and the diamine, thereby releasing the end caps of the prepolymer and providing the solid polymeric structure. A curable resin composition comprising an end-capped, imide-terminated prepolymer, at least one photopolymerizable olefinic monomer, at least one photoinitiator, and a diamine, is also provided, as are related methods of use.

A liquid crystal aligning agent composition for forming a liquid crystal alignment film having improved electrical characteristics and high reliability while exhibiting excellent alignment properties and durability, a method for preparing a liquid crystal alignment film using the same, and a liquid crystal alignment film and a liquid crystal display device using the liquid crystal alignment film.

Provided is an endless belt that can be used for fusing a toner image or enhancing the gloss of a toner image, the endless belt including a substrate later and a release layer on the substrate layer. The release layer can include a coating layer that includes an inorganic-organic nanocomposite material in which inorganic nanoparticles are dispersed in a siloxane polymer matrix.

The present invention aims to provide an adhesive composition that is easily separable by irradiation with light even after high-temperature processing at 300° C. or higher with an adherend fixed thereon, an adhesive tape including an adhesive layer formed of the adhesive composition, and a method for processing an electronic component. The present invention is an adhesive composition including: a reactive resin having an imide backbone and containing a double bond-containing functional group in a side chain or at an end; and a silicone compound or a fluorine compound.

A non-thermoplastic polyimide film contains non-thermoplastic polyimide. The non-thermoplastic polyimide has a 3,3′,4,4′-biphenyltetracarboxylic dianhydride residue, a 4,4′-oxydiphthalic anhydride residue, a p-phenylenediamine residue and a 1,3-bis(4-aminophenoxy)benzene residue. Where the content ratio of the 3,3′,4,4′-biphenyltetracarboxylic dianhydride residue is A.sub.1 mol %, the content ratio of the 4,4′-oxydiphthalic anhydride residue is A.sub.2 mol %, the content ratio of the p-phenylenediamine residue is B.sub.1 mol %, and the content ratio of the 1,3-bis(4-aminophenoxy)benzene residue is B.sub.2 mol %, the relationships of A.sub.1+A.sub.2≥80, B.sub.1+B.sub.2≥80 and (A.sub.1+B.sub.1)/(A.sub.2+B.sub.2)≤3.50 are satisfied.