Hydrocarbon proton exchange membranes are disclosed that are composed of a material including a hydrophobic main chain, and acidic side chains. The main chain includes a polyaryl structure that is substantially free of ether linkages and also includes a fluoromethyl substituted carbon. The acidic side chains include a hydrocarbon tether terminated by a strongly acidic group, such as a fluoroalkyl sulfonate group. Chemical stability of the material is increased by removing the ether linkages from the main chain. The hydrophobic main chain and substantially hydrophilic side chains create a phase-separated morphology that affords enhanced transport of protons and water across the membrane even at low relative humidity levels. These materials are advantageous as membranes for use in fuel cells, redox flow batteries, water hydrolysis systems, sensors, electrochemical hydrogen compressors, actuators, water purifiers, gas separators, etc.

The present invention addresses the problem of providing a fluorine-containing aromatic polymer; a method for producing the fluorine-containing aromatic polymer; etc. The problem can be solved by: a polymer having a monomer unit represented by formula (1) (wherein R.sup.1 in each occurrence is independently a halogen atom, NR.sup.11R.sup.12 (wherein R.sup.11 and R.sup.12 are independently a hydrogen atom or an organic group), or an organic group; n1 is an integer of 0 to 4; two R.sup.1s that can be present in the ortho-positions may form a ring together with two carbon atoms on the adjacent benzene ring, wherein the formed ring may have an organic group as a substituent; and L.sup.1 is a single bond, an oxygen atom, a sulfur atom, -L.sup.11-O—, —O-L.sup.12-O—, -L.sup.13-S—, or —S-L.sup.14-S— (wherein L.sup.11 to L.sup.14 are each independently an alkylene group optionally having one or more substituents); etc.

A patterned film structure consists of a substrate and of a patterned polymeric layer which selectively covers and exposes part of the surface of the substrate. The patterned polymeric layer is selected form at least one of an unsubstituted poly-para-xylylene and a substituted poly-para-xylylene.

The present application relates to a polymer containing at least one structural unit of a formula (I) and at least one further structural unit selected from structural units A, B and C. The present application further relates to the use of the polymer in an electronic device and to a process for preparing the polymer. The present application further relates to an electronic device comprising the polymer.

A resist underlayer film-forming composition for lithography process having characteristics of enabling wafer surface planarization after film formation, excellent planarization performance on substrate with level difference, and good embeddability in fine hole pattern. The resist underlayer film-forming composition including polymer having unit structure of Formula (1) and solvent,

##STR00001##

wherein each of R.sup.1 to R.sup.4 is independently hydrogen atom or methyl group, and X.sup.1 is divalent organic group having at least one arylene group optionally substituted by alkyl group, amino group, or hydroxyl group, and wherein X.sup.1 in Formula (1) is organic group of Formula (2),

##STR00002##

wherein A.sup.1 is phenylene group or naphthylene group, A.sup.2 is phenylene group, naphthylene group, or organic group of Formula (3), and dotted line is bond, and

##STR00003##

wherein each of A.sup.3 and A.sup.4 is independently phenylene group or naphthylene group, and dotted line is bond.

Films including a water-soluble layer and a vapor-deposited organic coating are disclosed. The films can optionally further include a vapor-deposited inorganic layer. The films exhibit enhanced barrier properties.

A composition comprising a phosphorescent compound of formula (I) and a polymer comprising a repeat unit of formula (II) Ar.sup.1 is an aryl or heteroaryl group. R.sup.2 is a substituent. A is independently in each occurrence N or CR.sup.3 wherein R.sup.3 is H or a substituent. M is a transition metal or metal ion. x is a positive integer of at least 1. y is 0 or a positive integer. L.sup.1 is a mono- or polydentate ligand. R.sup.1 is a substituent. z is 0 or a positive integer. X is O or S. The phosphorescent compound of formula (I) may be mixed with the polymer or may be covalently bound thereto. The composition may be used in the light-emitting layer of an organic light-emitting device.

A composition for resist underlayer film formation contains: a compound having a partial structure represented by the following formula (1); and a solvent. In the formula (1): X represents a group represented by formula (i), (ii), (iii) or (iv). In the formula (i): R.sup.1 and R.sup.2 each independently represent a hydrogen atom, a substituted or unsubstituted monovalent aliphatic hydrocarbon group having 1 to 20 carbon atoms, or a substituted or unsubstituted aralkyl group having 7 to 20 carbon atoms provided that at least one of R.sup.1 and R.sup.2 represents the substituted or unsubstituted monovalent aliphatic hydrocarbon group having 1 to 20 carbon atoms or the substituted or unsubstituted aralkyl group having 7 to 20 carbon atoms; or R.sup.1 and R.sup.2 taken together represent a part of a ring structure having 3 to 20 ring atoms together with the carbon atom to which R.sup.1 and R.sup.2 bond. ##STR00001##

The object is to provide a resin composition for a printed circuit board capable of realizing a printed circuit board that not only has heat resistance and flame retardancy but also is excellent in heat resistance after moisture absorption. The resin composition is a resin composition for a printed circuit board containing a cyanate ester compound (A) obtained by cyanation of a naphthol-dihydroxynaphthalene aralkyl resin or a dihydroxynaphthalene aralkyl resin, and an epoxy resin (B).

A surface protective film comprising a base film and a resin film thereon can be bonded to a substrate having a circuit-forming surface and separated therefrom after processing. The resin film is formed of a resin composition comprising (A) a silphenylene-siloxane skeleton-containing resin, (B) a compound capable of reacting with an epoxy group in the resin to form a crosslinked structure, (C) a curing catalyst, and (D) a parting agent.