Provided are a solid electrolyte composition containing an inorganic solid electrolyte having a conductivity of an ion of a metal belonging to Group I or II of the periodic table and a binder having a specific hydrocarbon polymer segment and a specific segment, a solid electrolyte-containing sheet in which the same solid electrolyte composition is used and a manufacturing method therefor, an all-solid state secondary battery and a manufacturing method therefor, a polymer having a specific hydrocarbon polymer segment and a specific segment, and a non-aqueous solvent dispersion thereof.

The present disclosure discloses an organosilicon-modified polyimide resin composition, comprising an organosilicon-modified polyimide and a thermal curing agent, wherein the organosilicon-modified polyimide comprises a repeating unit represented by the following general formula (I):

##STR00001##

wherein Ar.sup.1 is a tetra-valent organic group having a benzene ring or an alicyclic hydrocarbon structure, Ar.sup.2 is a di-valent organic group, R is each independently methyl or phenyl, and the thermal curing agent is selected from the group consisting of epoxy resin, isocyanate and bisoxazoline compounds. The resultant organosilicon-modified polyimide resin composition of the present disclosure has superior transmittance, heat resistance and mechanical strength, and is suitable for producing a flexible LED filament.

The present invention is a substrate for a display, the substrate having a film B including a polysiloxane resin on at least one surface of a film A including a polyimide resin, wherein the film B contains inorganic oxide particles therein, and the present invention has an object to provide a substrate for a display: being able to be applied to a color filter, an organic EL element, or the like without the need to carry out any complex operations; allowing high-definition displays to be manufactured; and being provided with a low CTE, a low birefringence, and flexibility.

This invention discloses a membrane composition, a method of making, and applications for a new type of high selectivity, high plasticization-resistant and solvent-resistant, both chemically and UV cross-linked polyimide membranes. Gas permeation tests on these membranes demonstrated that they not only showed high selectivities, but also showed extremely high CO.sub.2 plasticization resistance under CO.sub.2 pressure up to 4923 kPa (700 psig). This new type of high selectivity, high plasticization-resistant and solvent-resistant, both chemically and UV cross-linked polyimide membranes can be used for a wide range of gas separations such as separations of H.sub.2/CH.sub.4, He/CH.sub.4, CO.sub.2/CH.sub.4, CO.sub.2/N.sub.2, olefin/paraffin separations (e.g. propylene/propane separation), O.sub.2/N.sub.2, iso/normal paraffins, polar molecules such as H.sub.2O, H.sub.2S, and NH.sub.3 mixtures with CH.sub.4, N.sub.2, H.sub.2, and other light gases separations. The membranes can also be used for liquid separations such as in the removal of organic compounds from water.

A photosensitive resin composition is provided comprising 100 pbw of a polyimide silicone containing a primary alcoholic hydroxyl group, a crosslinker, a photoacid generator, a polyfunctional epoxy compound, 1-70 pbw of a filler having an average particle size of 0.01-20.0 m, and 0.01-30 pbw of a colorant. The resin composition is colored and photosensitive and cures into a product having an improved modulus.

A polyimide precursor solution is provided. The polyimide precursor solution includes 100 parts by weight of a fully aromatic polyamic acid, from 5 to 20 parts by weight of silica particles, from 5 to 80 parts by weight of an alkoxysilane, and from 40 to 80 parts by weight of a solvent.

A photosensitive polyimide resin composition is provided. The resin composition comprises an infrared absorber, an epoxy, a photosensitive polyimide and a photo initiator. The infrared absorber includes pigment and has an amount of weight accounting for 5-40% of total solid weight of the photosensitive polyimide resin composition. The epoxy has an amount of weight accounting for 5-40% of total solid weight of the photosensitive polyimide resin composition. The photosensitive polyimide has the structure of formula (1): ##STR00001## wherein m, n are independently 1 to 600; X is a tetravalent organic group, and the main chain of X includes alicyclic structure; Y is a divalent organic group, and the main chain of Y includes siloxane structure; Z is a divalent organic group, and the side chain of Z includes phenolic hydroxyl group or carboxyl group. The photosensitive polyimide has an amount of weight accounting for 30-90% of total solid weight of the photosensitive polyimide resin composition. The photo initiator has an amount of weight accounting for 0.1-15% of total solid weight of the transparent photosensitive resin.

A polyimide resin of the present invention contains a repeating unit represented by the formula (1). X.sub.1 is a tetravalent organic group having at least one ring structure, and each two of four carbonyl groups bonded to X.sub.1 form a pair and, together with X.sub.1 and a nitrogen atom, form a five-membered ring. R.sub.2 is a hydrogen, an alkyl group having 1-9 carbon atoms, or an alkoxy group having 1-10 carbon atoms. Y is a divalent organic group having a phenolic hydroxyl group. The polyimide resin of the present invention can be practically used as a thermosetting resin composition or a positive type photosensitive resin composition.

##STR00001##

Provided is a laminate that can be implemented with a wide processing margin and without adhesive residue or damage to a semiconductor element in the transfer of the semiconductor element using laser light of various wavelengths. The laminate is obtained by laminating a substrate 1 having laser permeability, a resin film 1 and a resin film 2 in this order, wherein the light absorbance of the resin film 1 calculated for a film thickness of 1.0 ?m at any wavelength of 200 nm to 1100 nm is 0.4-5.0, and the adhesive strength of the surface of the resin film 2 on the side opposite that of the resin film 1 side is 0.02-0.3 N/cm.

The present invention relates to a branched copolymer having a polyimide polymer block bonded to each terminal of a branched polyamide functional group, and a photosensitive resin composition including the same, a photosensitive resin film, and an optical device.