Provided is an encapsulating composition and an organic electronic device comprising the same. The encapsulating composition can effectively block moisture or oxygen from being introduced into an organic electronic device from the outside. The encapsulating composition can secure the lifetime of the organic electronic device, make it possible to realize a top emission type organic electronic device, is applicable to an inkjet method and can provide a thin display.

Provided is an encapsulating composition and an organic electronic device comprising the same. The encapsulating composition can effectively block moisture or oxygen from being introduced into an organic electronic device from the outside. The encapsulating composition can secure the lifetime of the organic electronic device, make it possible to realize a top emission type organic electronic device, is applicable to an inkjet method and can provide a thin display.

Provided is an encapsulating composition and an organic electronic device comprising the same. The encapsulating composition can effectively block moisture or oxygen from being introduced into an organic electronic device from the outside. The encapsulating composition can secure the lifetime of the organic electronic device, make it possible to realize a top emission type organic electronic device, is applicable to an inkjet method and can provide a thin display.

A method of producing a patterned substrate includes the steps of: providing, on a substrate, a coating film of a resin composition including (A) an alkali-soluble resin selected from the group consisting of polyimides, polyamideimides, polyimide precursors, polyamideimide precursors, polybenzoxazoles, polybenzoxazole precursors, copolymers of at least two of the resins, and copolymers of at least one of the resins and another structural unit, (B) a photoacid generator, and (C) at least one compound selected from the group consisting of epoxy compounds and oxetane compounds; forming a pattern of the coating film; patterning the substrate through etching using the pattern of the coating film as a mask; and removing the coating film of the resin composition.

A method of producing a patterned substrate includes the steps of: providing, on a substrate, a coating film of a resin composition including (A) an alkali-soluble resin selected from the group consisting of polyimides, polyamideimides, polyimide precursors, polyamideimide precursors, polybenzoxazoles, polybenzoxazole precursors, copolymers of at least two of the resins, and copolymers of at least one of the resins and another structural unit, (B) a photoacid generator, and (C) at least one compound selected from the group consisting of epoxy compounds and oxetane compounds; forming a pattern of the coating film; patterning the substrate through etching using the pattern of the coating film as a mask; and removing the coating film of the resin composition.

The present invention relates to a composition comprising: a) at least one primary, secondary or tertiary amine and b) at least one agent which masks the odor of said at least one amine, said at least one odor-masking agent comprising at least one ether (b1), optionally, but preferably, at least one terpene and/or one terpenoid (b2) and optionally, but preferably, at least one oxime (b3). The invention also relates to the use of an odor-masking agent in order to mask the odor of at least one amine.

The present invention relates to a composition comprising: a) at least one primary, secondary or tertiary amine and b) at least one agent which masks the odor of said at least one amine, said at least one odor-masking agent comprising at least one ether (b1), optionally, but preferably, at least one terpene and/or one terpenoid (b2) and optionally, but preferably, at least one oxime (b3). The invention also relates to the use of an odor-masking agent in order to mask the odor of at least one amine.

A method of producing a patterned substrate includes the steps of: providing, on a substrate, a coating film of a resin composition including (A) an alkali-soluble resin selected from the group consisting of polyimides, polyamideimides, polyimide precursors, polyamideimide precursors, polybenzoxazoles, polybenzoxazole precursors, copolymers of at least two of the resins, and copolymers of at least one of the resins and another structural unit, (B) a photoacid generator, and (C) at least one compound selected from the group consisting of epoxy compounds and oxetane compounds; forming a pattern of the coating film; patterning the substrate through etching using the pattern of the coating film as a mask; and removing the coating film of the resin composition.

The present disclosure provides a hard-coating resin composition for a hard-coating having easy processability, flexibility and high surface hardness suitable for a hard-coating agent, in which a siloxane molecule having an inorganic material characteristic is chemically bonded with an epoxy group having an organic material characteristic to form one molecule, and the siloxane molecule is made to contain a various molecular weight distribution for dense crosslinking during polymerization of the epoxy group in order to obtain high surface hardness due to the inorganic material.

The present disclosure provides a hard-coating resin composition for a hard-coating having easy processability, flexibility and high surface hardness suitable for a hard-coating agent, in which a siloxane molecule having an inorganic material characteristic is chemically bonded with an epoxy group having an organic material characteristic to form one molecule, and the siloxane molecule is made to contain a various molecular weight distribution for dense crosslinking during polymerization of the epoxy group in order to obtain high surface hardness due to the inorganic material.