Patent classifications
C08K2003/2227
Aluminum-containing silica sol dispersed in nitrogen-containing solvent and resin composition
A silica sol dispersed in a nitrogen-containing solvent and a silica-containing resin composition containing a nitrogen atom-containing polymer. A silica sol including silica particles containing aluminum atoms and having an average primary particle diameter of 5 to 100 nm, the silica particles being dispersed in a nitrogen-containing solvent, wherein the aluminum atoms are bonded to the surfaces of the silica particles in an amount in terms of Al.sub.2O.sub.3 of 800 to 10,000 ppm/SiO.sub.2. The silica particles are bonded to a silane compound or a hydrolysate of the silane compound. The nitrogen-containing solvent is an amide solvent. The nitrogen-containing solvent is dimethylacetamide, dimethylformamide, N-methylpyrrolidone, or N-ethylpyrrolidone. The insulating resin composition includes the silica sol and a nitrogen-containing polymer. The nitrogen-containing polymer is polyimide, polyamide, polyamic acid, polyamideimide, polyetherimide, or polyesterimide. An insulation-coated conductor wire produced by insulation coating of a conductor wire with the insulating resin composition.
Inorganic nanoparticle-coated hollow particles, method for producing the same, and aqueous dispersion containing the hollow particles
Provided are hollow particles which are more excellent in heat resistance and dispersibility than ever before and which are lightweight. The hollow particles containing hollow resin particles having a surface covered with inorganic fine particles, wherein a volume average particle diameter of the hollow particles is from 0.1 μm to 9.0 μm, and a void ratio thereof is from 55% to 95%; wherein a repeating unit constituting the resin of the hollow resin particles contains a crosslinkable monomer unit, and a content of the crosslinkable monomer unit is from 25 to 100 parts by mass, with respect to 100 parts by mass of the resin; wherein a primary particle diameter of the inorganic fine particles is from 10 nm to 120 nm; and wherein the inorganic fine particles are contained at from 5 to 180 parts by mass, with respect to 100 parts by mass of the hollow resin particles.
Inorganic nanoparticle-coated hollow particles, method for producing the same, and aqueous dispersion containing the hollow particles
Provided are hollow particles which are more excellent in heat resistance and dispersibility than ever before and which are lightweight. The hollow particles containing hollow resin particles having a surface covered with inorganic fine particles, wherein a volume average particle diameter of the hollow particles is from 0.1 μm to 9.0 μm, and a void ratio thereof is from 55% to 95%; wherein a repeating unit constituting the resin of the hollow resin particles contains a crosslinkable monomer unit, and a content of the crosslinkable monomer unit is from 25 to 100 parts by mass, with respect to 100 parts by mass of the resin; wherein a primary particle diameter of the inorganic fine particles is from 10 nm to 120 nm; and wherein the inorganic fine particles are contained at from 5 to 180 parts by mass, with respect to 100 parts by mass of the hollow resin particles.
COMPOUNDED COPOLYAMIDE POWDERS
Compounded copolyamide powders, processes for preparation of compounded copolyamide powders, articles made therefrom and uses.
CURABLE COMPOSITION AND ARTICLE
A curable composition containing: a compound represented by the following formula (1):
##STR00001##
wherein R.sup.11 and R.sup.12 each independently represent a hydrogen atom or a methyl group, and R.sup.13 represents a divalent group having a polyoxyalkylene chain; and a thermally conductive filler.
CURABLE RESIN COMPOSITION, PRODUCTION METHOD THEREOF AND CURED PRODUCT
The present invention provides a curable resin composition excellent in surface curability and internal curability in bonding adherend members without use of an organic tin catalyst. The curable resin composition includes the following components (A) to (E): component (A): an epoxy resin having 2 or more epoxy groups in a molecule; component (B): a bismuth catalyst; component (C): water having a pH of 8.0 or more; component (D): an organic polymer having 2 or more hydrolyzable silyl groups in a molecule; and component (E): a curing agent for an epoxy resin.
Fireproof and Waterproof Biomass Floor and Manufacturing Method Therefor
A fireproof and waterproof biomass floor and a manufacturing method therefor. The floor comprises, in parts by weight, 80-95 parts of a wood fiber, 5-20 parts of an additive, and 0-1 part of a pigment. The additive comprises the following raw material components in percentage by weight: a metal oxide: 10-20 wt %; a hydrochloride: 10-20 wt %; a non-metal oxide: 5-10 wt %; a weak acid: 5-10 wt %; a sulfate: 1-2 wt %; a phosphate: 1-2 wt %; and water: 36-68 wt %. The manufacturing method comprises: mixing the wood fiber, the additive, and the pigment; flatly laying the obtained mixture on a base plate; performing die pressing, and standing for 3-10 days; performing demolding; subjecting the obtained demolded plate to edge cutting, drying, sanding, assembling, hot pressing, cutting, curing, slotting, and silent pad pasting on the back face. The floor has the advantages of being fireproof, ultralow in water absorption thickness expansion rate, and ultralow in formaldehyde release amount.
FLAME-RETARDANT POLYMER COMPOSITION
A flame-retardant polymer composition comprises at least one elastomeric polymer that includes at least one monomer incorporated by polymerization. The at least one monomer comprises at least one of C2-C30 alkylenes. The flame-retardant polymer composition further comprises polyarylene sulfide. The polyarylene sulfide is present in a particle form and/or in a fiber form.
FLAME RETARDANT-STABILIZER COMBINATION FOR THERMOPLASTIC POLYMERS
The invention provides a flame retardant-stabilizer combination for thermoplastic polymers, comprising as component A 20% to 99.7% by weight of phosphinic salt of the formula (I), (I), in which R.sub.1 and R.sub.2 are each ethyl, M is Al and m is 3; as component B 0.2% to 16% by weight of aluminium salts of ethylbutylphosphinic acid, of dibutylphosphinic acid, of ethylhexylphosphinic acid, of butylhexylphosphinic acid and/or of dihexylphosphinic acid; as component C 0.1% to 80% by weight of a salt of phosphorous acid having the general formula (II) [HP(═O)O.sub.2].sup.2−M.sup.m+(II) in which M is Zn and m is 2; as component D 0% to 80% by weight of a salt of phosphorous acid having the general formula (III) [HP(═O)O.sub.2].sup.2−.sub.3 M.sup.m+.sub.2 (III) in which M is Al and m is 3; as component E 0% to 30% by weight of a nitrogen-containing synergist and/or of a phosphorus-containing and/or nitrogen-containing flame retardant; as component F 0% to 10% by weight of an inorganic synergist selected from zinc borate, zinc stannate, boehmite and/or hydrotalcite; as component G 0% to 3% by weight of an organic phosphonite and/or a mixture of an organic phosphonite and an organic phosphite and as component H 0% to 3% by weight of an ester and/or salt of long-chain aliphatic carboxylic acids (fatty acids) typically having chain lengths of C.sub.14 to C.sub.40, where the sum total of the components is always 100% by weight.
##STR00001##
FLOWABLE HARDENABLE COMPOSITION, THERMALLY CONDUCTIVE COMPOSITION, AND ELECTRONIC HEAT SINK ASSEMBLY INCLUDING THE SAME
A flowable hardenable composition comprising from 10 to 95 percent by volume of shaped composite particles dispersed in a hardenable binder precursor. The shaped composite particles comprise thermal filler particles having an aspect ratio of at least 1.5 retained in a binder matrix. After hardening, a thermally conductive composition is obtained. An electronic heat sink assembly comprises an electronic component, a heat sink, and the thermally conductive composition sandwiched therebetween.