A fluorine-containing elastomer composition comprising 0.4 to 4.0 parts by weight of a pigment that is a perylene-based compound, a naphthalenecarboxamide-based compound, a pyrimidinetrione-based compound, or a benzimidazolone-based compound, and 0.2 to 5.0 parts by weight of a bisamidoxime compound or 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane, based on 100 parts by weight of a fluorine-containing elastomer having a copolymer composition of (A) 60.0 to 80.0 mol % of tetrafluoroethylene, (B) 19.8 to 39.8 mol % of perfluoro(lower alkyl vinyl ether) or perfluoro(lower alkoxy lower alkyl vinyl ether), and (C) 0.2 to 5.0 mol % of a perfluoro unsaturated nitrile compound.

The present invention has an object of providing a laminate which is composed of a layer containing a melt shapable fluororesin and a layer of an ethylene-?-olefin-nonconjugated polyene copolymer composition, and is excellent in adhesiveness, and the present invention relates to a laminate including: a layer including an ethylene-?-olefin-nonconjugated polyene copolymer composition, and a layer comprising a melt shapable fluororesin; wherein the ethylene-?-olefin-nonconjugated polyene copolymer composition includes 100 parts by mass of an ethylene-?-olefin-nonconjugated polyene copolymer (A), 1.0 to 6.0 parts by mass of at least one compound (C) selected from the group consisting of 1,8-diazabicyclo(5.4.0)undecene-7 salts, 1,5-diazabicyclo(4.3.0)nonene-5 salts, 1,8-diazabicyclo(5.4.0)undecene-7 and 1,5-diazabicyclo(4.3.0)nonene-5, and 3 to 20 parts by mass of magnesium oxide.

The present invention is directed to a reactive dye-dyeable polyurethane-urea elastic yarn including a reaction product of at least two polyols, a diisocyanate compound, a diamine chain extender, an amine chain terminator, and a diethylenetriamine compound, wherein one of the polyols is polyethylene glycol, which is included in an amount of 20 to 30.0 mol % based on the total amount of the polyols, a polyurethane-urea polymer includes 10 meq/kg to 45 meq/kg of primary amine ends, and the capping ratio (CR) of the diisocyanate to the polyols is 1.8 to 2.0.

The present application describes a microcapsule comprising: (i) a lipophilic core material, and (ii) a microcapsule shell, wherein microcapsule shell formed from oil-in-water emulsion polymerisation of monomer mixture consisting essentially of: (a) greater than 70 to about 99% by weight of at least one polyfunctional ethylenically unsaturated monomer, (b) about 1 to about 30% by weight of at least one unsaturated carboxylic acid monomer or its ester, and (c) about 0 to about 30% by weight of at least one vinyl monomer. Also provides process for preparing the same and its method of use in various applications.

The present invention relates to a polyamide composition which is dyed in black, comprising a chromium-containing azo dye in the form of a 1:2 chromium complex, to the production of such a polyamide composition and to the use thereof for the preparation of polyamide molded bodies and fibers, which are dyed in black. The invention further relates to a method for laser welding using at least one molding part on the basis of such a polyamide composition.

An object of the present invention is to provide a resin composition capable of suppressing surface roughness in a thin film portion and maintaining insulation reliability of a thin film portion, a cured relief pattern of the resin composition, and a method for manufacturing a semiconductor electronic component or a semiconductor equipment using the cured relief pattern. The constitution of the present invention for achieving the above-mentioned object is as follows. That is, the present invention provides a resin composition containing: (a) at least one resin selected from an alkali-soluble polyimide, an alkali-soluble polybenzoxazole, an alkali-soluble polyamide-imide, precursors thereof, and copolymers thereof; and (b) an alkali-soluble phenol resin, wherein a ratio (R.sub.b/R.sub.a) between an alkali dissolution rate (R.sub.a) of the resin (a) and an alkali dissolution rate (R.sub.b) of the resin (b) satisfies a relationship of 0.5R.sub.b/R.sub.a2.0. The present invention also provides a cured relief pattern of the resin composition, and a method for manufacturing a semiconductor electronic component or a semiconductor equipment using the cured relief pattern.

An object of the present invention is to provide a resin composition capable of suppressing surface roughness in a thin film portion and maintaining insulation reliability of a thin film portion, a cured relief pattern of the resin composition, and a method for manufacturing a semiconductor electronic component or a semiconductor equipment using the cured relief pattern. The constitution of the present invention for achieving the above-mentioned object is as follows. That is, the present invention provides a resin composition containing: (a) at least one resin selected from an alkali-soluble polyimide, an alkali-soluble polybenzoxazole, an alkali-soluble polyamide-imide, precursors thereof, and copolymers thereof; and (b) an alkali-soluble phenol resin, wherein a ratio (R.sub.b/R.sub.a) between an alkali dissolution rate (R.sub.a) of the resin (a) and an alkali dissolution rate (R.sub.b) of the resin (b) satisfies a relationship of 0.5R.sub.b/R.sub.a2.0. The present invention also provides a cured relief pattern of the resin composition, and a method for manufacturing a semiconductor electronic component or a semiconductor equipment using the cured relief pattern.

Disclosed herein are a black photosensitive resin composition and a black column spacer prepared therefrom. The black photosensitive resin composition may form a cured film exhibiting good adhesion to a substrate, good height difference property, good surface roughness and high light shielding property (optical density), and may be effectively used for the formation of a cured film, particularly a black column spacer, of a liquid crystal display (LCD) or an organic light-emitting diode (OLED) display.

An inkjet aqueous pigment dispersion which achieves high pigment concentration, exhibits favorable redispersion properties after drying, and does not exhibit changes in ink properties even when stored for a long time; and an ink composition using the aqueous pigment dispersion. The inkjet aqueous pigment dispersion contains a pigment, a liquid medium, and a polymer dispersion agent which is an A-B block polymer obtained by copolymerization using a mixture of an organic tellurium compound represented by formula (1) and an organic ditellurium compound represented by formula (2) as a polymerization initiator. The monomer for configuring the A block is at least one type of monomer represented by formula (3), and the monomer for configuring the B block is benzyl methacrylate and/or benzyl acrylate. ##STR00001##

The present invention describes a pigment dispersion and a printing ink and coating employing the pigment dispersion. The pigment dispersion includes a pigment, binder and solvent. The pigment dispersion has a mean particle size less than about 120 nm. The printing ink or coating includes the pigment dispersion in addition to a solvent. The printing ink or coating has a solid binder to pigment ratio greater than about 1.5.