C08K5/28

BITUMEN GRANULES WHICH ARE SOLID AT AMBIENT TEMPERATURE
20220017751 · 2022-01-20 · ·

Bitumen granules including at least: bitumen, a compound of general formula R1-(COOH)z (I), a compound of general formula R2-(NH)nCONH—X—(NHCO)p(NH)n-R3 (II), and a compound of general formula Ar1-R-Ar2 (III); and a method for producing the bitumen granules and to the use thereof as asphalt binder.

Compositions and methods for fabricating coatings
11214707 · 2022-01-04 · ·

Aspects of the present disclosure provide coatings and methods for depositing coatings onto surfaces. In one aspect, a method for forming a coating includes applying a composition to a surface of a component, the composition including a first polymer, a second polymer that is a fluoropolymer, an isocyanate, and a curative. The method includes curing the mixture at a first temperature of about 50° C. or greater and increasing the first temperature to a second temperature of about 80° C. or greater. The method includes obtaining a coating disposed on the surface of the component, the coating having a thickness of from about 10 mils to about 50 mils and a void density of less than 5 voids of size 0.5 mm or greater per cm.sup.2.

Compositions and methods for fabricating coatings
11214707 · 2022-01-04 · ·

Aspects of the present disclosure provide coatings and methods for depositing coatings onto surfaces. In one aspect, a method for forming a coating includes applying a composition to a surface of a component, the composition including a first polymer, a second polymer that is a fluoropolymer, an isocyanate, and a curative. The method includes curing the mixture at a first temperature of about 50° C. or greater and increasing the first temperature to a second temperature of about 80° C. or greater. The method includes obtaining a coating disposed on the surface of the component, the coating having a thickness of from about 10 mils to about 50 mils and a void density of less than 5 voids of size 0.5 mm or greater per cm.sup.2.

PHOTOSENSITIVE RESIN COMPOSITION AND ORGANIC EL ELEMENT PARTITION WALL
20220275241 · 2022-09-01 · ·

The present invention reduces inhibition of light sensitization of a photosensitive resin composition containing a black dye and increases sensitivity by improving pattern forming ability. The photosensitive resin composition according to one embodiment of the present invention contains a binder resin (A), a radiation-sensitive compound (B), and a dye (C), wherein the dye (C) contains a black dye (C1) and a dye (C2) other than (C1), the dye (C2) has an absorption maximum at a wavelength of 480-550 nm in an wavelength range of 300-800 nm, and, when the absorbance of the dye (C2) at the absorption maximum wavelength is defined as Abs1 and the average absorbance of the dye (C2) at wavelengths 560-600 nm is defined as Abs2, Abs2/Abs1 equals 0.1-1.0.

PHOTOSENSITIVE RESIN COMPOSITION AND ORGANIC EL ELEMENT PARTITION WALL
20220275241 · 2022-09-01 · ·

The present invention reduces inhibition of light sensitization of a photosensitive resin composition containing a black dye and increases sensitivity by improving pattern forming ability. The photosensitive resin composition according to one embodiment of the present invention contains a binder resin (A), a radiation-sensitive compound (B), and a dye (C), wherein the dye (C) contains a black dye (C1) and a dye (C2) other than (C1), the dye (C2) has an absorption maximum at a wavelength of 480-550 nm in an wavelength range of 300-800 nm, and, when the absorbance of the dye (C2) at the absorption maximum wavelength is defined as Abs1 and the average absorbance of the dye (C2) at wavelengths 560-600 nm is defined as Abs2, Abs2/Abs1 equals 0.1-1.0.

Self-foaming hot melt adhesive compositions and methods of making and using same
11141748 · 2021-10-12 · ·

The present invention relates to self-foaming hot melt adhesive compositions and methods of making and using the same. Self-foaming hot melt adhesive compositions are formed by admixing a dispersion concentrate including a chemical blowing agent and a compatible carrier (liquid or molten) with a molten base hot melt adhesive composition at a temperature below the decomposition temperature of the chemical blowing agent. The resolidified material is processed through a device that heats the material above the decomposition temperature of the chemical agent and cools it below such temperature before being dispensed. The device preferably includes sensors and a controller configured to prevent the material from accumulating an adverse thermal history during processing.

Self-foaming hot melt adhesive compositions and methods of making and using same
11141748 · 2021-10-12 · ·

The present invention relates to self-foaming hot melt adhesive compositions and methods of making and using the same. Self-foaming hot melt adhesive compositions are formed by admixing a dispersion concentrate including a chemical blowing agent and a compatible carrier (liquid or molten) with a molten base hot melt adhesive composition at a temperature below the decomposition temperature of the chemical blowing agent. The resolidified material is processed through a device that heats the material above the decomposition temperature of the chemical agent and cools it below such temperature before being dispensed. The device preferably includes sensors and a controller configured to prevent the material from accumulating an adverse thermal history during processing.

Fluoroelastomer composition

The invention pertains to a composition based on a fluoroelastomer comprising nitrile or carboxylate-type cure sites and including a curing agent and a Br-containing marker having reactivity towards the said cure-sites, which can be cured so as to deliver cured parts maintaining chemically bound bromine atoms; this material, when submitted to wear/damage would hence release Br-containing contaminants, which can easily spotted via notably an on-line mass spectrometer, so as to monitor and anticipate critical failures of sealing materials based there upon.

Fluoroelastomer composition

The invention pertains to a composition based on a fluoroelastomer comprising nitrile or carboxylate-type cure sites and including a curing agent and a Br-containing marker having reactivity towards the said cure-sites, which can be cured so as to deliver cured parts maintaining chemically bound bromine atoms; this material, when submitted to wear/damage would hence release Br-containing contaminants, which can easily spotted via notably an on-line mass spectrometer, so as to monitor and anticipate critical failures of sealing materials based there upon.

UV CROSSLINKING OF PVDF-BASED POLYMERS FOR GATE DIELECTRIC INSULATORS OF ORGANIC THIN-FILM TRANSISTORS
20210226142 · 2021-07-22 ·

A method includes preparing a mixture having an organic solvent, a fluorine-containing polymer, at least one organic base, and a crosslinker component; depositing the mixture over a substrate to form a first layer; and crosslinking the first layer by light treatment to form a crosslinked gate dielectric layer, such that the fluorine-containing polymer is at least one of homopolymers of vinylidene fluoride or copolymers of vinylidene fluoride with fluorine-containing ethylenic monomers. A transistor includes a crosslinked gate dielectric layer disposed over a substrate; an organic semiconductor layer disposed over the substrate and being in direct contact with the crosslinked gate dielectric layer; a source and a drain in contact with the organic semiconductor layer and defining the ends of a channel through the organic semiconductor layer; and a gate superposed with the channel, such that the crosslinked gate dielectric layer separates the gate from the organic semiconductor layer.