An adhesive article comprising first and second tacky latent adhesive layers disposed on respective first and second opposed major surfaces of a substrate. Each of the first and second tacky latent adhesive layers independently comprises at least one polymerizable component, and a redox initiator system comprising a transition metal complex that participates in a redox cycle, an oxidizing agent, and a blocked reducing agent represented by the formula ((I). Each of R.sup.1 and R.sup.2 are independently H, an alkyl, an aryl, or RPhoto5 with the proviso that at least one of R1 and R.sup.2 is RPhoto. R.sup.Photo represents a photoremovable group. Each of R.sup.3 and R.sup.4 independently represents H, an alkyl group, or an aryl group comprising a monovalent ester, ether, urethane, or carbonate group. Methods of making and using the adhesive articles are also disclosed. ##STR00001##

The present invention pertains to a ferroelectric fluoropolymer, to a process for manufacturing said fluoropolymer and to uses of said fluoropolymer in electric and/or electronic applications.

The present invention pertains to a ferroelectric fluoropolymer, to a process for manufacturing said fluoropolymer and to uses of said fluoropolymer in electric and/or electronic applications.

A subject-matter of the present invention are new complexes comprising cyclic alkylene carbonates and polyamides, processes for their preparation and uses. Additionally, a subject-matter of the invention is the use of alkylene carbonates for recycling, solubilization, purification, and/or powdering of polyamide-based materials.

A subject-matter of the present invention are new complexes comprising cyclic alkylene carbonates and polyamides, processes for their preparation and uses. Additionally, a subject-matter of the invention is the use of alkylene carbonates for recycling, solubilization, purification, and/or powdering of polyamide-based materials.

A low-VOC, two-component polyurethane adhesive is provided. The polyurethane adhesive has an A-side that includes an isocyanate and a non-reactive plasticizer, and a B-side that includes an aliphatic polyester polyol, a non-polyester polyol, and a urethane catalyst. The A-side and the B-side are reacted at a volume ratio of 1:1 and formulated at an NCO/OH index within the range of 0.90 to 1.10. The polyurethane adhesive is solvent-free and is particularly suitable for adhering a polymeric membrane to a substrate.

An easily water-disintegrable adhesive composition contains a 2-cyanoacrylate compound and a water-soluble compound, and wherein a cured product of the adhesive composition has a water absorption rate of 5% or higher when immersed in 40° C. water for 24 hours. The cured product of the adhesive composition preferably has a water absorption rate of 5% or higher when immersed in 23° C. water for 24 hours.

An easily water-disintegrable adhesive composition contains a 2-cyanoacrylate compound and a water-soluble compound, and wherein a cured product of the adhesive composition has a water absorption rate of 5% or higher when immersed in 40° C. water for 24 hours. The cured product of the adhesive composition preferably has a water absorption rate of 5% or higher when immersed in 23° C. water for 24 hours.

A low-VOC, two-component polyurethane adhesive is provided. The polyurethane adhesive has an A-side that includes an isocyanate and a non-reactive plasticizer, and a B-side that includes an aliphatic polyester polyol, a non-polyester polyol, and a urethane catalyst. The A-side and the B-side are reacted at a volume ratio of 1:1 and formulated at an NCO/OH index within the range of 0.90 to 1.10. The polyurethane adhesive is solvent-free and is particularly suitable for adhering a polymeric membrane to a substrate.

The present invention provides a composition capable of reducing adhesion of biofilms and therefore useful for producing a molded body. The composition comprises at least one resin (A) selected from the group consisting of thermoplastic resins and thermosetting resins, and a quorum sensing inhibitor (B), and is configured such that a common logarithm log S of solubility of the quorum sensing inhibitor (B) in water of 25° C. is less than 0.1, and Ra.sub.1 is greater than 3.2 MPa.sup.1/2, provided that Ra.sub.1 is a distance between a Hansen solubility parameter of the at least one resin (A) selected from the group consisting of thermoplastic resins and thermosetting resins and a Hansen solubility parameter of the quorum sensing inhibitor (B).