A modified bismaleimide resin is made by modify bismaleimide with aromatic diamine that contains fluoro substituents through chain-growth polymerization; and modified bismaleimide resin is excellent in physical properties including a low dielectric constant Dk (3 GHz) less than 3.0, a dissipation factors (3 GHz) less than 0.02, a low resin water absorptivity ranging from 0.21% to 0.33% and an excellent processability, and is particularly suited for producing a copper clad laminate that is required to have dielectric constant Dk (3 GHz) less than 3.

A method for manufacturing a semiconductor apparatus, including an encapsulating step of collectively encapsulating a device mounting surface of a substrate having semiconductor devices mounted thereon with a base-attached encapsulant having a base and a thermosetting resin layer formed on one surface of the base, the semiconductor devices being mounted by flip chip bonding, the encapsulating step including a unifying stage of unifying the substrate having the semiconductor devices mounted thereon and the base-attached encapsulant under a reduced pressure condition with a vacuum of 10 kPa or less, and a pressing stage of pressing the unified substrate with a pressure of 0.2 MPa or more.

An aqueous polyimide precursor solution composition in which a polyamic acid which is formed by the reaction of a tetracarboxylic acid component and a diamine component, and contains a repeating unit represented by the following formula (1), is dissolved in an aqueous solvent together with an imidazole in an amount of 1.6 mole or more per mole of the tetracarboxylic acid component of the polyamic acid, in which the aqueous polyimide precursor solution composition contains no organic solvent, and the polyamic acid has an inherent viscosity of 0.2 or more.

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Provided is a heat-curable resin composition for use in electric and electronics industry which is suitable as an underfill and for performing potting, and is superior in fluidity, moisture resistance reliability and adhesiveness at a high temperature. The heat-curable resin composition of the invention contains (A) a heat-curable resin; and (B) a bismaleimide compound in liquid form at 25 C., and exhibits a viscosity of 1 mPa.Math.s to 850 Pa.Math.s when measured at 25 C. in accordance with a method described in JIS Z8803:2011.

Provided are a curable maleimide resin composition that can avoid the usage of a problematic solvent, such as NMP among aprotic polar solvents, having a high boiling point and toxicity, can be cured at a relatively low temperature, and provide a cured product having a superior adhesiveness to semiconductor materials. The curable maleimide resin composition contains: (A) a maleimide compound that has a number average molecular weight of 5,000 to 50,000; (B) a reaction initiator; and (C) a silane coupling agent that has one or more epoxy groups in one molecule; and optionally (D) a diaminotriazine ring-containing imidazole.

There are provided a photosensitive resin composition having excellent heat resistance, developability, and curability, a laminate obtained by using a photosensitive resin composition, a method for manufacturing a semiconductor device, and a semiconductor device.

The photosensitive resin composition includes a polymer including a repeating unit derived from an acid group-containing maleimide, a crosslinking agent, a photopolymerization initiator, and a thermal polymerization initiator. The polymer preferably further includes a repeating unit derived from a vinyl compound.

Formulations usable in additive manufacturing, 3D inkjet printing in particular, of a three-dimensional object that contains a polyimide material, and additive manufacturing utilizing same are provided. The formulations contain a polyimide precursor (e.g., a bismaleimide) and an additional curable material, which is a multifunctional curable material, and are devoid of an organic solvent.

The present invention relates to novel compositions comprising cyanate ester resins and substituted bisimides (citracon-imides, bisitaconimide, citraconimido-itaconimide, bisnadicimide, bistetrahydroimide and mixtures thereof) as defined in claim 1, and thermoset composite materials based on these compositions.

A polyimide precursor resin composition for forming a flexible device substrate, including a polyamic acid having a structure obtained from a tetracarboxylic acid component including at least one of 3,3,4,4-biphenyltetracarboxylic dianhydride and pyromellitic dianhydride, a diamine component including at least one of paraphenylene diamine and 4,4-diaminodiphenyl ether, and a carboxylic acid monoanhydride, the polyamic acid satisfying equations (1) and (2) below:
0.97X/Y<1.00Equation (1)
0.5(Z/2)/(YX)1.05Equation (2)
in which X represents a number of moles of tetracarboxylic acid component, Y represents a number of moles of diamine component, and Z represents a number of moles of the carboxylic acid monoanhydride.

A resin composition includes a prepolymer which is prepared from a mixture subjected to a prepolymerization reaction, the mixture including 100 parts by weight of a first maleimide resin, 40 to 60 parts by weight of a siloxane compound and 10 to 30 parts by weight of a diamine compound, wherein: the first maleimide resin includes bisphenol A diphenyl ether bismaleimide; the siloxane compound includes a compound of Formula (I), having a molecular weight of 2200 to 2600 g/mol; and the diamine compound includes 4-aminophenyl-4-aminobenzoate. The resin composition may be used to make various articles, such as a varnish, a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following properties can be improved, including resin compatibility and X-axis coefficient of thermal expansion.