A maleimide resin according to the present invention is formed by reacting a tetracarboxylic acid dianhydride (a1), an amine (a2), and maleic anhydride (a3), the amine (a2) including a dimer diamine and a secondary amine that is not a dimer diamine, and at least one of the tetracarboxylic acid dianhydride (a1) and the amine (a2) including a compound that has a fluorene skeleton.

To provide a compound represented by Formula (1): wherein the dotted line portions each independently represent *CHCH.sub.2 or *CCH, and * is bonded to the side near the oxygen atom contained in the ring.

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A resin composition containing a resin that contains a specific repeating unit and a group having an ethylenically unsaturated bond, in which a content of a phenolic hydroxyl group is 0.250 mmol/g or less, and a polymerizable compound having an ethylenically unsaturated bond, a cured substance obtained by curing the resin composition, a laminate including the cured substance, a manufacturing method for the cured substance, a manufacturing method for a laminate, a manufacturing method for a semiconductor device including the manufacturing method for a cured substance, and a semiconductor device including the cured substance, and a diamine compound having a specific structure.

A negative-type photosensitive resin composition that has a satisfactory imidization rate and can yield a resin layer with high chemical resistance, even under low-temperature curing conditions of 200 C. or below, the negative-type photosensitive resin composition containing a photopolymerization initiator (B) in a proportion of 0.1 part by mass to 20 parts by mass with respect to 100 parts by mass of a polyimide precursor (A), the polyimide precursor (A) being a polyamic acid ester or polyamic acid salt with a specific structure, and the weight-average molecular weight (Mw) of the polyimide precursor (A) being 3,000 or greater and less than 16,000, in terms of polystyrene, according to gel permeation chromatography (GPC).