A resin composition is provided and contains a maleimide compound, a polyphenylene ether compound having an unsaturated double bond in the molecule, a phosphorus-containing compound having a group represented by the following Formula (1) and a group containing a phosphorus atom in the molecule, and a curing agent.

##STR00001##

In Formula (1), R.sub.1 represents a hydrogen atom or an alkyl group.

A resin composition is provided and contains a maleimide compound, a polyphenylene ether compound having an unsaturated double bond in the molecule, a phosphorus-containing compound having a group represented by the following Formula (1) and a group containing a phosphorus atom in the molecule, and a curing agent.

##STR00001##

In Formula (1), R.sub.1 represents a hydrogen atom or an alkyl group.

Disclosed herein is a polyamide composition, and an article which is obtained or obtainable from the composition. The article may include a connector socket for Double Data Rate 5 RAM. The polyamide composition disclosed herein shows desirable tensile strength for the article at a thickness of 0.4 mm, good flowability, and high HDT. The composition also exhibits good thermal stability during molding, and approaches UL 94 V-0.

Disclosed herein is a polyamide composition, and an article which is obtained or obtainable from the composition. The article may include a connector socket for Double Data Rate 5 RAM. The polyamide composition disclosed herein shows desirable tensile strength for the article at a thickness of 0.4 mm, good flowability, and high HDT. The composition also exhibits good thermal stability during molding, and approaches UL 94 V-0.

It would be helpful to provide a styrene-based resin molded body that has excellent dielectric constant, dielectric loss tangent, and color tone, and with little degradation in properties due to usage environment. The present disclosure is a styrene-based resin composition containing a styrene-based resin (A1) having styrene-based monomer units as repeating units. The styrene-based resin composition includes 6 μg or less of a catechol derivative contained in the styrene-based resin (A1) per gram of the styrene-based resin (A1), and the total amount of dimers of the styrene-based monomer units and trimers of the styrene-based monomer units contained in the styrene-based resin (A1) is 5000 μg or less per gram of the styrene-based resin (A1). The styrene-based resin composition has a dielectric constant of 3 or less and a dielectric loss tangent of 0.02 or less.

It would be helpful to provide a styrene-based resin molded body that has excellent dielectric constant, dielectric loss tangent, and color tone, and with little degradation in properties due to usage environment. The present disclosure is a styrene-based resin composition containing a styrene-based resin (A1) having styrene-based monomer units as repeating units. The styrene-based resin composition includes 6 μg or less of a catechol derivative contained in the styrene-based resin (A1) per gram of the styrene-based resin (A1), and the total amount of dimers of the styrene-based monomer units and trimers of the styrene-based monomer units contained in the styrene-based resin (A1) is 5000 μg or less per gram of the styrene-based resin (A1). The styrene-based resin composition has a dielectric constant of 3 or less and a dielectric loss tangent of 0.02 or less.

The present invention is a flame retardant polyester resin composition that contains 3 to 74% by mass of a polybutylene terephthalate resin (A), 3 to 60% by mass of a polyethylene terephthalate resin (B1), 3 to 50% by mass of a copolyester resin (B2), 10 to 50% by mass of a halogen-free flame retardant (C), and 10 to 40% by mass of a glass fiber (D), wherein the copolyester resin (B2) is a polyester resin obtained by copolymerizing an ethylene terephthalate unit with at least one selected from the group consisting of neopentyl glycol, 1,2-propanediol, diethylene glycol, 1,4-cyclohexanedimethanol, and isophthalic acid, and that satisfies prescribed characteristics.

The present invention is a flame retardant polyester resin composition that contains 3 to 74% by mass of a polybutylene terephthalate resin (A), 3 to 60% by mass of a polyethylene terephthalate resin (B1), 3 to 50% by mass of a copolyester resin (B2), 10 to 50% by mass of a halogen-free flame retardant (C), and 10 to 40% by mass of a glass fiber (D), wherein the copolyester resin (B2) is a polyester resin obtained by copolymerizing an ethylene terephthalate unit with at least one selected from the group consisting of neopentyl glycol, 1,2-propanediol, diethylene glycol, 1,4-cyclohexanedimethanol, and isophthalic acid, and that satisfies prescribed characteristics.

Provided herein is a polymer composition comprising a polyhydroxyamino ether (e.g., a crosslinked polyhydroxyamino ether) and printed circuit boards comprising the same.

Provided herein is a polymer composition comprising a polyhydroxyamino ether (e.g., a crosslinked polyhydroxyamino ether) and printed circuit boards comprising the same.