An object of the present invention is to provide a cyanate ester-based curable resin composition having a high curing rate, very high heat resistance and very high long-term heat resistance, and a molded article and a prepreg each using the same. The present invention relates to a thermosetting resin composition including (A) a cyanate ester compound and/or (B) an unsaturated imide compound, and (C) a cyclic carbodiimide compound. In addition, the present invention relates to a molded article including a cured product of the thermosetting resin composition, and a prepreg including a reinforcing fiber substrate impregnated with the thermosetting resin composition.

Aliphatic polyimides are synthesized by a reaction of 2 moles of an unsaturated monoanhydride or an unsaturated diacid with both one mole of a diamine and one mole of a monoamine. Imidization of intermediates so formed from those reactions resolve to 6 possible bicyclic imidic structures bridged by monoamidic or saturated hydrocarbon spans, more likely the latter. Bio-derived monomers are particularly useful in the synthesis of the aliphatic polyimides.

The present invention relates to a resin composition containing a phosphate ester-based flame retardant (A) having an aromatic hydrocarbon group containing two or more aromatic ring structures and a polyphenylene ether derivative (B) having an ethylenically unsaturated bond-containing group at both ends.

Provided is a maleimide resin with superior solution stability. Also provided is a cured product with a superior dielectric characteristic that is obtained by curing a curable resin composition in which said maleimide resin is used. The maleimide resin expressed in formula (1), wherein the N,N-(phenylene-di-(2,2,-propylidene)-di-p-phenylene) bismaleimide content is 90 area % or less. (In formula (1), n is the number of repetitions, and 1<n<5.)

Provided is a curable resin composition for a bonding film that has a high adhesion force to a copper foil with a small surface roughness, maintains a high adhesion force even after HAST, and can also be turned into a cured product superior in dielectric properties. The curable resin composition for a bonding film that is to be bonded to a copper foil, contains: (A) a maleimide compound having at least one dimer acid frame-derived hydrocarbon group per molecule, that is represented by the following formula (1), (2) or (3)

##STR00001##

wherein A independently represents a tetravalent organic group having a cyclic structure, B independently represents a divalent hydrocarbon group having 6 to 60 carbon atoms and is a hydrocarbon group other than a dimer acid frame-derived hydrocarbon group, D represents a dimer acid frame-derived hydrocarbon group, m, l and n are each 1 to 100; and (B) a catalyst.

Provided is a curable composition having excellent workability and being capable of forming a cured product having excellent heat resistance. The curable composition of the present invention includes a compound represented by Formula (1) below and a solvent: In Formula (1) below, R.sup.1 and R.sup.2 each represent a curable functional group, and D.sup.1 and D.sup.2 each represent a single bond or a linking group. L represents a divalent group having a repeating unit containing a structure represented by Formula (I) below and a structure represented by Formula (II) below. In Formula (I) and Formula (II) below, Ar.sup.1 to Ar.sup.3 each represent a group in which two hydrogen atoms are removed from an aromatic ring structure or a group in which two hydrogen atoms are removed from a structure in which two or more aromatic rings are bonded through a single bond or a linking group. X represents CO, S, or SO.sub.2, and Y represents S, SO.sub.2, O, CO, COO, or CONH. n represents an integer of 0 or greater.

The present invention relates to a resin composition comprising a maleimide compound having a saturated or unsaturated divalent hydrocarbon group and a divalent group having at least two imido bonds; and a catalyst comprising at least one selected from the group consisting of an imidazole compound, a phosphorus compound, an azo compound and an organic peroxide.

The invention generally relates to shape memory films that are tri-functionally crosslinked and that comprise multiple, non-terminal, phenylethynyl moieties. In addition, the present invention relates methods of fabricating such films. Due to the improved properties of such SMPS, the SMP designer can program in to the SMP mechanical property enhancements that make the SMP suitable, among other things, for advanced sensors, high temperature actuators, responder matrix materials and heat responsive packaging.

The disclosure provides a thermosetting resin composition which contains at least: (a) a benzoxazine resin and (b) bismaleimide. The disclosure provides a flame-retardant resin composition which contains at least: (a) a benzoxazine resin, (b) bismaleimide, and (c) a flame retardant. The thermosetting resin composition and the flame-retardant resin composition may be used as a constituent element of a semiconductor liquid packaging material, or an interlayer insulating film.

The invention generally relates to shape memory films that are tri-functionally crosslinked and that comprise multiple, non-terminal, phenylethynyl moieties. In addition, the present invention relates methods of fabricating such films. Due to the improved properties of such SMPs, the SMP designer can program in to the SMP thermomechanical property enhancements that make the SMP suitable, among other things, for advanced sensors, high temperature actuators, responder matrix materials and heat responsive packaging.