The present invention provides a laminate film for temporary bonding which is excellent in heat resistance, capable of providing a flat film even at the periphery of a substrate, and capable of making a semiconductor circuit formation substrate and a support substrate or a support film layer adhere to each other with one type of adhesive, and which can be peeled off at room temperature under mild conditions. The present invention provides a laminate film for temporary bonding, including at least three layers of (A) a protective film layer, (B) an adhesive layer, and (C) a support film layer, wherein the adhesive layer (B) contains at least a siloxane polymer represented by a specific general formula or a compound represented by a specific general formula.

A polyamic acid according to one or more embodiments of the present invention contains a structural unit represented by general formula (1) and a structural unit represented by general formula (2). In general formula (1), the plurality of R.sup.1s are each independently a hydrogen atom, a monovalent aliphatic group or an aromatic group. In general formula (2), the plurality of R.sup.2s are each independently an alkyl group having 1-3 carbon atoms or an aryl group having 6-10 carbon atoms. In general formulas (1) and (2), X is a tetravalent organic group. In general formula (2), the plurality of Ys are each independently an alkylene group having 1-3 carbon atoms or an arylene group having 6-10 carbon atoms, and m is an integer of 51-199. ##STR00001##

To provide an alkaline developable negative-type photosensitive resin composition from which a cured film that has a high-resolution and low-taper pattern shape and that are excellent in heat resistance and light blocking property can be obtained. A negative-type photosensitive resin composition is characterized by containing an (A1) first resin, a (A2) second resin, a (C) photopolymerization initiator, and a (D) coloring agent, wherein the (A1) first resin is an (A1-1) polyimide and/or an (A1-2) polybenzo-oxazole, and wherein the (A2) second resin is one or more species selected from a (A2-1) polyimide precursor, a (A2-2) polybenzo-oxazole precursor, a (A2-3) polysiloxane, a (A2-4) cardo based resin, and an (A2-5) acrylic resin, and wherein a content ratio of the (A1) first resin in a total of 100 mass % of the (A1) first resin and the (A2) second resin is within the range of 25 to 90 mass %.

A photosensitive and via-forming circuit board comprising a laminate unit, a conductor unit, and a cover layer unit is provided. The laminate unit includes an insulating layer, a first conductive wiring layer and a second conductive wiring layer formed at two opposite sides of the insulating layer, respectively, and at least one through-hole surface defining a through hole extending from the upper surface of the first conductive wiring layer through the insulating layer to the lower surface of the second conductive wiring layer. The conductor unit is formed on the at least one through-hole surface. The cover layer unit is formed from a photosensitive composition comprising an epoxy group-containing compound and a photosensitive polyimide capable of reacting with the epoxy group of the epoxy group-containing compound, and includes a first cover layer formed on the first conductive wiring layer and extending into and filling the through hole.

A thermoplastic composition includes a polyetherimide, a thermoplastic polyester elastomer comprising a hard segment comprising a polyester block, and a soft segment comprising a polyether block or a polyester block, and optionally, a polyester, one or more flame retardants, and one or more additives. Articles including the composition can include an extruded part, an injection molded part, or a hot-compressed part. Also described herein is an electrical wire including a conductor wire and a covering disposed over the conductor wire, wherein the covering includes the thermoplastic composition. Articles including the electrical wire are also discussed.

A photosensitive resin composition, a black pixel defining layer, and a display device, the composition including a binder polymer including a structural unit represented by Chemical Formula 1; a black colorant; a photopolymerizable monomer; a photopolymerization initiator; and a solvent,

##STR00001##

A system comprises a build area, a precursor feed system to feed polyimide precursor to the build area, and a laser system comprising a laser device to emit a focused energy beam onto the build area, and a laser actuator to aim the focused energy onto selected target locations of the build area in order to selectively initiate polymerization of at least a portion of the polyimide precursor into a structure including polyimide. A method comprises feeding a polyimide precursor to a build area and selectively directing a focused energy beam to the build area to selectively initiate polymerization of at least a portion of the polyimide precursor into a structure including polyimide.

Provided are a polyimide film that, when applied as a material for a spacecraft, exhibits excellent resistance to atomic oxygen derived from an oxygen molecule which is an atmospheric residual component and generates a small amount of outgas compound upon heating; and a polyimide used in the polyimide film. A polyimide for a spacecraft, the polyimide containing a diamine-derived structural unit and an aromatic acid dianhydride-derived structural unit, wherein the polyimide contains, as the diamine-derived structural unit, at least a structural unit derived from a silicon-containing diamine represented by the following formula (1) (provided that the silicon-containing diamine has a number average molecular weight of 500 or less), and a proportion of the structural unit derived from the silicon-containing diamine is 5 to 100 mol % relative to the entire diamine-derived structural unit. (In the formula, RI and R2 are each independently a divalent aliphatic hydrocarbon group having 3 to 20 carbons, R.sup.3, R.sup.4, R.sup.5, and R.sup.6 are each independently a monovalent aliphatic hydrocarbon group having 1 to 3 carbons, and m is 1 or 2.)

##STR00001##

A polyimide resin includes an acid anhydride residue; and a diamine residue, the polyimide resin including a residue of a polysiloxane diamine represented by Formula (1) in an amount of not less than 60% by mole in the total amount of the diamine residue: ##STR00001##
wherein, n is a natural number and an average value thereof calculated from the average molecular weight of the polysiloxane diamine is 45 to 200; R.sup.1 and R.sup.2, the same or different, each represent an alkylene group having 1 to 30 carbon atoms or a phenylene group; and R.sup.3 to R.sup.6, the same of different, each represent an alkyl group having 1 to 30 carbon atoms, a phenyl group or a phenoxy group.

The resin composition of the present invention comprises an alkenyl-substituted nadimide (A), a maleimide compound (B), and an amino-modified silicone (C).