C08K5/527

RESIN COMPOSITION AND PRODUCTION METHOD THEREOF

Provided is a halogen-free resin composition including a polyolefin resin, containing a phosphorus compound in an amount of 0.05 to 2.5 mass % as a phosphorus content; a NOR-type hindered amine in an amount of 0.05 to 5 mass %; and an inorganic filler in an amount of 3 to 50 mass %, respectively, with respect to the total amount of the resin composition, wherein a DTA (Differential Thermal Analysis) curve obtained by differential thermal analysis of the inorganic filler has an endothermic portion in a temperature range of 180 to 500° C.; and in the inorganic filler, a ratio value of a number of particles having a maximum diameter of 300 μm or more to a number of particles having a maximum diameter of 100 μm or more is ⅕ or less, or there are no particles having a maximum diameter of 100 μm or more.

ADDITIVE COMPOSITION AND USE THEREOF, CONDENSATION POLYMER COMPOSITION,MOLDING COMPOUND AND MOLDING COMPOUNDS PRODUCED THEREFROM, AND MOLDED PARTS AND USE THEREOF

The invention relates to an additive composition comprising at least one hydroxycarboxylic acid salt and at least one organic phosphorus compound, said composition being capable of accelerating the hydrolytic decomposition of a thermoplastic condensation polymer upon working said additive composition into the condensation polymer. The invention additionally relates to a condensation polymer composition which is additivized with an additive composition according to the invention. The invention additionally relates to a method for the hydrolytic decomposition of a thermoplastic condensation polymer and to uses of the additive composition according to the invention and the thermoplastic condensation polymer composition.

ADDITIVE COMPOSITION AND USE THEREOF, CONDENSATION POLYMER COMPOSITION,MOLDING COMPOUND AND MOLDING COMPOUNDS PRODUCED THEREFROM, AND MOLDED PARTS AND USE THEREOF

The invention relates to an additive composition comprising at least one hydroxycarboxylic acid salt and at least one organic phosphorus compound, said composition being capable of accelerating the hydrolytic decomposition of a thermoplastic condensation polymer upon working said additive composition into the condensation polymer. The invention additionally relates to a condensation polymer composition which is additivized with an additive composition according to the invention. The invention additionally relates to a method for the hydrolytic decomposition of a thermoplastic condensation polymer and to uses of the additive composition according to the invention and the thermoplastic condensation polymer composition.

WHITE HEAT-CURABLE EPOXY RESIN COMPOSITION FOR OPTICAL SEMICONDUCTOR ELEMENT ENCAPSULATION AND OPTICAL SEMICONDUCTOR DEVICE USING SAME

Provided are a white heat-curable epoxy resin composition capable of yielding a cured product that is tough and superior in initial reflection rate and heat resistance; and a semiconductor device with a light receiving element and other semiconductor elements being encapsulated by such cured product. The white heat-curable epoxy resin composition contains: (A) a prepolymer as a molten mixture of (A-1) an epoxy resin: a triazine derivative epoxy resin and/or an alicyclic epoxy compound having an epoxy group and an alicyclic structure in one molecule and being non-fluid at 25° C., (A-2) an acid anhydride having no carbon-carbon double bond and (A-3) an acrylic resin-based modifier having an epoxy group and a weight-average molecular weight of 1,000 to 30,000; (B) a white pigment containing a titanium oxide; (C) an inorganic filler; (D) a curing accelerator; and (E) an antioxidant.

WHITE HEAT-CURABLE EPOXY RESIN COMPOSITION FOR OPTICAL SEMICONDUCTOR ELEMENT ENCAPSULATION AND OPTICAL SEMICONDUCTOR DEVICE USING SAME

Provided are a white heat-curable epoxy resin composition capable of yielding a cured product that is tough and superior in initial reflection rate and heat resistance; and a semiconductor device with a light receiving element and other semiconductor elements being encapsulated by such cured product. The white heat-curable epoxy resin composition contains: (A) a prepolymer as a molten mixture of (A-1) an epoxy resin: a triazine derivative epoxy resin and/or an alicyclic epoxy compound having an epoxy group and an alicyclic structure in one molecule and being non-fluid at 25° C., (A-2) an acid anhydride having no carbon-carbon double bond and (A-3) an acrylic resin-based modifier having an epoxy group and a weight-average molecular weight of 1,000 to 30,000; (B) a white pigment containing a titanium oxide; (C) an inorganic filler; (D) a curing accelerator; and (E) an antioxidant.

AROMATIC POLYCARBONATE RESIN COMPOSITION AND MOLDED ARTICLE THEREOF

Provided are: an aromatic polycarbonate resin composition which has excellent hue and is suitable as a molding material for light guide members; and a molded article which is obtained by molding this aromatic polycarbonate resin composition. An aromatic polycarbonate resin composition which contains: an aromatic polycarbonate resin (A); and 0.01-0.1 part by mass of a phosphite-based stabilizer (B-I) represented by general formula (I), which serves as a phosphorus-based stabilizer (B), and 0.05-2 parts by mass of a polyalkylene glycol compound (C), per 100 parts by mass of the aromatic polycarbonate resin (A). In the formula, each of R.sup.11-R.sup.18 represents a hydrogen atom or an alkyl group; each of R.sup.29-R.sup.22 represents an alkyl group, an aryl group or an aralkyl group; and each of a-d represents an integer of 0-3.

AROMATIC POLYCARBONATE RESIN COMPOSITION AND MOLDED ARTICLE THEREOF

Provided are: an aromatic polycarbonate resin composition which has excellent hue and is suitable as a molding material for light guide members; and a molded article which is obtained by molding this aromatic polycarbonate resin composition. An aromatic polycarbonate resin composition which contains: an aromatic polycarbonate resin (A); and 0.01-0.1 part by mass of a phosphite-based stabilizer (B-I) represented by general formula (I), which serves as a phosphorus-based stabilizer (B), and 0.05-2 parts by mass of a polyalkylene glycol compound (C), per 100 parts by mass of the aromatic polycarbonate resin (A). In the formula, each of R.sup.11-R.sup.18 represents a hydrogen atom or an alkyl group; each of R.sup.29-R.sup.22 represents an alkyl group, an aryl group or an aralkyl group; and each of a-d represents an integer of 0-3.

CRYSTAL NUCLEATING AGENT COMPOSITION FOR POLYOLEFIN RESIN, AND POLYOLEFIN RESIN COMPOSITION INCLUDING SAID CRYSTAL NUCLEATING AGENT COMPOSITION

The disclosure relates to a crystal nucleating agent composition including a compound represented by formula (1) and a compound represented by formula (2).

##STR00001##

R.sup.1 is a C.sub.1-C.sub.4 alkyl group, R.sup.1 binds to the carbon at position 3 or 4 of a cyclohexane ring. When M.sub.1 is a calcium ion or a hydroxyaluminum ion, a is 2, and b is 1, and when M.sub.1 is a sodium ion or a lithiumion, a is 1, and b is 2.

##STR00002##

R.sup.2 to R.sup.5 are the same or different, and each represents a hydrogen atom or a C.sub.1-C.sub.9 alkyl group, R.sup.6 is a hydrogen atom or a C.sub.1-C.sub.3 alkyl group. When M.sub.2 is an alkali metal ion, c is 1, and d is 1, and when M.sub.2 is an alkaline earth metal ion, a zinc ion, or ahydroxyaluminum ion, c is 2, and d is 2.

CRYSTAL NUCLEATING AGENT COMPOSITION FOR POLYOLEFIN RESIN, AND POLYOLEFIN RESIN COMPOSITION INCLUDING SAID CRYSTAL NUCLEATING AGENT COMPOSITION

The disclosure relates to a crystal nucleating agent composition including a compound represented by formula (1) and a compound represented by formula (2).

##STR00001##

R.sup.1 is a C.sub.1-C.sub.4 alkyl group, R.sup.1 binds to the carbon at position 3 or 4 of a cyclohexane ring. When M.sub.1 is a calcium ion or a hydroxyaluminum ion, a is 2, and b is 1, and when M.sub.1 is a sodium ion or a lithiumion, a is 1, and b is 2.

##STR00002##

R.sup.2 to R.sup.5 are the same or different, and each represents a hydrogen atom or a C.sub.1-C.sub.9 alkyl group, R.sup.6 is a hydrogen atom or a C.sub.1-C.sub.3 alkyl group. When M.sub.2 is an alkali metal ion, c is 1, and d is 1, and when M.sub.2 is an alkaline earth metal ion, a zinc ion, or ahydroxyaluminum ion, c is 2, and d is 2.

CRYSTAL NUCLEATING AGENT COMPOSITION FOR POLYOLEFIN RESIN, AND POLYOLEFIN RESIN COMPOSITION INCLUDING SAID CRYSTAL NUCLEATING AGENT COMPOSITION

The disclosure relates to a crystal nucleating agent composition including a compound represented by formula (1) and a compound represented by formula (2).

##STR00001##

R.sup.1 is a C.sub.1-C.sub.4 alkyl group, R.sup.1 binds to the carbon at position 3 or 4 of a cyclohexane ring. When M.sub.1 is a calcium ion or a hydroxyaluminum ion, a is 2, and b is 1, and when M.sub.1 is a sodium ion or a lithiumion, a is 1, and b is 2.

##STR00002##

R.sup.2 to R.sup.5 are the same or different, and each represents a hydrogen atom or a C.sub.1-C.sub.9 alkyl group, R.sup.6 is a hydrogen atom or a C.sub.1-C.sub.3 alkyl group. When M.sub.2 is an alkali metal ion, c is 1, and d is 1, and when M.sub.2 is an alkaline earth metal ion, a zinc ion, or ahydroxyaluminum ion, c is 2, and d is 2.