A one-pack type curable silicone gel composition which contains: 100 parts by mass of (A) a branched chain organopolysiloxane having a specific structure from 0.1 part by mass to 50 parts by mass of (B) a diorganopolysiloxane having both molecular chain ends blocked with diorganohydrogensiloxy groups; (C) a platinum-based catalyst; and (D) a phosphite compound represented by formula (3) ##STR00001##
(wherein R.sup.2 represents a monovalent aliphatic hydrocarbon group having 1 to 10 carbon atoms; and X represents a hydrogen atom or a methyl group) in such an amount that more than 3 molecules hut not more than 15 molecules of the phosphite compound represented by formula (3) are present per one platinum atom in component (C). This one-pack type curable silicone gel composition is stable in terms of characteristics and physical properties even if exposed to a temperature more than 50° C. for a long period of time.

A one-pack type curable silicone gel composition which contains: 100 parts by mass of (A) a branched chain organopolysiloxane having a specific structure from 0.1 part by mass to 50 parts by mass of (B) a diorganopolysiloxane having both molecular chain ends blocked with diorganohydrogensiloxy groups; (C) a platinum-based catalyst; and (D) a phosphite compound represented by formula (3) ##STR00001##
(wherein R.sup.2 represents a monovalent aliphatic hydrocarbon group having 1 to 10 carbon atoms; and X represents a hydrogen atom or a methyl group) in such an amount that more than 3 molecules hut not more than 15 molecules of the phosphite compound represented by formula (3) are present per one platinum atom in component (C). This one-pack type curable silicone gel composition is stable in terms of characteristics and physical properties even if exposed to a temperature more than 50° C. for a long period of time.

A polymer composition with a polymer of ethylene with a comonomer with silane group(s) containing units and an additive that is an organic compound with at least one amine moiety that has a gel content less than 10 wt % after 7 days at ambient conditions and a gel content of at least 15 wt % gel content after 14 days at 100° C. The film can be used in a laminate.

A polymer composition with a polymer of ethylene with a comonomer with silane group(s) containing units and an additive that is an organic compound with at least one amine moiety that has a gel content less than 10 wt % after 7 days at ambient conditions and a gel content of at least 15 wt % gel content after 14 days at 100° C. The film can be used in a laminate.

A polyorganosiloxane composition for molding includes: (A) a straight-chain polyorganosiloxane having two or more alkenyl groups and having a viscosity (25° C.) of 10,000 to 500,000 mPa.Math.s; (B) 30 to 80 mass % of a resinoid polyorganosiloxane including M, D, and Q units, at a molar ratio of a:b:c, on average (0.3≦a≦0.6, 0≦b≦0.1, 0.4≦c≦0.7, and a+b+c=1), and having two or more alkenyl groups; (C) an amount of a polyorganohydrogensiloxane having Si-bonded hydrogen atoms, an average degree of polymerization of 10 or more, a content of the Si-bonded hydrogen atoms of 5.0 mmol/g or more and 11.0 mmol/g or less, and a mass decrease rate up to 140° C. by TGA of 2.0 mass % or less so that an amount of the (Si-bonded hydrogen atoms/alkenyl groups) is 1.0 to 3.0 mol; and (D) a hydrosilylation reaction catalyst. A cured product excellent in mold release property is obtained and contamination of a metal mold is prevented.

This invention relates to a polymer composition comprising: (A) at least one polyester, and (B) a stabilizer composition comprising: (1) at least one primary antioxidant comprising at least one hindered phenolic antioxidant; (2) at least one secondary antioxidant comprising at least one phosphite; (3) at least one chain extending agent; (4) at least one ultraviolet light absorbing agent; and (5) at least one hindered amine light stabilizer.

This invention relates to a polymer composition comprising: (A) at least one polyester, and (B) a stabilizer composition comprising: (1) at least one primary antioxidant comprising at least one hindered phenolic antioxidant; (2) at least one secondary antioxidant comprising at least one phosphite; (3) at least one chain extending agent; (4) at least one ultraviolet light absorbing agent; and (5) at least one hindered amine light stabilizer.

The present invention provides a resin composition having superior flexibility and that exhibits excellent durability in thermal molding, and a molded body of such a resin composition. The present invention relates to a resin composition comprising: a copolymer (B) constituted of a vinyl alcohol polymer (B-1) region and a diene polymer (B-2) region; and at least one compound selected from the group consisting of a phenol-based compound (C), an amine-based compound (D), and a phosphorus-based compound (E).

The present invention provides a resin composition having superior flexibility and that exhibits excellent durability in thermal molding, and a molded body of such a resin composition. The present invention relates to a resin composition comprising: a copolymer (B) constituted of a vinyl alcohol polymer (B-1) region and a diene polymer (B-2) region; and at least one compound selected from the group consisting of a phenol-based compound (C), an amine-based compound (D), and a phosphorus-based compound (E).

Provided is a polycarbonate resin composition, including, with respect to 100 parts by mass of an aromatic polycarbonate resin (A), 0.005 part by mass to 1 part by mass of a phosphorus-based compound (B) having an aryl group, and 0.005 part by mass to 5 parts by mass of a polyether compound (C) having a specific polyoxyalkylene structure, in which: an amount of a compound having a phenol structure produced by decomposition of the phosphorus-based compound (B) 1,500 hours after standing thereof under conditions of 40° C. and a humidity of 90% is 5 mass % or less with respect to the phosphorus-based compound (B); and when a weight of the phosphorus-based compound (B) is measured with a thermogravimetric-differential thermal analysis machine under a nitrogen atmosphere, a temperature at which the weight becomes smaller than the weight before the measurement by 2% is 340° C. or more.