Recycled rubber is provided, which is formed by depolymerizing 100 parts by weight of rubber and 0.5 to 10 parts by weight of modifier, wherein the modifier is formed by reacting (a) R.sup.1-M, (b) double bond monomer, (c) ethylene sulfide, and (d) polymerization terminator, wherein R.sup.1 is C.sub.4-C.sub.16 alkyl group, M is Li, Na, K, Ba, or Mg and (b) double bond monomer is 1,3-butadiene, isoprene, 1,3-pentadiene, 2,3-dimethyl-1,3-butadiene, 2-methyl-1,3-pentadiene, 2,3-dimethyl-1,3-pentadiene, 2-phenyl-1,3-butadiene, 4,5-diethyl-1,3-octadiene, styrene, 1-ethylene naphthalene, 3-methylstyrene, 3,5-diethylstyrene, 4-propylstyrene, 2,4,6-trimethylstyrene, 4-dodecylstyrene, 3-methyl-5-n-hexylstyrene, 4-phenylstyrene, 2-ethyl-4-benzylstyrene, 3,5-diphenylstyrene, 2,3,4,5-tetraethyl styrene, 3-ethyl-1-vinylnaphthalene, 6-isopropyl-1-vinylnaphthalene, 6-cyclohexyl-1-vinylnaphthalene, 7-dodecyl-2-vinylnaphthalene, α-methyl styrene, or a combination thereof.

A resin composition includes a vinyl-containing polyphenylene ether resin and a multifunctional vinylsilane. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board and achieve improvement in at least one of the properties including prepreg or laminate surface appearance, glass transition temperature, ratio of thermal expansion, peel strength, thermal resistance after moisture absorption, thermal resistance, dielectric constant, dissipation factor and inner resin flow.

Thermosetting resin composition, prepreg and metal foil clad laminate made therefrom. The thermosetting resin composition comprises (A): a solvent-soluble multifunctional vinyl aromatic copolymer, wherein same is a multifunctional vinyl aromatic copolymer having structural units from monomers comprising a divinyl aromatic compound (a) and ethyl vinyl aromatic compound (b); and (B), wherein same is selected from olefin resins having a number-average molecular weight of 500-10,000 and containing 10%-50% by weight of a styrene structure, and the molecules thereof contain a 1,2-addition butadiene structure. The prepreg and copper foil clad laminate made from the thermosetting resin composition of the present invention have a good toughness, and maintain a high glass transition temperature, a low water absorption, excellent dielectric properties and damp heat resistance thereof, and are suitable for use in the field of high frequency and high speed printed circuit boards, and are also suitable for processing multilayer printed circuit boards.

A resin composition contains a maleimide compound (A), a cyanate ester compound (B), a polyphenylene ether compound (C) with a number average molecular weight of not lower than 1000 and not higher than 7000 and represented by Formula (1), and a block copolymer (D) having a styrene backbone. In Formula (1), X represents an aryl group; (YO)n.sub.2- represents a polyphenylene ether moiety; R.sub.1, R.sub.2, and R.sub.3 each independently represent a hydrogen atom, an alkyl group, an alkenyl group, or an alkynyl group; n.sub.2 represents an integer of from 1 to 100; n.sub.1 represents an integer of from 1 to 6; and n.sub.3 represents an integer of from 1 to 4.

##STR00001##

Copper clad laminates and a resin composition and a pre-preg and a laminate using the composition. The resin composition contains: (A) a prepolymer of vinyl thermosetting polyphenylene ether and a bifunctional maleimide or a multifunctional maleimide; and, (B) a polyolefin resin. Employing the prepolymer of vinyl thermosetting polyphenylene ether and the bifunctional maleimide or the multifunctional maleimide, solves the problem of incompatibility of the bifunctional maleimide or the multifunctional maleimide with the vinyl thermosetting polyphenylene ether and the polyolefin resin. An aqueous glue solution so mixed is uniform and consistent, the prepreg has a uniform expression, and a substrate resin area is free of a phase-separation problem.

The present invention relates to a polypropylene resin composition containing a polypropylene resin, an elastomer having a polar functional group, and a filler. The polypropylene resin composition of the present invention can be suitably used in manufactured articles of audio equipment, electric appliances, transportation vehicles, construction buildings, industrial equipment, and the like.

A compound having a structure represented by the following Formula (I), where Q.sup.1 and Q.sup.2 individually represent a functional group containing a CC unsaturated bond and J.sup.1 and J.sup.2 individually represent a flame retardant group containing a phosphorus atom, useful in a resin composition for fabricating articles such as a prepreg, a resin film, a laminate or a printed circuit board, such that the articles have improved one or more properties including glass transition temperature, ratio of thermal expansion, peel strength, thermal resistance, dielectric constant, dissipation factor and flame retardancy. ##STR00001##

A thermosetting resin composition, a prepreg, a laminate, and a printed circuit board are provided. The thermosetting resin composition has a thermosetting polyphenylene ether resin, an unsaturated polyolefin resin, a curing agent, and hollow borosilicate microspheres with surfaces treated with a bromine-containing silane coupling agent. The laminate produced from the thermosetting resin composition satisfies the requirements for overall properties such as low dielectric constant, low dielectric loss, low water absorption rate, high peeling strength, and the like for a high-frequency electronic circuit substrate.

Disclosed herein is a resin composition, comprising: a crosslinking agent, its prepolymer, or a combination thereof; and a first unsaturated bond-containing resin. The resin composition may be used to make various articles, such as a prepreg, a resin film, a resin-coated copper, a laminate or a printed circuit board and achieve improvement in at least one, more or all properties including volatile content of prepreg, stickiness of prepreg, resin filling property of prepreg, glass transition temperature, dimensional stability under heat, T288 thermal resistance, thermal resistance after moisture absorption, dielectric constant and dissipation factor.

A phosphorus-containing compound, a phosphorus-containing flame retardant, and a preparation method thereof are provided. Also provided is a resin composition which comprises the phosphorus-containing flame retardant and an unsaturated bond-containing resin. The resin composition may be used to make various articles, such as a prepreg, a resin film, a resin-coated copper, a laminate or a printed circuit board, and achieves improvement in at least one, more or all properties including resin filling property of prepreg, flame retardancy, alkali resistance, glass transition temperature, thermal dimensional stability (ratio of dimensional change under heat), thermal resistance after moisture absorption, peeling strength, dielectric constant and dissipation factor.