A polyamic acid composition is polymerized by dianhydride monomers and diamine monomers. A range of molar ratio of the dianhydride monomers to the diamine monomers is from 0.9 to 1.1. The diamine monomers have a combination of specific functional groups containing at least one nitrogen heterocycle structure, at least one liquid crystal structure, and at least one soft structure, wherein the diamine monomer containing nitrogen heterocycle structure has a molar weight percentage of 3% to 8% of a total molar weight of the diamine monomers, and the diamine monomers containing at least one liquid crystal structure and at least one soft structure have a molar weight percentage of 92% to 97% of the total molar weight of the diamine monomers. The disclosure further relates to a polyimide film, a copper clad laminate, and a printed circuit board.

A curable resin composition containing: a curable resin; and a curing agent containing an imide oligomer, the imide oligomer containing an aliphatic diamine residue- and/or aliphatic triamine residue-containing imide oligomer that has, in a main chain, an imide skeleton and a substituted or unsubstituted aliphatic diamine residue having a carbon number of 4 or greater and/or a substituted or unsubstituted aliphatic triamine residue having a carbon number of 4 or greater, has a crosslinkable functional group at an end, and has a molecular weight of 5,000 or less. The curable resin composition is excellent in flexibility and processability before curing and excellent in adhesiveness, heat resistance, and dielectric characteristics after curing. An adhesive, an adhesive film, a circuit board, an interlayer insulating material, and a printed wiring board each produced using the curable resin composition are also provided.

A polyamic acid according to one or more embodiments of the present invention contains a structural unit represented by general formula (1) and a structural unit represented by general formula (2). In general formula (1), the plurality of R.sup.1s are each independently a hydrogen atom, a monovalent aliphatic group or an aromatic group. In general formula (2), the plurality of R.sup.2s are each independently an alkyl group having 1-3 carbon atoms or an aryl group having 6-10 carbon atoms. In general formulas (1) and (2), X is a tetravalent organic group. In general formula (2), the plurality of Ys are each independently an alkylene group having 1-3 carbon atoms or an arylene group having 6-10 carbon atoms, and m is an integer of 51-199.

##STR00001##

A monomer represented by Chemical Formula 1-1 ##STR00001##
wherein in Chemical Formula 1-1, Z, L.sup.1, L.sup.2, R.sup.1 to R.sup.6, n, m, p, and a to f are the same as defined in the detailed description.

The purpose of the present invention is to provide a resin composition which enables the achievement of a cured film that has a low dielectric loss tangent and is capable of withstanding a heat treatment and a chemical treatment, said treatments being associated with the formation of a coil pattern. In order to achieve the above-described purpose, the configuration of the present invention is as follows. A resin composition which contains (P) a resin that has an alicyclic structure and an aromatic ring structure, and wherein the resin (P) that has an alicyclic structure and an aromatic ring structure has a group having two or more alicyclic rings and a group wherein two or more benzene rings are bonded by means of a single bond.

An imide composition obtainable by providing (a) reacting a dianhydride with a diamine in the presence of a solvent at a temperature in the range of from 20-80 C. The molar ratio of the dianhydride to the diamine is from 0.25-4, forming an imide precursor; and (b) subjecting the imide precursor as formed in step (a) in the presence of a solvent to a heat treatment carried out at a temperature from 80-150 C. to convert the imide precursor into an imide, thereby forming the imide composition. Also, a preservative composition including the present imide composition; a metal article having a coating that provides the present preservative composition; a process for preparing the imide composition; the use of the present imide composition to prevent and/or reduce false brinelling in a roll bearing system; and the use of the present preservative composition to prevent and/or reduce false brinelling in a roll bearing system.

Provided are an organic thin film transistor element comprising an organic semiconductor layer containing a specific polymer which has a repeating unit including a structure represented by a specific formula, an organic semiconductor film suitable as the organic semiconductor layer and a method of manufacturing the same, and a polymer and a composition suitable as a constituent material of the organic semiconductor film.

A resin composition for display substrates includes the following: the resin (a): a resin containing, as a main component, a repeating unit represented by the chemical formula (1), wherein the resin contains the total of 95 mass % or more of a tetracarboxylic acid residue A, having 2 or more carbon atoms and an SP value of 15 or more and 17 or less and a diamine residue having an SP value of 11 or more and 13 or less with respect to the total of 100 mass % of A and B contained in the resin; the solvent (b): a solvent having an SP value of 7.5 or more and less than 9.5; and the solvent (c): a solvent having an SP value of 9.5 or more and 14.0 or less;

##STR00001##

wherein R.sup.1 and R.sup.2 independently represent a hydrogen atom, hydrocarbon group having 1 to 10 carbon atoms, alkylsilyl group having 1 to 10 carbon atoms, alkali metal ion, ammonium ion, imidazolium ion, or pyridinium ion.

Various embodiments provide random copolyimides that may possess the mechanical, thermal, chemical and optical properties associated with polyimides yet achieve a low energy surface. In various embodiments, the copolyimides may be prepared using a minor amounts of a diamino terminated fluorinated alkyl ether oligomer and a diamino terminated siloxane oligomer. The various embodiments include processes for making the copolyimides containing fluorine and silicon surface modifying agents and anisotropic coatings and articles of manufacture from them. Thus the coatings and articles of manufacture made with the copolyimides of the various embodiments may be characterized as having an anisotropic fluorine and silicon composition and low surface energy.

Provided is a detachable layer-forming composition which, for example, contains an organic solvent and a polyamic acid, both ends of which are derived from a diamine and sealed with an aromatic dicarboxylic acid, such as the polyamic acid represented by this formula.

##STR00001##

(In the formula, X represents a tetravalent aromatic group, Y represents a divalent aromatic group, R.sup.1-R.sup.4 each independently represent a hydrogen atom, a C1-10 alkyl group, or a C6-20 aryl group, and m is a natural number.)