Patent classifications
C08K2003/2296
Coated steel sheet and painted member
A coated steel sheet has a coating film on at least one side of a plated steel sheet. The coating film contains a binder resin, non-oxide ceramic particles containing V (excluding VC particles), and doped zinc oxide particles. The respective contents of the non-oxide ceramic particles containing V and the doped zinc oxide particles relative to the coating film satisfy the expressions: [(1) C.sub.Zn≥10.0, (2) C.sub.V≤0.5.Math.C.sub.Zn, (3) C.sub.V≤70−C.sub.Zn, (4) C.sub.V≥0.125.Math.C.sub.Zn, and (5) C.sub.V≥2.0], where C.sub.V represents the content (mass %) of the non-oxide ceramic particles containing V, and C.sub.Zn represents the content (mass %) of the doped zinc oxide particles. The coated steel sheet is excellent in both corrosion resistance before electrodeposition coating, and weldability.
POLYAMIDE RESIN, POLYAMIDE RESIN COMPOSITION, AND MOLDED ARTICLE
Provided are a polyamide resin having high crystallinity, a high glass transition temperature, and a low mass loss rate, and a polyamide resin composition and a molded article in which the polyamide resin is used. The polyamide resin includes a diamine-derived structural unit and a dicarboxylic acid-derived structural unit, in which 50 mol % or more of the diamine-derived structural units are structural unit derived from p-benzenediethanamine, and of the dicarboxylic acid-derived structural units, from not less than 20 mol % to less than 95 mol % are structural units derived from an aromatic dicarboxylic acid and from more than 5 mol % to not more than 80 mol % are structural units derived from an α,ω-linear aliphatic dicarboxylic acid having from 4 to 15 carbons.
NON-CURABLE THERMALLY CONDUCTIVE PITUITOUS SILICONE MATERIAL
A non-curable thermally conductive material contains: (a) a matrix material containing: (i) 90 to 98 wt % of a non-functional non-crosslinked organosiloxane fluid having a dynamic viscosity of 50 to 350 centiStokes; and (ii) 2 to less than 10 wt % of a crosslinked hydrosilylation reaction product of an alkenyl terminated polydiorganosiloxane having a degree of polymerization greater than 300 and an organohydrogensiloxane crosslinker with 2 or more SiH groups per molecule where the molar ratio of SiH groups to alkenyl groups is 0.5 to 2.0; (b) greater than 80 wt % to less than 95 wt % thermally conductive filler dispersed throughout the matrix material; and (c) treating agents selected from alkyltrialkoxy silanes where the alkyl contains one to 14 carbon atoms and monotrialkoxy terminated diorganopolysiloxanes having a degree of polymerization of 20 to 110 and the alkoxy groups each contain one to 12 carbon atoms dispersed in the matrix material.
Wavelength converting device
A wavelength converting includes a diffused-reflecting layer, a substrate, a photoluminescence layer, and a binder. The diffused-reflecting layer has a first surface and a second surface facing away from each other. The substrate is over the first surface of the diffused-reflecting layer. The photoluminescence layer is over the second surface of the diffused-reflecting layer. The binder is mixed at least in the photoluminescence layer or at least in the diffused-reflecting layer, the binder includes a structural unit represented by formula (1), and a characteristic absorption band in a Fourier-Transform Infrared (FTIR) Spectrum of silicon-oxygen-silicon bonds (Si—O—Si bonds) in the binder is from 900 cm.sup.−1 to 1250 cm.sup.−1, ##STR00001##
in which R represents an aromatic group.
Thermally conductive resin composition and thermally conductive sheet using the same
A thermally conductive resin composition capable of maintaining high thermal conductivity and a thermally conductive sheet using the same, a thermally conductive resin composition contains an addition reaction type silicone resin, a thermally conductive filler, an alkoxysilane compound, and a carbodiimide compound in which a subcomponent is in an inactive state with respect to an alkoxysilane compound, and contains 55 to 85% by volume of the thermally conductive filler. A thermally conductive resin composition contains an addition reaction type silicone resin, an alkoxysilane compound, a thermally conductive filler, and a carbodiimide compound in which a subcomponent is in an inactive state with respect to the alkoxysilane compound, and exhibits thermal conductivity of 5 W/m*K or more after curing.
Dielectric-heating bonding film and bonding method using dielectric-heating bonding film
A dielectric welding film capable of achieving a tight welding through a short period of dielectric heating, and a welding method using the dielectric welding film are provided. The dielectric welding film is configured to weld a pair of adherends of the same material or different materials through dielectric heating, the dielectric welding film including a thermoplastic resin as an A component and a dielectric filler as a B component and satisfying the conditions (i) and (ii): (i) a melting point or softening point measured in accordance with JIS K 7121 (1987) is in a range from 80 to 200 degrees C.; and (ii) heat of fusion measured in accordance with JIS K 7121 (1987) is in a range from 1 to 80 J/g.
POLYMER-CERAMIC COMPOSITE HOUSINGS AND HOUSING COMPONENTS FOR PORTABLE ELECTRONIC DEVICES
The present disclosure includes thin, high-stiffness laminates, portable electronic device housings including the same, and methods for making such laminates and portable electronic device housings. Some laminates include an inner section having one or more first laminae and one or more second laminae, and first and second outer sections disposed on opposing sides of the inner section, each having one or more third laminae The laminate has a width and a length that is perpendicular to the width. Each of the first lamina(e) can have fibers aligned in a direction parallel to the length, each of the second lamina(e) can have fibers aligned in a direction parallel to the width, and each of the third lamina(e) can have fibers aligned in a direction angnlarly disposed at an angle of at least 10 degrees to each of the length and the width.
METHOD AND COMPOSITION FOR INCREASING THE ELECTRICAL AND THERMAL CONDUCTIVITY OF A TEXTITLE ARTICLE AND TEXTILE ARTICLE THUS OBTAINED
Method and composition for increasing the electrical and thermal conductivity of a textile article comprising the application of a composition comprising graphene and an inorganic pigment, so as to form a layer that consists of a thermal circuit for optimal management of heat and an electrical circuit for dissipation of the static electricity accumulated on the textile article.
COATED ARAMID PULP FOR RUBBER REINFORCEMENT
The presently claimed invention relates to aramid pulp comprising a plurality of fibrils having a coating of polyalkyleneimine disposed thereon. The presently claimed invention further relates to a method of coating the aramid pulp with polyalkyleneimine. The presently claimed invention also relates to a rubber composition comprising the coated aramid pulp and rubber as well as to a method for preparing the rubber composition.
ETHYLENE/alpha-OLEFIN COPOLYMER COMPOSITION AND APPLICATION THEREOF
An object of the present invention is to obtain a composition having, for example, improved anti-sagging properties, pigment dispersibility, and crack resistance, and the present invention relates to an ethylene/α-olefin copolymer composition including: an ethylene/α-olefin copolymer (A) satisfying requirements (a-1) to (a-3) described below; one or more selected from a color material (D), a resin (E) and an oil (F); and a solvent (C), (a-1) a methyl group index measured by .sup.1H-NMR is in a range of 40 to 60%, (a-2) a weight average molecular weight (Mw) determined by gel permeation chromatography (GPC) is in a range of 3,000 to 30,000, (a-3) no melting peak is observed at temperatures ranging from −100° C. to 150° C. in differential scanning calorimetry (DSC).