Patent classifications
C08K5/1515
ACRYLIC DAMPING ADHESIVE AND DIAPHRAGM MEMBRANE FOR MICRO-SPEAKERS
The present invention provides an acrylic damping adhesive. The acrylic damping adhesive comprises a crosslinked structure of a carboxy-containing acrylic polymer with a glass transition temperature less than or equal to −20° C. and a carboxy-containing acrylic polymer with a glass transition temperature ranging from 20° C. to 50° C. The acrylic damping adhesive according to technical solutions of the present invention exhibits double damping peaks in a rheological curve, and thus has a wider damping temperature range (the damping temperature range is greater than or equal to 50° C., and preferably greater than or equal to 90° C.), a higher frequency response of damping, and higher system stability.
Adhesive Composition for Decorative Film
One embodiment of the present invention relates to an adhesive composition for a decorative film, a decorative film, or a decorative molded body. The adhesive composition for a decorative film contains a (meth)acrylic polymer (A) that satisfies (I) and (II) below, has a weight-average molecular weight of 300,000 or less as measured by gel permeation chromatography, and has a glass transition temperature of higher than 0° C. and lower than 50° C. as determined from a peak temperature of tan δ measured by dynamic mechanical analysis. Relative to a total of 100 mass % of the (meth)acrylic polymer (A) and a (meth)acrylic polymer (Ah) having a glass transition temperature of 50° C. or higher, a percentage content of the (meth)acrylic polymer (Ah) is less than 25 mass %. (I) The (meth)acrylic polymer (A) is a polymer of a monomer component that contains 19 mass % or more of a monomer (a1) that does not have a crosslinkable functional group. (II) A homopolymer of the monomer (a1) has a glass transition temperature of 0° C. or higher.
Adhesive Composition for Decorative Film
One embodiment of the present invention relates to an adhesive composition for a decorative film, a decorative film, or a decorative molded body. The adhesive composition for a decorative film contains a (meth)acrylic polymer (A) that satisfies (I) and (II) below, has a weight-average molecular weight of 300,000 or less as measured by gel permeation chromatography, and has a glass transition temperature of higher than 0° C. and lower than 50° C. as determined from a peak temperature of tan δ measured by dynamic mechanical analysis. Relative to a total of 100 mass % of the (meth)acrylic polymer (A) and a (meth)acrylic polymer (Ah) having a glass transition temperature of 50° C. or higher, a percentage content of the (meth)acrylic polymer (Ah) is less than 25 mass %. (I) The (meth)acrylic polymer (A) is a polymer of a monomer component that contains 19 mass % or more of a monomer (a1) that does not have a crosslinkable functional group. (II) A homopolymer of the monomer (a1) has a glass transition temperature of 0° C. or higher.
ADHESIVE SHEET
Provided is a pressure-sensitive adhesive sheet capable of allowing a small electronic part (e.g., a chip having a size of 50 μm/□ or less) to be temporarily fixed in a satisfactory manner and satisfactorily peeled. The pressure-sensitive adhesive sheet of the present invention includes a gas-generating layer configured to generate a gas by being irradiated with laser light, wherein a modulus of elasticity Er(gas) [unit: MPa] of the gas-generating layer measured by a nanoindentation method and a thickness h(gas) [unit: μm] thereof satisfy the following expression (1):
Log(Er(gas)×10.sup.6)≥8.01×h(gas).sup.−0.116 (1).
In one embodiment, the pressure-sensitive adhesive sheet has a transmittance of from 0% to 35% for light having a wavelength of 360 nm. In one embodiment, the pressure-sensitive adhesive sheet has a transmittance of from 10% to 100% for light having a wavelength of 380 nm.
ADHESIVE SHEET
Provided is a pressure-sensitive adhesive sheet capable of allowing a small electronic part (e.g., a chip having a size of 50 μm/□ or less) to be temporarily fixed in a satisfactory manner and satisfactorily peeled. The pressure-sensitive adhesive sheet of the present invention includes a gas-generating layer configured to generate a gas by being irradiated with laser light, wherein a modulus of elasticity Er(gas) [unit: MPa] of the gas-generating layer measured by a nanoindentation method and a thickness h(gas) [unit: μm] thereof satisfy the following expression (1):
Log(Er(gas)×10.sup.6)≥8.01×h(gas).sup.−0.116 (1).
In one embodiment, the pressure-sensitive adhesive sheet has a transmittance of from 0% to 35% for light having a wavelength of 360 nm. In one embodiment, the pressure-sensitive adhesive sheet has a transmittance of from 10% to 100% for light having a wavelength of 380 nm.
ADHESIVE COMPOSITION AND RUBBER REINFORCING MATERIAL
The present invention relates to an adhesive composition including a latex (A), a polyurethane (B), an amine-based adhesion promoter (C), and a water-containing solvent (G). The composition is eco-friendly, has a low risk of fire, and has excellent adhesive strength.
ADHESIVE COMPOSITION AND RUBBER REINFORCING MATERIAL
The present invention relates to an adhesive composition including a latex (A), a polyurethane (B), an amine-based adhesion promoter (C), and a water-containing solvent (G). The composition is eco-friendly, has a low risk of fire, and has excellent adhesive strength.
MODIFIED ASPHALT USING EPOXIDE-CONTAINING POLYMERS
A polymer-modified asphalt composition comprises or is produced from asphalt and a high-melt flow index ethylene co/terpolymer comprising copolymerized units derived from ethylene, an epoxy-containing comonomers, and optionally a third monomer selected from the group consisting of acrylates, methacrylates, vinyl esters, and the like. The modified asphalt composition may further comprise a nonreactive polymer, such as a styrene/conjugated-diene block copolymer, and a co-reactant, such as an acid or an acid anhydride. Further provided are processes for producing the polymer-modified asphalt composition, and paving and roofing materials that comprise the polymer-modified asphalt composition.
MODIFIED ASPHALT USING EPOXIDE-CONTAINING POLYMERS
A polymer-modified asphalt composition comprises or is produced from asphalt and a high-melt flow index ethylene co/terpolymer comprising copolymerized units derived from ethylene, an epoxy-containing comonomers, and optionally a third monomer selected from the group consisting of acrylates, methacrylates, vinyl esters, and the like. The modified asphalt composition may further comprise a nonreactive polymer, such as a styrene/conjugated-diene block copolymer, and a co-reactant, such as an acid or an acid anhydride. Further provided are processes for producing the polymer-modified asphalt composition, and paving and roofing materials that comprise the polymer-modified asphalt composition.
Composition for dip molding
A glove including a cured film of an elastomer containing a (meth)acrylonitrile-derived structural unit, an unsaturated carboxylic acid-derived structural unit and a butadiene-derived structural unit in a polymer main chain, wherein the elastomer contains 20 to 40% by weight of a (meth)acrylonitrile-derived structural unit, 1 to 10% by weight of an unsaturated carboxylic acid-derived structural unit and 50 to 75% by weight of a butadiene-derived structural unit, and has a crosslinked structure of a carboxyl group in the unsaturated carboxylic acid-derived structural unit with an epoxy crosslinker containing an epoxy compound having three or more epoxy groups in one molecule.