The present invention pertains to semi-crystalline fluoropolymer [polymer (F)] comprising: recurring units derived from vinylidene fluoride (VDF); from 10% to 50% by moles [with respect to the total moles of recurring units of polymer (F)] of recurring units derived from trifluoroethylene (TrFE); and from 0.01% to 10% by moles [with respect to the total moles of recurring units of polymer (F)] of recurring units derived from at least one monomer comprising an azide group [monomer (Az)], to a process for its manufacture, to a crosslinkable composition comprising the same, to a process for crosslinking the same and to a method for manufacturing one of electrical and electronic devices using the same.

To provide a photosensitive resin composition which is capable of forming a pattern with high resolution and obtaining a cured film having excellent heat resistance and cracking resistance, and is also alkali developable; and a method capable of shortening the step required to remove a cured film of the composition after formation of an impurity region on a semiconductor substrate; and a method for manufacturing a semiconductor device using the same. Disclosed is a photosensitive resin composition including a polysiloxane (A).

To provide a photosensitive resin composition which is capable of forming a pattern with high resolution and obtaining a cured film having excellent heat resistance and cracking resistance, and is also alkali developable; and a method capable of shortening the step required to remove a cured film of the composition after formation of an impurity region on a semiconductor substrate; and a method for manufacturing a semiconductor device using the same. Disclosed is a photosensitive resin composition including a polysiloxane (A).

The present invention relates to novel polyimide polymers containing certain fluorinated diamine moieties, said polyimide polymers being characterized by excellent dielectric performances. The present invention also relates to the use of said polyimide-based polymers in polymer compositions in microelectronics applications.

The present invention relates to novel polyimide polymers containing certain fluorinated diamine moieties, said polyimide polymers being characterized by excellent dielectric performances. The present invention also relates to the use of said polyimide-based polymers in polymer compositions in microelectronics applications.

The present invention relates to novel polyimide polymers containing certain fluorinated diamine moieties, said polyimide polymers being characterized by excellent dielectric performances. The present invention also relates to the use of said polyimide-based polymers in polymer compositions in microelectronics applications.

The present invention relates to self-foaming hot melt adhesive compositions and methods of making and using the same. Self-foaming hot melt adhesive compositions are formed by admixing a dispersion concentrate including a chemical blowing agent and a compatible carrier (liquid or molten) with a molten base hot melt adhesive composition at a temperature below the decomposition temperature of the chemical blowing agent. The resolidified material is processed through a device that heats the material above the decomposition temperature of the chemical agent and cools it below such temperature before being dispensed. The device preferably includes sensors and a controller configured to prevent the material from accumulating an adverse thermal history during processing.

The present invention relates to self-foaming hot melt adhesive compositions and methods of making and using the same. Self-foaming hot melt adhesive compositions are formed by admixing a dispersion concentrate including a chemical blowing agent and a compatible carrier (liquid or molten) with a molten base hot melt adhesive composition at a temperature below the decomposition temperature of the chemical blowing agent. The resolidified material is processed through a device that heats the material above the decomposition temperature of the chemical agent and cools it below such temperature before being dispensed. The device preferably includes sensors and a controller configured to prevent the material from accumulating an adverse thermal history during processing.

Impact copolymer (ICP) compositions may include those having a melt strength (MS) and melt flow rate (MFR) described according to the formula: MS325MFR.sup.1.7, wherein the MS is greater than 1 cN. Methods of producing an impact copolymer (ICP) composition may include coupling the ICP composition with a coupling agent, wherein the ICP composition includes a matrix polymer and a dispersed component; wherein the ICP composition possesses a measurable melt strength (MS) and melt flow rate (MFR) satisfying the equation: MS325MFR.sup.1.7, wherein the MS is greater than 1 cN.

Impact copolymer (ICP) compositions may include those having a melt strength (MS) and melt flow rate (MFR) described according to the formula: MS325MFR.sup.1.7, wherein the MS is greater than 1 cN. Methods of producing an impact copolymer (ICP) composition may include coupling the ICP composition with a coupling agent, wherein the ICP composition includes a matrix polymer and a dispersed component; wherein the ICP composition possesses a measurable melt strength (MS) and melt flow rate (MFR) satisfying the equation: MS325MFR.sup.1.7, wherein the MS is greater than 1 cN.