In an embodiment, a method of making fibers comprises: flowing a dispersion medium through a reaction tube, wherein the dispersion medium comprises an anti-solvent; adjusting a temperature of a polymer solution to form a stable polymer solution, wherein the polymer solution comprises a polymer and a solvent; introducing the stable polymer solution into the dispersion medium to form a polymer dispersion comprising the dispersion medium and a plurality of polymer components of the polymer solution; and shearing the dispersed-phase components by flowing the dispersion system through the reaction tube, wherein a plurality of fibers having an average diameter of less than or equal to 10 μm are formed.

The present invention relates to a laminated film roll body, around which a laminated film is wound, the laminated film including: a first polyimide film; and a second polyimide film laminated on the first polyimide film and made of a fluorine-based, siloxane-based, or amine-based polyamic acid, wherein the second polyimide film has a glass transition temperature of 350° C. or higher when measured by a temperature elevation rate of 20° C./min. The laminated film roll body can be used in a continuous manufacturing process of a flexible device to improve process yield and efficiency.

As described herein, a polyimide chemical composition may be used for coating glass articles. According to embodiments, a coated glass article may include a glass container which may include a first surface and a second surface opposite the first surface, and a low-friction coating bonded to at least a portion of the first surface of the glass container. The low-friction coating may include a polyimide chemical composition. The polyimide chemical composition may be halogenated and the polyimide chemical composition may include a siloxane moiety.

A polyimide resin includes structural unit A derived from tetracarboxylic dianhydride and structural unit B derived from diamine, wherein unit A includes at least one unit selected from the group consisting of unit (A-1) derived from a compound represented by Formula (a-1) and unit (A-2) derived from a compound represented by Formula (a-2), and unit B includes unit (B-1) derived from a compound represented by Formula (b-1) and includes unit (B-2) derived from a compound represented by Formula (b-2).

##STR00001##

wherein X represents a single bond or an oxygen atom, and Ar represents a substituted or unsubstituted arylene group.

##STR00002##

wherein Z.sup.1/Z.sup.2 represent a divalent aliphatic or aromatic group, R.sup.1/R.sup.2 represent a monovalent aromatic or aliphatic group, R.sup.3/R.sup.4 represent a monovalent aliphatic group, R.sup.5/R.sup.6 represent a monovalent aliphatic or aromatic group, m&n represent an integer of 1 or greater, and a sum of m+n represents an integer from 2-1000.

A thermoplastic composition includes an aromatic poly(ketone), a poly(etherimide), and a reactive additive, wherein each component is present in a particular amount as defined herein. The thermoplastic composition can be useful in an insulating layer disposed over a conductor wire to form an electrical wire. Articles including the thermoplastic composition can be particularly useful in applications including an electrical device component, a railway vehicle component, an auto-mobile component, a marine vehicle component, a construction component, construction component, a building component, or an aircraft component.

The present invention provides a resin composition having a high sensitivity and serving to produce a cured film with a low water absorption rate. The resin composition includes: (a) an alkali-soluble resin and (b1) an amido-phenol compound containing a phenolic hydroxyl group in which a monovalent group as represented by the undermentioned general formula (1) is located at the ortho position and/or (b2) an aromatic amido acid compound containing a carboxy group in which a monovalent group as represented by the undermentioned general formula (2) is located at the ortho position: ##STR00001##
wherein in general formula (1), X is a monovalent organic group having an alkyl group that contains 2 to 20 carbon atoms and bonds directly to the carbonyl carbon in general formula (1) or a monovalent organic group that has —(YO).sub.n—; and in general formula (2), U is a monovalent organic group that has an alkyl group containing 2 to 20 carbon atoms and bonding directly to the amide nitrogen in general formula (2) or a monovalent organic group that has —(YO).sub.n—; wherein Y is an alkylene group containing 1 to 10 carbon atoms and n is an integer of 1 to 20.

A polyimide that is a reaction product of a diamine represented by Chemical Formula 1, a diamine represented by Chemical Formula 2, and a tetracarboxylic dianhydride represented by Chemical Formula 3: ##STR00001## wherein, in Chemical Formulae 1 to 3, L.sup.1, L.sup.2, R.sup.a to R.sup.f, m, R.sup.2, R.sup.10, R.sup.12, R.sup.13, n7, and n8 are the same as defined in the specification.

This application relates to the field of lighting, and discloses an LED filament including: at least one LED section, each LED section including at least two LED chips, adjacent LED chips being electrically connected to each other; electrodes, electrically connected to the LED section; and a light conversion layer, wrapping the LED section and parts of the electrodes, and including a top layer and a carrying layer, the carrying layer including a base layer and a transparent layer, the base layer including an upper surface and a lower surface opposite to each other, the upper surface of the base layer being in contact with a part of the top layer, and a part of the lower surface of the base layer being in contact with the transparent layer. This application has the characteristics of uniform light emission and good heat dissipation effect.

A polymer, a composition, and a polysiloxane-polyimide material thereof are provided. The polymer includes a first repeat unit and a second repeat unit. The first repeat unit has a structure represented by Formula (I) and the second repeat unit has a structure represented by Formula (II)

##STR00001##

wherein A.sup.1 and A.sup.3 are independently tetravalent moiety; A.sup.2 is a divalent moiety; n≥1; m≥1; R.sup.1 is independently hydrogen, C.sub.1-8 alkyl, C.sub.1-8 fluoroalkyl, C.sub.1-8 alkoxy, or C.sub.6-12 aryl; and R.sup.2 is independently hydrogen, C.sub.1-8 alkyl, C.sub.1-8 fluoroalkyl, C.sub.1-8 alkoxy, C.sub.6-12 aryl, or a reactive functional group.

There are provided a method of manufacturing a cured film, including a first exposure step of exposing a part of a photocurable film formed from a photocurable resin composition, a development step of developing the photocurable film after the exposure with a developing solution to obtain a pattern, and a second exposure step of exposing the pattern with light including light having a wavelength different from a wavelength of light used in the first exposure step, where the photocurable resin composition has a specific constitution, a photocurable resin composition that is used in the method of manufacturing the cured film, a method of manufacturing a laminate including the method of manufacturing a cured film, and a method of manufacturing an electronic device, which includes the method of manufacturing the cured film.