A peroxide-curable polyolefin composition comprising a peroxide-curable polyolefin prepolymer, an organic peroxide, and 4-[[4,6-bis(octylthio)-1,3,5-triazin-2-yl]amino]-2,6-bis(1,1-dimethylethyl)-phenol. Also, a peroxide-cured polyolefin product prepared therefrom, methods of making and using same, and articles containing or made from same.

Hose embodiments include an inner tube, a reinforcement layer disposed outwardly adjacent the inner tube, and an outer cover layer disposed outwardly adjacent the reinforcement layer. One or more of the inner tube and cover layer may be based upon a curable composition having EPDM, a filler package, and a sulfur curative, and after curing, the hose embodiments meet the testing requirements of the UL 94 standard. In some cases, the inner tube is based upon the curable composition, while in some other cases, the cover layer is based upon the curable composition. Yet, in other cases, the inner tube and the cover layer each is based upon the curable composition. In some aspects, the curable composition includes the EPDM in an amount of from 10% to 30% by weight, or even in an amount of from 30% to 80% by weight.

Hose embodiments include an inner tube, a reinforcement layer disposed outwardly adjacent the inner tube, and an outer cover layer disposed outwardly adjacent the reinforcement layer. One or more of the inner tube and cover layer may be based upon a curable composition having EPDM, a filler package, and a sulfur curative, and after curing, the hose embodiments meet the testing requirements of the UL 94 standard. In some cases, the inner tube is based upon the curable composition, while in some other cases, the cover layer is based upon the curable composition. Yet, in other cases, the inner tube and the cover layer each is based upon the curable composition. In some aspects, the curable composition includes the EPDM in an amount of from 10% to 30% by weight, or even in an amount of from 30% to 80% by weight.

A resist mixture for manufacturing an ion-conductor. In some examples the mixture is crosslinkable and comprises: a polymer comprising siloxane; a crosslinker; and a salt comprising a cationic component, and an anionic component. In other examples the mixture is polymerisable and comprises: a polymer comprising siloxane; a monomer; and a salt comprising a cationic component, and an anionic component. At least one of the cationic component or the anionic component is bonded to the polymer.

A resist mixture for manufacturing an ion-conductor. In some examples the mixture is crosslinkable and comprises: a polymer comprising siloxane; a crosslinker; and a salt comprising a cationic component, and an anionic component. In other examples the mixture is polymerisable and comprises: a polymer comprising siloxane; a monomer; and a salt comprising a cationic component, and an anionic component. At least one of the cationic component or the anionic component is bonded to the polymer.

The present disclosure relates to a photosensitive composition comprising a photoinitiator and a bismaleimide component, photopolymers comprising the photosensitive composition and their use, especially in electronic devices. The bismaleimide component includes a bismaleimide compound or a bismaleimide oligomer.

Provided are methods of controlling disassociation of cells from a carrier, compositions, and methods of collecting cells. The methods of controlling disassociation of cells from a carrier may include contacting a polymeric carrier with one or more digesting agents to disassociate at least a portion of a plurality of cells from the polymeric carrier. The polymeric carrier may be crosslinked with a crosslinker including at least one of a redox sensitive moiety, a UV light sensitive moiety, a pH sensitive moiety, and a temperature sensitive moiety.

A semiconductor device having a copper wiring and an insulating layer provided on the copper wiring, where after storage in air with a humidity of 5% for 168 hours at 150° C., the area of void portion of the copper wiring is 10% or less at the copper wiring surface in contact with the insulating layer. The insulating layer contains at least one polyimide that has (i) a structure derived from 4,4′-oxydiphthalic acid dianhydride and a structure derived from 4,4′-diaminodiphenyl ether; or (ii) a structure derived from 3,3′4,4′-biphenyltetracarboxylic acid dianhydride and a structure derived from 4,4′-diaminodiphenyl ether; or (iii) a structure derived from 4,4′-oxydiphthalic acid dianhydride and a structure derived from 2,2′-dimethyl-4,4′-diaminobiphenyl.

A semiconductor device having a copper wiring and an insulating layer provided on the copper wiring, where after storage in air with a humidity of 5% for 168 hours at 150° C., the area of void portion of the copper wiring is 10% or less at the copper wiring surface in contact with the insulating layer. The insulating layer contains at least one polyimide that has (i) a structure derived from 4,4′-oxydiphthalic acid dianhydride and a structure derived from 4,4′-diaminodiphenyl ether; or (ii) a structure derived from 3,3′4,4′-biphenyltetracarboxylic acid dianhydride and a structure derived from 4,4′-diaminodiphenyl ether; or (iii) a structure derived from 4,4′-oxydiphthalic acid dianhydride and a structure derived from 2,2′-dimethyl-4,4′-diaminobiphenyl.

A vulcanized rubber composition according to one aspect of the present invention comprises a rubber component containing a diene-based rubber and a filler containing silica, and a total of an amount of monosulfide crosslinks and an amount of carbon-carbon crosslinks is 30% to 55% based on an amount of total crosslinks of the vulcanized rubber composition.