A resin having a small linear thermal expansion coefficient and a low absorbance is provided. The resin is characterized by including at least one structure selected from structures represented by the following general formulae (1) and (2): ##STR00001##

An LED light bulb is provided. The LED light bulb includes a lamp housing, a bulb base, a stem, first and second conductive supports, a driving circuit, and a flexible LED filament. The flexible filament includes two conductive electrodes, a first LED section, a second LED section, and a conductive section. The first LED section is bent in a first space curved shape. The second LED section is bent in a second space curved shape. The conductive section includes a center point of the flexible LED filament. The flexible LED filament is bent in a third space curved shape comprising the first space curved shape and the second space curved shape.

A process for producing a three-dimensional object by selectively layer-by-layer solidification of a powdery material layer at the locations corresponding to the cross-section of the object in a respective layer by exposure to electromagnetic radiation. The powdery material comprises at least one polymer which is obtainable from its melt only in substantially amorphous or completely amorphous form, or a polyblend which is obtainable from its melt only in substantially amorphous or completely amorphous form. The powdery material has a specific melting enthalpy of at least 1 J/g.

Provided is a polyimide precursor composition including a polyimide precursor including a siloxane structure and a solvent having a negative partition coefficient (log P). The polyimide precursor composition may be used to alleviate thermal expansion-contraction behavior, thereby producing a polyimide film with minimal curling.

Coatings and materials that are atomic oxygen resistant and have an atomically smooth surface that can reduce drag are disclosed. The coatings and materials can be used on at least a portion of a spacecraft intended to operate in harsh environments, such as stable Earth orbits at about 100 km to about 350 km.

A resin composition contains at least (a) a polyimide resin having a specific structure and (b) a crosslinker including a fluorene group. The resin composition is capable of bonding an electronic circuit formation substrate or a semiconductor circuit formation substrate and a support substrate together. The resin composition has excellent heat resistance during bonding of an electronic circuit formation substrate or semiconductor circuit formation substrate having a thickness of 1 μm or more and 100 μm or less. The resin composition has steady adhesive force through the process of manufacturing an electronic component, a semiconductor device or the like, and can be peeled off under mild conditions at room temperature after the manufacturing process. An adhesive, a resin layer, a laminated film, and a processed wafer containing the resin composition, as well as a method for manufacturing an electronic component or a semiconductor device using these are also disclosed.

A resin and a photosensitive resin composition whereby a cured film exhibiting high extensibility, reduced stress, and high adhesion to metals can be obtained are provided. A resin (A) including a polyamide structure and at least any structure of an imide precursor structure and an imide structure, wherein at least any of the structures of the resin (A) include a diamine residue having an aliphatic group.

An LED filament and an LED light bulb applying the same are provided. The LED filament includes a at least one LED section, wherein the at least one LED section comprises at least two LED chips electrically connected to each other through a first wire, and at least two conductive electrodes, wherein each of the at least two conductive electrodes is electrically connected to corresponding one of the at least one LED section; and a light conversion layer, covering the at least one LED section and a portion of each of the at least two conductive electrodes, a portion of the first wire is exposed outside the light conversion layer.

The present invention provides a novel polyimide resin adhesion enhancer having a fluorene framework, wherein a polyimide film produced using same exhibits conventional properties such as heat resistance and mechanical properties, and maintains adhesion with a carrier substrate while not being affected with respect to retardation even during a high-temperature process.

A polyimide precursor composition according to an exemplary embodiment includes an imide precursor having an organic group derived from a cyclic ether group-containing compound. A polyimide film formed using the polyimide precursor composition has improved heat resistance and mechanical properties, and has high absorbance in a wavelength range in an ultraviolet region.