A method of forming a pattern on a substrate, the method including: forming a photoresist underlayer over a surface of the substrate, wherein the photoresist underlayer is formed from a composition comprising a polymer and a solvent, and the photoresist underlayer has a carbon content of greater than 47 at %; subjecting the photoresist underlayer to a a metal precursor, where the metal precursor infiltrates a free volume of the photoresist underlayer; and exposing the metal precursor-treated photoresist underlayer to an oxidizing agent to provide a metallized photoresist underlayer.

A method for purification of a biphenol dianhydride composition includes contacting the biphenol dianhydride composition with a halogenated solvent to form a solution, and isolating the purified biphenol dianhydride composition from the solution. A method of making a biphenol dianhydride composition including contacting a first solution including a biphenol tetraacid, and at least one of sodium ions, potassium ions, calcium ions, zinc ions, aluminum ions, iron ions, nickel ions, titanium ions, chromium ions, magnesium ions, manganese ions, copper ions, phosphorus ions, phosphate ions, sulfate ions, chloride ions, bromide ions, fluoride ions, nitrate ions, and nitrite ions, with a halogenated solvent to provide a second solution, heating the second solution to form the corresponding biphenol dianhydride, and isolating the purified biphenol dianhydride. The biphenol dianhydride is particularly useful for forming poly(etherimides), which can be used in a variety of articles.

In a method of forming a semicrystalline polyetherimide, a solvent mixture is combined with an amorphous polyetherimide in a weight ratio of 1:1 to 50:1, respectively, to form a first dispersion. The solvent mixture includes dichloromethane and a C.sub.1-C.sub.6 alkanol in a weight ratio of 0.5:1 to 15:1, respectively. The first dispersion is agitated to form a second dispersion containing a semicrystalline polyetherimide, and the semicrystalline polyetherimide is isolated from the second dispersion. The isolated semicrystalline polyetherimide exhibits a melting point in a range of 230 to 300° C. Also described is a composition that includes a polyetherimide, dichloromethane, and a C.sub.1-C.sub.6 alkanol in specific ratios.

Provided a polyimide compound having high heat resistance and transparency. The polyimide compound according to the present invention is characterized in that it is a reaction product of a diamine compound represented by the following general formula (1):

##STR00001## and an alicyclic tetracarboxylic acid dianhydride represented by the following general formula (2).

##STR00002##

A process for producing a three-dimensional object by selectively layer-by-layer solidification of a powdery material layer at the locations corresponding to the cross-section of the object in a respective layer by exposure to electromagnetic radiation. The powdery material comprises at least one polymer which is obtainable from its melt only in substantially amorphous or completely amorphous form, or a polyblend which is obtainable from its melt only in substantially amorphous or completely amorphous form. The powdery material has a specific melting enthalpy of at least 1 J/g.

A curable epoxy composition, comprising: an epoxy resin composition comprising one or more epoxy resins, each independently having at least two epoxy groups per molecule; an epoxy resin curing agent; optionally a curing catalyst; and a functionalized polyetherimide prepared from a substituted or unsubstituted C.sub.4-40 bisanhydride, a substituted or unsubstituted C.sub.1-40 organic diamine, and optionally an organic compound, wherein the functionalized polyetherimide includes a reactive end group of the formula (C.sub.1-40 hydrocarbylene)-NH.sub.2, (C.sub.1-40 hydrocarbylene)-OH, (C.sub.1-40 hydrocarbylene)-SH, (C.sub.4-40 hydrocarbylene)-G, wherein G is an anhydride group, a carboxylic acid, a carboxylic ester, or a combination thereof, wherein the functionalized polyetherimide has a total reactive end group concentration of 50-1,500 μeq/g and 0.05-1,000 ppm by weight of residual organic diamine, wherein the functionalized polyetherimide is obtained by precipitation from a solution using an organic anti-solvent, or by devolatilization, and the organic compound comprises at least two functional groups/molecule.

Provided are a coloring resin composition including a resin, a coloring material, and a solvent, in which the resin is a polyimide or polyimide precursor including a repeating unit represented by Formula (1-1) or Formula (1-2), and a content of the coloring material is 30 mass % or more with respect to a total solid content of the composition; a film; a color filter; a solid-state imaging element; and an image display device.

##STR00001##

Provided is a polyimide precursor composition including a polyimide precursor including a siloxane structure and a solvent having a negative partition coefficient (log P). The polyimide precursor composition may be used to alleviate thermal expansion-contraction behavior, thereby producing a polyimide film with minimal curling.

The present disclosure relates to a polyimide film for a flexible metal clad laminate and a flexible metal clad laminate including the same, and an aspect of the present disclosure is to provide a polyimide film for a flexible metal clad laminate, which is derived from a polyimide precursor composition including an acid dianhydride and a diamine, in which the acid dianhydride includes 70% by mol or more of pyromellitic dianhydride (PMDA), and the diamine includes m-tolidine and dimer diamine.

The present invention is a polymer having a polyamide structural unit, a polyamide-imide structural unit, or a polyimide structural unit, selected from a polyamide, a polyamide-imide, a polyimide, a polyimide precursor, a polybenzoxazole, and a polybenzoxazole precursor, including a reaction product of a diamine containing at least one of a diamine shown by the following general formula (1) and a diamine shown by the following general formula (2), together with at least one of a tetracarboxylic dianhydride shown by the following general formula (3) as well as a dicarboxylic acid and a dicarboxylic halide shown by the following general formula (4). This provides a polymer which is soluble in a safe organic solvent used widely, and is usable as a base resin of a positive photosensitive resin composition that is soluble in an aqueous alkaline solution and capable of forming a fine pattern to give higher resolution. ##STR00001##