Described herein are non-aqueous ink compositions containing a polythiophene having a repeating unit complying with Formula (I) described below, one or more metalloid nanoparticles, and a liquid carrier having one or more organic solvents. The present disclosure also concerns the uses of such non-aqueous ink compositions, for example, in organic electronic devices. Formula (I) wherein R.sub.1 and R.sub.2 are each, independently, H, alkyl, fluoroalkyl, alkoxy, aryloxy, or O[ZO].sub.pR.sub.e; wherein Z is an optionally halogenated hydrocarbylene group, p is equal to or greater than 1, and R.sub.e is H, alkyl, fluoroalkyl, or aryl.

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An acoustic lens for an ultrasonic probe includes a vulcanization-molded article of a rubber composition including a first silicone rubber composition having a plasticity number of 100 or less, and a second silicone rubber composition having a plasticity number of 150 or more and 300 or less.

An anhydride-free impregnating resin for an electrical insulation body, the impregnating resin has an epoxy resin, a curing agent and nanoscale and/or microscale inorganic particles. An impregnable electrical insulating tape for an electrical insulation body has a curing agent applied to the electrical insulating tape. A method includes producing an electrical insulation body An electrical insulation body includes an anhydride-free impregnating resin, where the impregnating resin has an epoxy resin, a curing agent and nanoscale and/or microscale inorganic particles.

The present invention relates to polyamide moulding compounds which have an improved resistance to heat-aging and comprise the following compositions: (A) 25 to 84.99 wt.-% of at least one polyamide, (B) 15 to 70 wt.-% of at least one filler and reinforcing means, (C) 0.01 to 5.0 wt.-% of at least one inorganic radical interceptor, (D) 0 to 5.0 wt.-% of at least one heat stabilizer which is different from the inorganic free-radical scavenger under (C), and (E) 0 to 20.0 wt.-% of at least one additive. The invention further relates to moulded articles produced from these polyamide moulding compounds as components in the automobile or electrics/electronics sector.

The present invention provides a corrosion-resistant structure for a high-temperature water system comprising: a structural material 1; and a corrosion-resistant film 3 formed from a substance containing at least one of La and Y deposited on a surface in a side that comes in contact with a cooling water 4, of the structural material 1 which constitutes the high-temperature water system that passes a cooling water 4 of high temperature therein. Due to above construction, there can be provided the corrosion-resistant structure and a corrosion-preventing method capable of operating a plant without conducting a water chemistry control of cooling water by injecting chemicals.

The present invention relates to polyamide molding compounds which have an improved resistance to heat-aging and comprise the following compositions: (A) 25 to 84.99 wt.-% of at least one polyamide, (B) 15 to 70 wt.-% of at least one filler and reinforcing means, (C) 0.01 to 5.0 wt.-% of at least one inorganic radical interceptor, (D) 0 to 5.0 wt.-% of at least one heat stabilizer which is different from the inorganic free-radical scavenger under (C), and (E) 0 to 20.0 wt.-% of at least one additive. The invention further relates to molded articles produced from these polyamide molding compounds as components in the automobile or electrics/electronics sector.

An anticorrosive pigment comprising an aluminum polyphosphate comprises at least one cerium-based compound and/or one lanthanum-based compound and/or one praseodymium-based compound. An anticorrosive paint incorporating the pigment is also provided.

A process involves the continuous surface treatment of stainless steel coils with aqueous suspensions of rare earth oxide nano or micro particles or aqueous rare earth nitrate solutions of nano or micro particles. The surface treatment can be applied by roll coating, spraying or other conventional application techniques. The treated material in coil form is then heated in an annealing box using an open coil process whereby a wire is placed between coil laps to promote uniform atmosphere exposure. The atmosphere can be reducing or oxidizing and the times can vary from 1 hr to 100 hr. The atmosphere can also be wet (high dew point) or dry (low dew point). The surface treatment promotes a more uniform color to the subsequently developed oxide formed during anneal-type heat treatment. It also improves corrosion resistance of the processed stainless steel material. Materials treated in this manner are suitable for a variety of applications in the building systems, automotive and appliance markets.

The present invention provides a resin composition which can simply provide, with good reproducibility, a laminate, a printed wiring board, and the like that not only have excellent heat dissipation properties but have good moldability, good mechanical drillability and excellent appearance, and a prepreg, a metal foil-clad laminate, and the like using the same. A resin composition having a cyanate ester compound (A), an epoxy resin (B), a first inorganic filler (C), a second inorganic filler (D), and a molybdenum compound (E), wherein an average particle diameter ratio of the first inorganic filler (C) to the second inorganic filler (D) is in a range of 1:0.02 to 1:0.2.

The present invention provides a resin composition which can simply provide, with good reproducibility, a laminate, a printed wiring board, and the like that not only have excellent heat dissipation properties but have good moldability, good mechanical drillability and excellent appearance, and a prepreg, a metal foil-clad laminate, and the like using the same. A resin composition having a cyanate ester compound (A), an epoxy resin (B), a first inorganic filler (C), a second inorganic filler (D), and a molybdenum compound (E), wherein an average particle diameter ratio of the first inorganic filler (C) to the second inorganic filler (D) is in a range of 1:0.02 to 1:0.2.