Patent classifications
C08K5/28
BITUMEN GRANULES WHICH ARE SOLID AT AMBIENT TEMPERATURE
Bitumen granules including at least: bitumen, a compound of general formula R1-(COOH)z (I), a compound of general formula R2-(NH)nCONH—X—(NHCO)p(NH)n-R3 (II), and a compound of general formula Ar1-R-Ar2 (III); and a method for producing the bitumen granules and to the use thereof as asphalt binder.
Compositions and methods for fabricating coatings
Aspects of the present disclosure provide coatings and methods for depositing coatings onto surfaces. In one aspect, a method for forming a coating includes applying a composition to a surface of a component, the composition including a first polymer, a second polymer that is a fluoropolymer, an isocyanate, and a curative. The method includes curing the mixture at a first temperature of about 50° C. or greater and increasing the first temperature to a second temperature of about 80° C. or greater. The method includes obtaining a coating disposed on the surface of the component, the coating having a thickness of from about 10 mils to about 50 mils and a void density of less than 5 voids of size 0.5 mm or greater per cm.sup.2.
Compositions and methods for fabricating coatings
Aspects of the present disclosure provide coatings and methods for depositing coatings onto surfaces. In one aspect, a method for forming a coating includes applying a composition to a surface of a component, the composition including a first polymer, a second polymer that is a fluoropolymer, an isocyanate, and a curative. The method includes curing the mixture at a first temperature of about 50° C. or greater and increasing the first temperature to a second temperature of about 80° C. or greater. The method includes obtaining a coating disposed on the surface of the component, the coating having a thickness of from about 10 mils to about 50 mils and a void density of less than 5 voids of size 0.5 mm or greater per cm.sup.2.
PHOTOSENSITIVE RESIN COMPOSITION AND ORGANIC EL ELEMENT PARTITION WALL
The present invention reduces inhibition of light sensitization of a photosensitive resin composition containing a black dye and increases sensitivity by improving pattern forming ability. The photosensitive resin composition according to one embodiment of the present invention contains a binder resin (A), a radiation-sensitive compound (B), and a dye (C), wherein the dye (C) contains a black dye (C1) and a dye (C2) other than (C1), the dye (C2) has an absorption maximum at a wavelength of 480-550 nm in an wavelength range of 300-800 nm, and, when the absorbance of the dye (C2) at the absorption maximum wavelength is defined as Abs1 and the average absorbance of the dye (C2) at wavelengths 560-600 nm is defined as Abs2, Abs2/Abs1 equals 0.1-1.0.
PHOTOSENSITIVE RESIN COMPOSITION AND ORGANIC EL ELEMENT PARTITION WALL
The present invention reduces inhibition of light sensitization of a photosensitive resin composition containing a black dye and increases sensitivity by improving pattern forming ability. The photosensitive resin composition according to one embodiment of the present invention contains a binder resin (A), a radiation-sensitive compound (B), and a dye (C), wherein the dye (C) contains a black dye (C1) and a dye (C2) other than (C1), the dye (C2) has an absorption maximum at a wavelength of 480-550 nm in an wavelength range of 300-800 nm, and, when the absorbance of the dye (C2) at the absorption maximum wavelength is defined as Abs1 and the average absorbance of the dye (C2) at wavelengths 560-600 nm is defined as Abs2, Abs2/Abs1 equals 0.1-1.0.
Self-foaming hot melt adhesive compositions and methods of making and using same
The present invention relates to self-foaming hot melt adhesive compositions and methods of making and using the same. Self-foaming hot melt adhesive compositions are formed by admixing a dispersion concentrate including a chemical blowing agent and a compatible carrier (liquid or molten) with a molten base hot melt adhesive composition at a temperature below the decomposition temperature of the chemical blowing agent. The resolidified material is processed through a device that heats the material above the decomposition temperature of the chemical agent and cools it below such temperature before being dispensed. The device preferably includes sensors and a controller configured to prevent the material from accumulating an adverse thermal history during processing.
Self-foaming hot melt adhesive compositions and methods of making and using same
The present invention relates to self-foaming hot melt adhesive compositions and methods of making and using the same. Self-foaming hot melt adhesive compositions are formed by admixing a dispersion concentrate including a chemical blowing agent and a compatible carrier (liquid or molten) with a molten base hot melt adhesive composition at a temperature below the decomposition temperature of the chemical blowing agent. The resolidified material is processed through a device that heats the material above the decomposition temperature of the chemical agent and cools it below such temperature before being dispensed. The device preferably includes sensors and a controller configured to prevent the material from accumulating an adverse thermal history during processing.
Fluoroelastomer composition
The invention pertains to a composition based on a fluoroelastomer comprising nitrile or carboxylate-type cure sites and including a curing agent and a Br-containing marker having reactivity towards the said cure-sites, which can be cured so as to deliver cured parts maintaining chemically bound bromine atoms; this material, when submitted to wear/damage would hence release Br-containing contaminants, which can easily spotted via notably an on-line mass spectrometer, so as to monitor and anticipate critical failures of sealing materials based there upon.
Fluoroelastomer composition
The invention pertains to a composition based on a fluoroelastomer comprising nitrile or carboxylate-type cure sites and including a curing agent and a Br-containing marker having reactivity towards the said cure-sites, which can be cured so as to deliver cured parts maintaining chemically bound bromine atoms; this material, when submitted to wear/damage would hence release Br-containing contaminants, which can easily spotted via notably an on-line mass spectrometer, so as to monitor and anticipate critical failures of sealing materials based there upon.
UV CROSSLINKING OF PVDF-BASED POLYMERS FOR GATE DIELECTRIC INSULATORS OF ORGANIC THIN-FILM TRANSISTORS
A method includes preparing a mixture having an organic solvent, a fluorine-containing polymer, at least one organic base, and a crosslinker component; depositing the mixture over a substrate to form a first layer; and crosslinking the first layer by light treatment to form a crosslinked gate dielectric layer, such that the fluorine-containing polymer is at least one of homopolymers of vinylidene fluoride or copolymers of vinylidene fluoride with fluorine-containing ethylenic monomers. A transistor includes a crosslinked gate dielectric layer disposed over a substrate; an organic semiconductor layer disposed over the substrate and being in direct contact with the crosslinked gate dielectric layer; a source and a drain in contact with the organic semiconductor layer and defining the ends of a channel through the organic semiconductor layer; and a gate superposed with the channel, such that the crosslinked gate dielectric layer separates the gate from the organic semiconductor layer.