The present disclosure provides a modified allyl compound, and a modified bismaleimide prepolymer. The modified allyl compound is represented by formula (1), has a cyclopentadiene structure represented by formula (2), and contains a benzene ring or a benzene ring substituted with a linear alkane of lower polarity.

The present application discloses a nanocomposite flame retardant. The nanocomposite flame retardant includes 9.7-9.8 wt % of MXene nanosheets, 72.7-76.5 wt % of bimetallic hydroxide and 13.8-17.5 wt % of cuprous oxide particles. The present disclosure further discloses flame-retardant bismaleimide resin added with the nanocomposite flame retardant and a preparation method of the flame-retardant bismaleimide resin. According to the present disclosure, the flame retardant is prepared from magnesium and aluminum elements, so the production cost of the flame retardant is reduced; and meanwhile, the particle size of the cuprous oxide particles is reduced, the specific surface area of cuprous oxide is increased, the catalytic efficiency of the cuprous oxide per unit mass can be improved, and then the flame-retardant and toxicity-reducing effects of products are improved.

An object is to provide a novel bismaleimide compound. The solution is a bismaleimide compound represented by formula (1):

##STR00001## wherein A.sub.1 represents a direct bond, a divalent linking group represented by formula (1-1), (1-2), or (1-3):

##STR00002## wherein ring a represents a benzene ring or a cyclohexane ring; X represents a direct bond or a divalent linking group; and Z represents a monovalent substituent; or a divalent linking group other than this; at least one of a plurality of A.sub.1s is formula (1-1), (1-2), or (1-3); A.sub.2 represents a divalent linking group that is a residue of a saturated aliphatic dicarboxylic acid compound, a divalent linking group that is a residue of an aromatic dicarboxylic acid compound, or a divalent linking group other than this; and when A.sub.2 is present singly, A.sub.2 is a divalent linking group that is a residue of a saturated aliphatic dicarboxylic acid compound, and when a plurality of A.sub.2s is present, at least one of A.sub.2s is a divalent linking group that is a residue of a saturated aliphatic dicarboxylic acid compound.

Resin composition including an epoxy resin, an epoxy resin curing agent, and a polyimide resin including a specified structural unit provide a high yield after patterning.

The present invention provides a film forming material for lithography comprising a compound having: a group of formula (0A):

##STR00001## and a group of formula (0B):

##STR00002##

wherein each R is independently selected from the group consisting of a hydrogen atom and an alkyl group having 1 to 4 carbon atoms, provided that at least one R is an alkyl group having 1 to 4 carbon atoms.

The present invention provides a thermosetting resin composition characterized by comprising a bismaleimide compound and a triazine compound having a diaminotriazine structure.

A film forming material for lithography comprising a maleimide resin represented by the following formula (1A)

##STR00001##

A resin composition according to the present invention contains: (i) a reactant of a cyanate compound (A) and polybutadiene (B) and/or (ii) a reactant of a polymerized product of the cyanate compound (A) and the polybutadiene (B); and a maleimide compound (C).

The present invention relates to self-healing polymers, more particular autonomously self-healing polymers and uses thereof in various domains, such as 3D printing, flexible electronics and soft robotics. Furthermore, the present invention relates to structures comprising said polymers.

A resin composition includes 80 parts by weight to 160 parts by weight of a vinyl-containing resin, 0.1 part by weight to 1.0 part by weight of a first compound and 0.1 part by weight to 2.0 parts by weight of a second compound; wherein the vinyl-containing resin includes a vinyl-containing polyphenylene ether resin, a maleimide resin, a bis(vinylphenyl)ethane, a triallyl isocyanurate, a vinyl-containing polyolefin resin or a combination thereof, the first compound includes a structure of Formula (1) to Formula (3) or a combination thereof, and the second compound includes a structure of Formula (4) to Formula (6) or a combination thereof. Moreover, an article may be made from the resin composition, including a prepreg, a resin film, a laminate or a printed circuit board.