Disclosed herein are thermal interface materials (TIM) composition comprising: a) a non-reactive polyurethane prepolymer; b) about 70-95 wt % of aluminum trihydroxide (ATH); c) about 0.15-1.5 wt % of at least one silane terminated urethane prepolymer; and d) about 1-20 wt % of at least one plasticizer, with the total weight of the thermal interface material totaling to 100 wt %.

The insulation adhesive film material is composed of a three-layer structure, its insulation polymer composite is supported by a thin film material, and a surface of the insulation polymer composite is covered with a layer of protective film. A release force of a support film is 25-60 μN/mm, and a release force of the protective film is 2-60 μN/mm. A thickness of the insulation polymer composite is 1-300 μm. The insulation adhesive film material is prepared as follows: after a high molecular polymer, an inorganic filler, a high molecular polymer curing agent, a molding auxiliary agent, and a solvent are mixed, dispersion technologies such as ball milling, sand milling, ultrasound are conducted to prepare an electronic paste of the insulation polymer composite, and the electronic paste is then applied to a surface of a support film material, and bonded with the protective film to form the insulation adhesive film material.

This thermally conductive addition curing silicone composition contains: a heated mixture of an organopolysiloxane having at least two alkenyl groups bonded to silicon atoms in one molecule, an organohydrogen polysiloxane having at least three hydrogen atoms bonded to silicon atoms in one molecule, and aluminum oxide particles having an Na.sup.+ ion level of 50 ppm or less when an aluminum oxide powder is heat extracted by pure water for 24 hours at 60° C. and the resultant water layer is measured by ion chromatography, the aluminum oxide particles having been surface-treated by the organohydrogen polysiloxane; an organohydrogen polysiloxane having two or more hydrogen atoms bonded to silicon atoms in one molecule; and a platinum group metal catalyst. Said composition can be applied to the inside of a module including electrical/electronic components and a circuit board on which these compounded are mounted, and can exhibit exceptional post-curing stress relaxation properties and thermal conductivity.

An object is to provide a heat conductive sheet having good handleability when mounting between the heating element and the heat dissipator, and softness that enables the distortion of the heating element, the heat dissipator, and the like to be suppressed in use. The heat conductive sheet contains: a matrix comprising a cured product of organopolysiloxane; and heat conductive fillers comprising anisotropic fillers with their major axes oriented in the thickness direction, and has a load property P represented b formula (1) below of 0.1 to 0.7: Load property P=(F.sub.30−F.sub.20)/F.sub.10 (1) wherein F.sub.10 is a load of the heat conductive sheet at 10% compression, F.sub.20 is a load of the heat conductive sheet at 20% compression, and F.sub.30 is a load of the heat conductive sheet at 30% compression.

A UV-cured cross-linked liquid resin reinforced with ceramic inorganic nano-particles and ceramic inorganic abrasion-resistant powder, comprised of 30%-45% by weight resin, wherein the resin is at least one of 2-propenoic acid, homopolymer, isophthalic acid, 1,4-Dimethoxybenzene, saturated polyester resin, and maleic anhydride; 10%-20% by weight industrial ceramic inorganic nano-materials; 30%-45% by weight industrial ceramic inorganic abrasion-resistant powder; and styrene, wherein the styrene is less than 25% by weight of the UV-cured cross-linked liquid resin reinforced with ceramic inorganic nano-particles and ceramic inorganic abrasion-resistant powder.

A problem to be solved by the present invention is that there is no method for forming a dense structure on a porous structure at low cost. In addition, another object is to provide a high quality and inexpensive structure of a brittle material and a laminate thereof as an intermediate layer for facilitating formation of a dense structure on a porous structure. A structure is provided having a brittle particle assembly having a plurality of brittle particles, wherein the brittle particle assemblies are arranged adjacently to each other, and the brittle particles having a brittle material region in the periphery are crosslinked (connected) by the brittle material region to bond the brittle particles to each other, and thereby form a brittle material crosslinked structure region preventing the mobility of the brittle particles.

Hexavalent chromium-free slurry formulations which are suitable in the production of ceramic overlay coating systems are described. The formulations provide superior hot corrosion and heat oxidation protection for superalloy substrates. A basecoat slurry and topcoat slurry are provided. The basecoat slurry includes an aluminum phosphate based aqueous solution having a molar ratio of Al:PO.sub.4 higher than about 1:3 with the incorporation of metal oxide particles. The topcoat slurry includes an aluminum phosphate based aqueous solution having a molar ratio of Al:PO.sub.4 higher than about 1:3. Both of the basecoat slurry and the topcoat slurry are hexavalent chromium-free.

A paste for ceramic 3D shaping according to the present invention is a paste for ceramic 3D shaping containing a curable resin and inorganic particles, in which the inorganic particles contain ceramic particles and glass particles.

Provided is a thermally conductive silicone composition that can be turned into a lightweight cured product superior in thermal conductivity, and is easily processable due to its low viscosity. The composition contains: (A) an organopolysiloxane having at least two alkenyl groups per each molecule; (B) an organohydrogenpolysiloxane having, per each molecule, at least two hydrogen atoms directly bonded to silicon atoms; (C) a thermally conductive filler containing magnesium oxide (20 to 40% by mass), aluminum oxide (40 to 60% by mass) and aluminum hydroxide (10 to 30% by mass); (D) a dimethylpolysiloxane with one end of the molecular chain thereof being blocked by a trialkoxy group; (E) a platinum group metal-based curing catalyst; and (F) an addition reaction control agent.

The present invention relates to flame retardant polyamide-based compositions or moulding materials and to articles of manufacture of the electricals or electronics industries producible therefrom, in particular charging components, containing at least one polyamide, aluminium oxide, magnesium hydroxide and at least one organic epoxide.