The present disclosure relates to a paste for ohmic contact to p-type semiconductor, including a metal oxide and a binder, wherein the metal oxide is a rhenium oxide or a molybdenum oxide.

Example embodiments relate to a hardmask composition and/or a method of forming a fine pattern by using the hardmask composition, wherein the hardmask composition includes at least one of a two-dimensional layered nanostructure and a precursor thereof, and a solvent, and an amount of the at least one of a two-dimensional layered nanostructure and the precursor is about 0.01 part to about 40 parts by weight based on 100 parts by weight of the hardmask composition.

Provided is a thermoplastic resin composition that allows a plated layer to be successfully formed on a surface of resin molded article obtained therefrom under a wide range of laser irradiation condition. A thermoplastic resin composition comprising a thermoplastic resin, and 1 to 30 parts by weight of a laser direct structuring additive and 0.1 to 10 parts by weight of a laser marking additive per 100 parts by weight of the thermoplastic resin, wherein the laser direct structuring additive comprises 70% by weight or more of a tin oxide.

Embodiments of an optical fiber ribbon cable are provided. The optical fiber ribbon cable includes a cable jacket having an interior surface defining a central bore, at least one buffer tube located in the central bore of the cable jacket, and at least one optical fiber ribbon disposed within the at least one buffer tube. The at least one optical fiber ribbon includes a plurality of optical fibers, a polymer matrix surrounding the plurality of optical fibers, and a low-smoke, flame retardant (LSFR) coating surrounding the polymer matrix. The LSFR coating includes from 25 to 65% by weight of an inorganic, halogen-free flame retardant filler dispersed in a curable acrylate medium. Further, the inorganic, halogen-free flame retardant filler includes particles having, on average, a maximum outer dimension of 5 microns.

A flame retardant compound is provided. The flame retardant compound includes a polymer base resin, a carbonific host compound, and a guest compound including at least one atom of a transition metal. The carbonific host compound and the guest compound form a host-guest complex, and the host-guest complex acts to inhibit at least one of smoke release and smoke formation when exposed to heat. The host-guest complex is distributed within the polymer base resin. An intumescent flame retardant compound is also provided. The intumescent flame retardant compound includes a base resin, an acid donor, a spumific agent, a cyclodextrin host compound, and a guest compound including at least one atom of molybdenum. The cyclodextrin host compound and the guest compound form a host-guest complex. The acid donor, carbonific host compound, and spumific agent react when exposed to a temperature above 280 C. to form a foam.

Disclosed are: an ionomer nanoparticle dispersion solution formed by dispersing a perfluorinated ionomer having an ion conductive functional group in a solvent mixture including water and an alcohol, and carrying out a reaction under a supercritical condition; and a preparation method thereof. The ionomer nanoparticle dispersion solution has a high azeotropic mixture content in a continuous phase, which is a liquid phase, so as to readily remove a solvent therefrom, and thus a product using the ionomer nanoparticle dispersion solution can be readily fabricated and preparation costs can be reduced. In addition, uniformity of the product is improved because a perfluorinated ionomer having various ion conductive functional groups and various salts thereof is nano-dispersed, in a narrow molecular weight distribution, in the ionomer nanoparticle dispersion solution.

Provided is a resin composition that achieves superior appearance characteristics such as a color of a film end (or a roll end) after melt molding, film-breaking resistance, blocking resistance, vapor deposition defects-inhibiting properties, and adhesive strength of a vapor deposition layer. The resin composition contains: an ethylene-vinyl alcohol copolymer; inorganic particles; and an aliphatic carbonyl compound having 3 to 8 carbon atoms, in which the content of the inorganic particles is 50 ppm or greater and 5,000 ppm or less, the aliphatic carbonyl compound is at least one selected from the group consisting of a saturated aldehyde, an unsaturated aldehyde and a saturated ketone, and the content of the aliphatic carbonyl compound is 0.01 ppm or greater and 100 ppm or less. The inorganic particles preferably contain a metal element which is at least one selected from the group consisting of silicon, aluminum, magnesium, zirconium, cerium, tungsten and molybdenum.

Described herein are non-aqueous ink compositions containing a polythiophene having a repeating unit complying with formula (I) described herein, one or more metallic nanoparticles, and a liquid carrier having one or more organic solvents. The present disclosure also concerns the uses of such non-aqueous ink compositions, for example, in organic electronic devices.

Discloses are a thermosetting resin composition containing a maleimide compound including an unsaturated maleimide compound having a specified chemical structure, a thermosetting resin, an inorganic filler, and a molybdenum compound; a laminate plate for wiring boards obtained by coating a base material with a thermosetting resin composition containing a thermosetting resin, silica, and a specified molybdenum compound and then performing semi-curing to form a prepreg, and laminating and molding the prepreg; and a method for manufacturing a resin composition varnish including specified steps. According to the present invention, electronic components having low thermal expansion properties and excellent drilling processability and heat resistance, for example, a prepreg, a laminate plate, an interposer, etc., can be provided.

A chemical mechanical polishing (abbreviated as CMP) conditioner comprises a bottom substrate, an intermediate substrate and a diamond film The intermediate substrate is provided on the bottom substrate. The intermediate substrate comprises a hollow portion, an annular portion surrounding the hollow portion, and at least one projecting ring projecting out of the annular portion away from the bottom substrate. The projecting ring comprises a plurality of bumps arranged to be spaced apart from each other along an annulus region. The bumps are extended in a radial direction of the intermediate substrate. The diamond film is provided on the intermediate substrate. The diamond film is allowed for conforming to the bumps, so as to form a plurality of the abrasive projections.