COMPOSITELY STRUCTURED INSULATION ADHESIVE FILM AND PREPARATION METHOD THEREOF

Abstract

The insulation adhesive film material is composed of a three-layer structure, its insulation polymer composite is supported by a thin film material, and a surface of the insulation polymer composite is covered with a layer of protective film. A release force of a support film is 25-60 μN/mm, and a release force of the protective film is 2-60 μN/mm. A thickness of the insulation polymer composite is 1-300 μm. The insulation adhesive film material is prepared as follows: after a high molecular polymer, an inorganic filler, a high molecular polymer curing agent, a molding auxiliary agent, and a solvent are mixed, dispersion technologies such as ball milling, sand milling, ultrasound are conducted to prepare an electronic paste of the insulation polymer composite, and the electronic paste is then applied to a surface of a support film material, and bonded with the protective film to form the insulation adhesive film material.

Claims

1. A compositely structured insulation adhesive film, comprising a three-layer structure, wherein the three-layer structure comprises an insulation polymer composite layer, a thin film support layer at a bottom of the insulation polymer composite layer, and a protective film covering a surface of the insulation polymer composite layer; wherein contact surfaces of the thin film support layer and the insulation polymer composite layer, and contact surfaces of the protective film and the insulation polymer composite layer are subjected to release treatment, a release force between the thin film support layer and the insulation polymer composite layer is 25 μN/mm to 60 μN/mm, and a release force between the contact surfaces of the protective film and the insulation polymer composite layer is 25 μN/mm to 60 μN/mm.

2. The compositely structured insulation adhesive film Rofflaccording to claim 1, wherein a material of the thin film support layer is a polymer thin film material or a paper-based film material.

3. The compositely structured insulation adhesive film according to claim 2, wherein the polymer thin film material is selected from the group consisting of a polyester thin film (PET), a polyether-ether-ketone thin film (PEEK), a polyetherimide thin film (PEI), a polyimide thin film (PI), and a polycarbonate thin film (PC), and the paper-based film material is selected from the group consisting of release paper and coated paper.

4. The compositely structured insulation adhesive film according to claim 1, wherein a thickness of the thin film support layer is 10 μm to 300 μm.

5. The compositely structured insulation adhesive film according to claim 1, wherein a thickness of the thin film support layer is 20 μm to 100 μm.

6. The compositely structured insulation adhesive film according to claim 1, wherein a thickness of the thin film support layer is 30 μm to 60 μm.

7. The compositely structured insulation adhesive film according to claim 1, wherein a material of the protective film is a polymer thin film material.

8. The compositely structured insulation adhesive film according to claim 7, wherein the polymer thin film material is selected from the group consisting of a polyester thin film (PET), an oriented polypropylene thin film (OPP), and a polyethylene thin film (PE).

9. The compositely structured insulation adhesive film according to claim 1, wherein a thickness of the protective film is 10 μm to 300 μm.

10. The compositely structured insulation adhesive film according to claim 9, wherein the thickness of the protective film is 20 μm to 100 μm.

11. The compositely structured insulation adhesive film according to claim 9, wherein the thickness of the protective film is 30 μm to 60 μm.

12. The compositely structured insulation adhesive film according to claim 1, wherein a thickness of an insulation polymer composite between the thin film support layer support film and the protective film is 1 μm to 300 μm.

13. The compositely structured insulation adhesive film according to claim 12, wherein the thickness of the insulation polymer composite between the thin film support film and the protective film is 10 μm to 150 μm.

14. The compositely structured insulation adhesive film according to claim 1 wherein the release treatment comprises treating the thin film support layer and the protective film by a release agent.

15. The compositely structured insulation adhesive film according to claim 1, wherein the insulation polymer composite layer is obtained by coating the thin film support layer with an insulation polymer composite electronic paste and then conducting drying, and the insulation polymer composite electronic paste is prepared from raw materials comprising a high molecular polymer, an inorganic filler, a high molecular polymer curing agent, a solvent and an auxiliary agent.

16. The compositely structured insulation adhesive film according to claim 15, wherein the high molecular polymer is selected from a thermosetting high molecule polymer, and the thermosetting high molecule polymer is at least one selected from the group consisting of epoxy resin, cyanate ester resin, bismaleimide resin, phenolic resin, amino resin, and unsaturated polyester resin.

17. The compositely structured insulation adhesive film according to claim 15, wherein the high molecular polymer curing agent is an amine curing agent or an anhydride curing agent, wherein the amine curing agent is selected from the group consisting of dicyandiamine, bicyclic fluorene diamine, diaminodiphenyl sulfone, ethylenediamine, triethylene tetramine, 4,4-diaminodiphenylmethane, and polyamide, wherein the anhydride curing agent is selected from the group consisting of methylnadic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methyl tetrahydrophthalic anhydride, methyl hexahydrophthalic anhydride, dodecenyl succinic anhydride, N-dodecyl succinic anhydride, octenyl anhydride, phenylsuccinic anhydride, 2,3-naphthalic anhydride, and a curing accelerator, wherein the curing accelerator is selected from the group consisting of 2-methylimidazole, 2-methyl-4-ethylimidazole, undecylimidazole, heptadecylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, and 2,4,6-tris(dimethylaminomethyl)phenol.

18. The compositely structured insulation adhesive film according to claim 15, wherein the inorganic filler is at least one selected from the group consisting of silica, alumina, boron nitride, barium titanate, zinc oxide, zirconia, magnesia, and calcium carbonate.

19. The compositely structured insulation adhesive film according to claim 21, wherein the dispersing agent is selected from the group consisting of a nonionic emulsifier, an anionic emulsifier, an alkyl ammonium salt emulsifier, and a cationic emulsifier, wherein the nonionic emulsifier is selected from the group consisting of nonylphenol polyoxyethylene ether, alkylphenol polyoxyethylene ether, higher aliphatic alcohol polyoxyethylene ether, polyoxyethylene fatty acid, fatty acid methyl ester ethoxylate, and a high molecular polymer, wherein the anionic emulsifier is selected from the group consisting of sodium cis-9-octadecenoate, sodium oleate, sodium stearate, sodium laurate, C13-C18 sodium alkyl benzene sulfonate, and sulfate, wherein the alkyl ammonium salt is selected from the group consisting of dodecyl ammonium chloride, cetyl trimethyl ammonium bromide, and bromohexadecyl pyridine.

20. The compositely structured insulation adhesive film according to claim 15, the solvent is selected from the group consisting of 2-butanone, toluene, propylene glycol methyl ether acetate, cyclohexanone, methylcyclohexanone, chlorobenzene, dichlorobenzene, dichlorotoluene, ethyl ether, propylene oxide, methyl acetate, ethyl acetate, propyl acetate, methyl isobutyl ketone, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monobutyl ether, N,N-dimethylformamide, and acetone.

21. The compositely structured insulation adhesive film according to claim 15, the auxiliary agent is at least one agent selected from the group consisting of a defoaming agent, a dispersing agent, a coupling agent, an anti-settling agent, a leveling agent, a rheological agent, and a flame retardant.

22. The compositely structured insulation adhesive film according to claim 15, wherein the insulation polymer composite electronic paste is prepared by mixing and uniformly dispersing the raw materials to form the insulation polymer composite electronic paste.

23. A preparation method of the compositely structured insulation adhesive film according to claim 1, comprising the following steps: 1) coating the thin film support layer and the protective film with a release agent respectively to reach the release force of 25 μN/mm to 60 μN/mm respectively; 2. coating the thin film support layer with an insulation polymer composite electronic paste, and conducting temperature-gradient heating and drying to obtain the insulation polymer composite layer; and 3. covering the insulation polymer composite layer with the protective film for a thermocompression treatment to obtain the compositely structured insulation adhesive film with the three-layer structure, wherein a temperature of the thermocompression treatment in step 3 is 60 to 90° C.; and wherein in step 2, the temperature-gradient heating and the drying are conducted at a drying station, and a temperature rising interval is 60° C. to 120° C.

24. The preparation method according to claim 23, wherein the release force in step 1 is 25 μN/mm to 35 μN/mm.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0039] FIG. 1 is a schematic structural diagram of an insulation adhesive film, wherein 1-1 is a protective film, 1-2 is an insulation polymer composite, and 1-3 is a thin film support layer.

[0040] FIG. 2 is a schematic structural diagram of an insulation polymer composite in the insulation adhesive film, wherein 2-1 is inorganic filler particles, and 2-2 is a high molecular polymer.

[0041] FIG. 3 is a schematic flow diagram of preparing the insulation adhesive film of the present disclosure.

[0042] FIGS. 4A and 4B show the results of Embodiment 1.

[0043] FIG. 4A is a photo of coating a PET thin film with a release force of 20 μN/mm with an insulation polymer composite electronic paste prepared according to this formula. It can be seen that there will be a phenomenon of a large number of shrinkage cavities after paste coating.

[0044] FIG. 4B is a photo of coating a PET thin film with a release force of 25 μN/mm with the insulation polymer composite electronic paste prepared according to this formula. It can be seen that there is not a phenomenon of shrinkage cavities after paste coating.

[0045] FIGS. 5A-5C show the results of Embodiment 2.

[0046] FIG. 5A is a photo of coating a PET thin film with a release force of 15 μN/mm with an insulation polymer composite electronic paste prepared according to this formula. It can be seen that there will be a phenomenon of a large number of shrinkage cavities after paste coating.

[0047] FIG. 5B is a photo of coating a PET thin film with a release force of 20 μN/mm with the insulation polymer composite electronic paste prepared according to this formula. It can be seen that there is a phenomenon of shrinkage cavities at some positions after paste coating.

[0048] FIG. 5C is a photo of coating a PET thin film with a release force of 35 μN/mm with the insulation polymer composite electronic paste prepared according to this formula. It can be seen that there is not a phenomenon of shrinkage cavities after paste coating.

DETAILED DESCRIPTION OF THE EMBODIMENTS

[0049] In order to make the above objectives, features and advantages of the present disclosure more obvious and easier to understand, the implementations of the present disclosure are described in detail below in combination with the accompanying drawings, but this shall not be construed as limiting the implementable scope of the present disclosure.

[0050] The present embodiment provides an insulation adhesive film that is suitable for semiconductor packaging and suitable for preparation of fine circuits by an additive process or a semi-additive process, wherein the insulation adhesive film is prepared through the following steps.

[0051] Embodiment 1. Preparation of Insulation Adhesive Film

[0052] 1) The following components are weighed and then mixed:

[0053] Spherical silica 10 g

[0054] Epoxy resin NPPN-6385 10 g

[0055] Epoxy resin E 51 3 g

[0056] Dicyandiamine 0.65 g

[0057] 2-Methyl-4-ethylimidazole 0.01 g

[0058] Nonylphenol polyoxyethylene ether 0.3 g

[0059] N,N-dimethylformamide 10 g

[0060] Butanone 10 g

[0061] An insulation polymer composite electronic paste is obtained after ball milling at 600 rpm for 12 hours.

[0062] 2) A PET thin film is coated with a release agent, and a release force is determined by adjusting an addition amount and testing a state after coating.

[0063] 3) Surfaces of 50 μm thickness PET thin films with different release forces are coated with the insulation polymer composite electronic paste by using a comma scraper coating mode, states are observed, and results are shown in FIG. 4 and Table 1.

[0064] 4) A thickness of an insulation polymer composite thin film is controlled according to a solid content of the electronic paste and a distance between a scraper and the PET thin film. A thickness of the thin film after drying is controlled to be 25 μm. A staged oven is used in a drying process. A temperature of the oven adopts staged temperature rising, and starting from a coating end, the temperature of the oven is set to 60° C., 80° C., 100° C., 110° C. and 120° C.

[0065] 5) The dried insulation polymer composite thin film and an OPP thin film with a thickness of 25 μm are composited by thermocompression. In a process of thermocompression, a temperature of a heating roll is set to 70° C. After thermocompression, the insulation adhesive film with a three-layer structure is obtained.

[0066] FIG. 4A is a photo of coating a PET thin film with a release force of 20 μN/mm with an insulation polymer composite electronic paste prepared according to this formula. It can be seen that there will be a phenomenon of a large number of shrinkage cavities after paste coating.

[0067] FIG. 4B is a photo of coating a PET thin film with a release force of 25 μN/mm with the insulation polymer composite electronic paste prepared according to this formula. It can be seen that there is not a phenomenon of shrinkage cavities after paste coating.

[0068] The release agent is a solvent-free organosilicon release agent SL-200.

[0069] The adopted PET and OPP release films are prepared by smooth roll coating.

[0070] In the present disclosure, a release force test method is as follows: (1) taking TESA 7475 tape with a width of 25.4 mm and a length of 200 mm to be stuck on a testing surface (a release surface) of a film, and rolling the tape 3 times back and forth with a 2 KG standard rolling hand roll, wherein it shall be rolling while full sticking to avoid bubbles between the tape and the release film when the tape is stuck; (2) after the tape is stuck, conducting still standing for 20 minutes, wherein a temperature and a humidity of a laboratory are controlled at 23±2° C. and 50±5% respectively; (3) sticking double-sided tape on a non-testing surface of a sample, and fixing the sample to a standard steel plate to be tested; (4) installing a material on a fixture, and conducting testing in a method of pulling the tested tape at an angle of 180 degrees by a tensile machine, wherein data displayed by a computer of the tensile machine are release forces of the tested sample, and an average value of 5 numerical values is taken as a test result.

[0071] By testing peeling of the PET thin film, it can be seen that peeling may be easy under a release force between 25 to 30 .sub.ItN/mm in a case of need without damaging a conductive paste layer.

[0072] Embodiment 2. Preparation of Insulation Adhesive Film

[0073] 1) The following components are weighed and then mixed:

[0074] Spherical alumina 10 g

[0075] Epoxy resin HyPox RK 84 5 g

[0076] Epoxy resin NPPN-431A70 8g

[0077] Dicyandiamine 0.4 g

[0078] 2-Methyl-4-ethylimidazole 0.01 g

[0079] Nonylphenol polyoxyethylene ether 0.3 g

[0080] N,N-dimethylformamide 10 g

[0081] Butanone 10 g

[0082] An insulation polymer composite electronic paste is obtained after ball milling at 600 rpm for 12 hours.

[0083] 2) A PET thin film is coated with a release agent, and a release force is determined by adjusting an addition amount and testing a state after coating.

[0084] 3) Surfaces of 50 μm thickness PET thin films with different release forces are coated with the insulation polymer composite electronic paste by using a comma scraper coating mode, and results are shown in FIGS. 5A-5C and Table 1.

[0085] 4) A thickness of an insulation polymer composite thin film is controlled according to a solid content of the electronic paste and a distance between a scraper and the PET thin film. A thickness of the thin film after drying is controlled to be 20 μm. A staged oven is used in a drying process. A temperature of the oven adopts staged temperature rising, and starting from a coating end, the temperature of the oven is set to 60° C., 80° C., 100° C., 110° C. and 120° C.

[0086] 5) The dried insulation polymer composite thin film and an OPP thin film with a thickness of 25 μm are composited by thermocompression. In a process of thermocompression, a temperature of a heating roll is set to 70° C. After thermocompression, the insulation adhesive film with a three-layer structure is obtained.

[0087] FIG. 5A is a photo of coating a PET thin film with a release force of 15 μN/mm with an insulation polymer composite electronic paste prepared according to this formula. It can be seen that there will be a phenomenon of a large number of shrinkage cavities after paste coating.

[0088] FIG. 5B is a photo of coating a PET thin film with a release force of 20 μN/mm with the insulation polymer composite electronic paste prepared according to this formula. It can be seen that there is a phenomenon of shrinkage cavities at some positions after paste coating.

[0089] FIG. 5C is a photo of coating a PET thin film with a release force of 35 μN/mm with the insulation polymer composite electronic paste prepared according to this formula. It can be seen that there is not a phenomenon of shrinkage cavities after paste coating.

[0090] By testing peeling of the PET thin film, it can be seen that peeling may be easy under a release force between 25 to 30 .sub.ItN/mm in a case of need without damaging a conductive paste layer.

TABLE-US-00001 TABLE 1 Test Results of Release Forces in Embodiments 1 and 2 Release agent Release forces (μN/mm) (AL-200) 15 μN/mm 20 μN/mm 25 μN/mm 35 μN/mm Embodiment 1 x x ∘ ∘ Embodiment 2 x x ∘ ∘ Note: x indicates that there is a phenomenon of shrinkage cavities after coating, and ∘ indicates a smooth surface after coating.