The present invention is a substrate for a display, the substrate having a film B including a polysiloxane resin on at least one surface of a film A including a polyimide resin, wherein the film B contains inorganic oxide particles therein, and the present invention has an object to provide a substrate for a display: being able to be applied to a color filter, an organic EL element, or the like without the need to carry out any complex operations; allowing high-definition displays to be manufactured; and being provided with a low CTE, a low birefringence, and flexibility.

The present invention relates to a modified polyimide including a terminal group represented by Formula 1:

##STR00001## wherein D is a heat curable or photocurable functional group, R is a divalent or higher polyvalent organic group, and n is an integer of 1 or greater. The modified polyimide undergoes less reduction in transmittance and is protected from discoloration when cured. Due to these advantages, the modified polyimide can provide a highly transparent colorless polyimide film. Particularly, the modified polyimide is suitable for use in display substrates, interlayer insulating films of semiconductor devices, passivation films, buffer coat films, insulating films for multilayer printed circuit boards, insulating films of OLEDs, and protective films of thin film transistors of liquid crystal display devices. The present invention also relates to a curable composition including the modified polyimide.

A polyimide material, a preparing method thereof, and a use thereof are provided. The polyimide material employs a newly introduced 2,4-trifluoromethyl dianhydride with benzene rings and fluorine-containing p-phenylenediamine, and the phenylenediamine with the simple binding structure is used to design a molecular structure of a target polyimide material compound. A polyimide material is provided. By introducing a new molecular structure containing a dianhydride structure with fluorine and benzene rings, and combining a diamine structure, the target polyimide material with a low coefficient of thermal expansion (CTE) performance parameter is obtained.

A polyimide luminescent material, a preparation method, and a used thereof are disclosed; the polyimide luminescent material includes a polyimide resin and a rare earth complex distributed in the polyimide resin, wherein the polyimide resin is a condensation polymer of an aromatic diamine containing a bidentate chelate ligand and an aromatic dianhydride, and the rare earth complex and the bidentate chelate ligand are connected by a chemical bond. The luminescent material has enhanced fluorescence intensity, thermal stability, and mechanical properties. The preparation method is simple and easy, and is suitable for industrial production.

Provided are a polyamideimide resin, and a polyamideimide film and a window cover film including the same. More particularly, a polyamideimide resin for preparing a polyamideimide film which satisfies both optical properties and mechanical properties which are in a trade-off relationship with each other and has more improved mechanical properties than a conventional polyamideimide film, a polyamideimide film using the same, and a window cover film including the same are provided.

A thermoplastic composition includes an aromatic poly(ketone), a poly(etherimide), and a reactive additive, wherein each component is present in a particular amount as defined herein. The thermoplastic composition can be useful in an insulating layer disposed over a conductor wire to form an electrical wire. Articles including the thermoplastic composition can be particularly useful in applications including an electrical device component, a railway vehicle component, an auto-mobile component, a marine vehicle component, a construction component, construction component, a building component, or an aircraft component.

Phenolic-terminated and phenolic pendent curable polyimides with very good dielectric properties have been prepared. These materials in combination with epoxy resins and other co-curable resins are ideal for being transformed into flexible films that are ready to be laminated for example between copper foils for applications such as copper-clad laminates for a variety of electronics applications.

The present invention provides a polyamide-imide copolymer, which is obtained by copolymerizing an aromatic diamine monomer, a dianhydride monomer and an aromatic dicarbonyl monomer, wherein the aromatic diamine monomer comprises a diamine containing an amide group (—CONH.sub.2) represented by formula (1), and Q.sup.1, X.sup.1, X.sup.2, R.sup.1, R.sup.2, Y.sup.1, Y.sup.2 and m are as defined herein:

##STR00001##

A polymer and a resin composition thereof are provided. The polymer includes a first repeat unit represented by Formula (I) and a second repeat unit represented by Formula (II)

##STR00001##

wherein A.sup.1 is C.sub.24-48 alkylene, C.sub.24-48 alkenylene, C.sub.24-48 alkynylene, C.sub.24-48 alicyclic alkylene, C.sub.24-48 alicyclic alkenylene, or C.sub.24-48 alicyclic alkynylene. A.sup.2 and A.sup.4, independently having at least one reactive group, are independently C.sub.6-25 arylene, C.sub.4-8 cycloalkylene, C.sub.5-25 heteroarylene, divalent C.sub.7-25 alkylaryl, divalent C.sub.7-25 acylaryl, divalent C.sub.6-25 aryl ether, divalent C.sub.7-25 acyloxyaryl, or divalent C.sub.6-25 sulfonylaryl; and, A.sup.3 is substituted or unsubstituted C.sub.6-25 arylene, C.sub.4-8 cycloalkylene, C.sub.5-25 heteroarylene, divalent C.sub.7-25 alkylaryl, divalent C.sub.7-25 acylaryl, divalent C.sub.6-25 aryl ether, divalent C.sub.7-25 acyloxyaryl, or divalent C.sub.6-25 sulfonylaryl.

The present invention provides a laminate with good adhesion, which includes a transparent substrate, an adhesive layer formed by an adhesive composition, and a metal layer. The adhesive composition contains a resin, an adhesion promoter selected from a triazole compound represented by formula (1), a thiadiazole compound represented by formula (2), a benzotriazole compound represented by formula (3) or a phosphate oligomer; and an antioxidant, in which R.sup.1˜R.sup.5 are as defined herein.

##STR00001##