Various embodiments of the teachings herein include a solid insulation material based on a resin containing epoxy groups for production of an anhydride-free insulation system by means of VPI. The material comprises: an anhydride-free curing catalyst; and an additive for improving distribution of the anhydride-free curing catalyst, wherein the additive comprises a phenyl carboxylate. The additive is present in an amount based on the epoxy groups in the resin containing epoxy groups which is present in the impregnating agent of at least 0.1% in stoichiometric terms.

Various embodiments of the teachings herein include a solid insulation material based on a resin containing epoxy groups for production of an anhydride-free insulation system by means of VPI. The material comprises: an anhydride-free curing catalyst; and an additive for improving distribution of the anhydride-free curing catalyst, wherein the additive comprises a phenyl carboxylate. The additive is present in an amount based on the epoxy groups in the resin containing epoxy groups which is present in the impregnating agent of at least 0.1% in stoichiometric terms.

Various embodiments of the teachings herein include a solid insulation material based on a resin containing epoxy groups for production of an anhydride-free insulation system by means of VPI. The material comprises: an anhydride-free curing catalyst; and an additive for improving distribution of the anhydride-free curing catalyst, wherein the additive comprises a phenyl carboxylate. The additive is present in an amount based on the epoxy groups in the resin containing epoxy groups which is present in the impregnating agent of at least 0.1% in stoichiometric terms.

Disclosed is a polymeric composition containing at least 95 wt. % of a polypropylene copolymer; and 50 ppm to 2000 ppm of an aryl amide containing clarifying agent or a phosphate ester salt containing clarifying agent or a combination thereof, wherein the polymeric composition has a haze value of A after being extruded once and a haze value of B after being extruded 5 times, wherein the ratio of A to B is 1 to 1.35 and A is less than 25%, and wherein A and B are determined in accordance with ASTM D1003, at a thickness of about 40 mil, methods of making the polymeric composition and articles containing the polymeric composition.

Disclosed is a polymeric composition containing at least 95 wt. % of a polypropylene copolymer; and 50 ppm to 2000 ppm of an aryl amide containing clarifying agent or a phosphate ester salt containing clarifying agent or a combination thereof, wherein the polymeric composition has a haze value of A after being extruded once and a haze value of B after being extruded 5 times, wherein the ratio of A to B is 1 to 1.35 and A is less than 25%, and wherein A and B are determined in accordance with ASTM D1003, at a thickness of about 40 mil, methods of making the polymeric composition and articles containing the polymeric composition.

There are provided a pellet type polypropylene resin composition that exhibits excellent heat resistance and oxidation stability, and exhibits high flow without using a decomposition accelerator, and thus, can be used to prepare fine denier fiber, and a method for preparing the same.

There are provided a pellet type polypropylene resin composition that exhibits excellent heat resistance and oxidation stability, and exhibits high flow without using a decomposition accelerator, and thus, can be used to prepare fine denier fiber, and a method for preparing the same.

The present invention relates to a polyolefin resin composition containing at least: (A) 100 parts by mass of a polyolefin resin, (B) 0.01 to 5 parts by mass of a compound having at least one (meth)acrylate group, and one hydrogen bonding group or one (meth)acrylate group, and (C) 0.01 to 5 parts by mass of an organic peroxide.

The present invention relates to a polyolefin resin composition containing at least: (A) 100 parts by mass of a polyolefin resin, (B) 0.01 to 5 parts by mass of a compound having at least one (meth)acrylate group, and one hydrogen bonding group or one (meth)acrylate group, and (C) 0.01 to 5 parts by mass of an organic peroxide.

A photoresist underlayer composition comprising a poly(arylene ether); an additive of formula (14):

D-(L.sup.1-Ar—[X].sub.n).sub.m  (14); and

a solvent, wherein, in formula (14), D is a substituted or unsubstituted C.sub.1-60 organic group, optionally wherein D is an organic acid salt of the substituted or unsubstituted C.sub.1-60 organic group; each L.sup.1 is independently a single bond or a divalent linking group, when L.sup.1 is a single bond, D may be a substituted or unsubstituted C.sub.3-30 cycloalkyl or substituted or unsubstituted C.sub.1-20 heterocycloalkyl that is optionally fused with Ar, each Ar is independently a monocyclic or polycyclic C.sub.5-60 aromatic group, each X is independently —OR.sup.30, —SR.sup.31, or —NR.sup.32R.sup.33, m is an integer of 1 to 6, each n is independently an integer of 0 to 5, provided that a sum of all n is 2 or greater, and R.sup.30 to R.sup.33 are as provided herein.