The invention relates to a thermoplastic molding composition comprising 5.0 to 57 wt.-% ABS graft copolymer (A); 30.5 to 80 wt.-% SAN copolymer (B) 1.5 to 9.5 wt.-% copolymer (C) with epoxy, maleic anhydride or maleic imide functions; 5 to 29 wt.-% of hollow glass microspheres (D); 6 to 12 wt.-% of glass fibers (E); 0 to 5 wt.-% additives and/or processing aids (F), having a low density and high strength, and a process for its preparation, shaped arti-cles thereof, and its use in the electronics sector.

The invention relates to an additive composition comprising at least one hydroxycarboxylic acid salt and at least one organic phosphorus compound, said composition being capable of accelerating the hydrolytic decomposition of a thermoplastic condensation polymer upon working said additive composition into the condensation polymer. The invention additionally relates to a condensation polymer composition which is additivized with an additive composition according to the invention. The invention additionally relates to a method for the hydrolytic decomposition of a thermoplastic condensation polymer and to uses of the additive composition according to the invention and the thermoplastic condensation polymer composition.

The invention relates to an additive composition comprising at least one hydroxycarboxylic acid salt and at least one organic phosphorus compound, said composition being capable of accelerating the hydrolytic decomposition of a thermoplastic condensation polymer upon working said additive composition into the condensation polymer. The invention additionally relates to a condensation polymer composition which is additivized with an additive composition according to the invention. The invention additionally relates to a method for the hydrolytic decomposition of a thermoplastic condensation polymer and to uses of the additive composition according to the invention and the thermoplastic condensation polymer composition.

The invention relates to an additive composition comprising at least one hydroxycarboxylic acid salt and at least one organic phosphorus compound, said composition being capable of accelerating the hydrolytic decomposition of a thermoplastic condensation polymer upon working said additive composition into the condensation polymer. The invention additionally relates to a condensation polymer composition which is additivized with an additive composition according to the invention. The invention additionally relates to a method for the hydrolytic decomposition of a thermoplastic condensation polymer and to uses of the additive composition according to the invention and the thermoplastic condensation polymer composition.

In a self-repairing polyurethane resin material produced by reaction of pentamethylenediisocyanate with an active hydrogen group-containing compound, the active hydrogen group-containing compound contains a polyol compound having a number average molecular weight of 100 to 2000 and an average functionality of 2 to 3.

A polyamide resin composition comprising a polyamide resin (A), a copper compound (B), a bromide of an alkali metal and/or a bromide of an alkaline earth metal (C), and at least one phosphorus compound (D) selected from the group consisting of tris(2,4-di-t-butylphenyl)phosphite, bis(2,4-di-t-butylphenyl)pentaerythritol diphosphite, bis(2,6-di-t-butyl-4-methylphenyl)pentaerythritol diphosphite, bis(2,4-dicumylphenyl)pentaerythritol diphosphite, 2,2′,2″-nitrilo(triethyl-tris(3,3′,5,5′-tetra-t-butyl-1,1′-biphenyl-2,2′-diyl))phosphite, tetrakis(2,4-di-t-butylphenyl)-4,4′-biphenylene diphosphonite, tetrakis(2,4-di-t-butylphenyl)-4,3′-biphenylene diphosphonite, and tetrakis(2,4-di-t-butylphenyl)-3,3′-biphenylene diphosphonate, in an amount of 0.01 to 10% by mass with respect to 100% by mass of the polyamide resin composition, at least one fatty acid compound (E), and an inorganic filler (F).

A polyamide resin composition comprising a polyamide resin (A), a copper compound (B), a bromide of an alkali metal and/or a bromide of an alkaline earth metal (C), and at least one phosphorus compound (D) selected from the group consisting of tris(2,4-di-t-butylphenyl)phosphite, bis(2,4-di-t-butylphenyl)pentaerythritol diphosphite, bis(2,6-di-t-butyl-4-methylphenyl)pentaerythritol diphosphite, bis(2,4-dicumylphenyl)pentaerythritol diphosphite, 2,2′,2″-nitrilo(triethyl-tris(3,3′,5,5′-tetra-t-butyl-1,1′-biphenyl-2,2′-diyl))phosphite, tetrakis(2,4-di-t-butylphenyl)-4,4′-biphenylene diphosphonite, tetrakis(2,4-di-t-butylphenyl)-4,3′-biphenylene diphosphonite, and tetrakis(2,4-di-t-butylphenyl)-3,3′-biphenylene diphosphonate, in an amount of 0.01 to 10% by mass with respect to 100% by mass of the polyamide resin composition, at least one fatty acid compound (E), and an inorganic filler (F).

A polyamide resin composition comprising a polyamide resin (A), a copper compound (B), a bromide of an alkali metal and/or a bromide of an alkaline earth metal (C), and at least one phosphorus compound (D) selected from the group consisting of tris(2,4-di-t-butylphenyl)phosphite, bis(2,4-di-t-butylphenyl)pentaerythritol diphosphite, bis(2,6-di-t-butyl-4-methylphenyl)pentaerythritol diphosphite, bis(2,4-dicumylphenyl)pentaerythritol diphosphite, 2,2′,2″-nitrilo(triethyl-tris(3,3′,5,5′-tetra-t-butyl-1,1′-biphenyl-2,2′-diyl))phosphite, tetrakis(2,4-di-t-butylphenyl)-4,4′-biphenylene diphosphonite, tetrakis(2,4-di-t-butylphenyl)-4,3′-biphenylene diphosphonite, and tetrakis(2,4-di-t-butylphenyl)-3,3′-biphenylene diphosphonate, in an amount of 0.01 to 10% by mass with respect to 100% by mass of the polyamide resin composition, at least one fatty acid compound (E), and an inorganic filler (F).

The invention relates to an additive composition with inorganic sulfites, organic derivatives of sulfurous acid and/or thiosulfates, and organic phosphorus compounds, said composition being capable of accelerating the hydrolytic decomposition of a thermoplastic condensation polymer upon working said additive composition into the condensation polymer. The invention additionally relates to a condensation polymer composition which is additivized with an additive composition according to the invention. The invention additionally relates to a method for the hydrolytic decomposition of a thermoplastic condensation polymer and to uses of the additive composition according to the invention and the thermoplastic condensation polymer composition.

The invention relates to an additive composition with inorganic sulfites, organic derivatives of sulfurous acid and/or thiosulfates, and organic phosphorus compounds, said composition being capable of accelerating the hydrolytic decomposition of a thermoplastic condensation polymer upon working said additive composition into the condensation polymer. The invention additionally relates to a condensation polymer composition which is additivized with an additive composition according to the invention. The invention additionally relates to a method for the hydrolytic decomposition of a thermoplastic condensation polymer and to uses of the additive composition according to the invention and the thermoplastic condensation polymer composition.