Patent classifications
C08K5/5313
RESIN MATERIAL AND METAL SUBSTRATE
A resin material and a metal substrate are provided. The resin material includes a resin composition and inorganic fillers. The inorganic fillers are uniformly dispersed in the resin composition. The resin composition includes 2 wt % to 40 wt % of a liquid rubber, 5 wt % to 60 wt % of a polyphenylene ether resin, 3 wt % to 40 wt % of a crosslinker, and 5 wt % to 40 wt % of a phosphorus flame retardant. A structural formula of the phosphorus flame retardant is shown as Formula (I):
##STR00001##
RESIN MATERIAL AND METAL SUBSTRATE
A resin material and a metal substrate are provided. The resin material includes a resin composition and inorganic fillers. The inorganic fillers are uniformly dispersed in the resin composition. The resin composition includes 2 wt % to 40 wt % of a liquid rubber, 5 wt % to 60 wt % of a polyphenylene ether resin, 3 wt % to 40 wt % of a crosslinker, and 5 wt % to 40 wt % of a phosphorus flame retardant. A structural formula of the phosphorus flame retardant is shown as Formula (I):
##STR00001##
FLAME-RETARDANT RUBBER COMPOSITION AND OUTER DIAPHRAGM FOR RAIL VEHICLES
A flame-retardant rubber composition containing the following components (A) to (E) and an outer diaphragm for rail vehicles are provided. The outer diaphragm composed of a cross-linked body of the flame-retardant rubber composition. Accordingly, the present disclosure ensures excellent rubber properties such as tensile strength and elongation at break, and exhibits good flame-retardancy. (A) Excluding (B) below, at least one selected from the group consisting of a diene-based rubber, an olefin-based rubber, a urethane rubber, and a silicone rubber. (B) An acid-modified polyolefin. (C) A metal hydroxide. (D) A phosphinic acid metal salt. (E) A cross-linking agent of component (A).
FLAME-RETARDANT RUBBER COMPOSITION AND OUTER DIAPHRAGM FOR RAIL VEHICLES
A flame-retardant rubber composition containing the following components (A) to (E) and an outer diaphragm for rail vehicles are provided. The outer diaphragm composed of a cross-linked body of the flame-retardant rubber composition. Accordingly, the present disclosure ensures excellent rubber properties such as tensile strength and elongation at break, and exhibits good flame-retardancy. (A) Excluding (B) below, at least one selected from the group consisting of a diene-based rubber, an olefin-based rubber, a urethane rubber, and a silicone rubber. (B) An acid-modified polyolefin. (C) A metal hydroxide. (D) A phosphinic acid metal salt. (E) A cross-linking agent of component (A).
FLAME-RETARDANT RUBBER COMPOSITION AND OUTER DIAPHRAGM FOR RAIL VEHICLES
A flame-retardant rubber composition containing the following components (A) to (E) and an outer diaphragm for rail vehicles are provided. The outer diaphragm composed of a cross-linked body of the flame-retardant rubber composition. Accordingly, the present disclosure ensures excellent rubber properties such as tensile strength and elongation at break, and exhibits good flame-retardancy. (A) Excluding (B) below, at least one selected from the group consisting of a diene-based rubber, an olefin-based rubber, a urethane rubber, and a silicone rubber. (B) An acid-modified polyolefin. (C) A metal hydroxide. (D) A phosphinic acid metal salt. (E) A cross-linking agent of component (A).
FLAME RETARDANT POLYAMIDE-BASED 3D PRINTING EXTRUSION MATERIALS
The present invention relates to a fire, smoke and toxicity retardant (FST) polyamide thermoplastic mass usable for 3D printing which comprises at least one non-halogenated organic flame retardant in combination with at least one particulate inorganic flame retardant. Moreover, the present invention refers to uses of such FST polyamide thermoplastic mass for 3D printing. The invention further relates to methods of preparing a three-dimensionally shaped product by means of 3D printing based on such FST polyamide thermoplastic mass.
FLAME RETARDANT POLYAMIDE-BASED 3D PRINTING EXTRUSION MATERIALS
The present invention relates to a fire, smoke and toxicity retardant (FST) polyamide thermoplastic mass usable for 3D printing which comprises at least one non-halogenated organic flame retardant in combination with at least one particulate inorganic flame retardant. Moreover, the present invention refers to uses of such FST polyamide thermoplastic mass for 3D printing. The invention further relates to methods of preparing a three-dimensionally shaped product by means of 3D printing based on such FST polyamide thermoplastic mass.
FLAME RETARDANT POLYAMIDE-BASED 3D PRINTING EXTRUSION MATERIALS
The present invention relates to a fire, smoke and toxicity retardant (FST) polyamide thermoplastic mass usable for 3D printing which comprises at least one non-halogenated organic flame retardant in combination with at least one particulate inorganic flame retardant. Moreover, the present invention refers to uses of such FST polyamide thermoplastic mass for 3D printing. The invention further relates to methods of preparing a three-dimensionally shaped product by means of 3D printing based on such FST polyamide thermoplastic mass.
RESIN COMPOSITION FOR SEALING OPTICAL SEMICONDUCTOR, RESIN MOLDED PRODUCT FOR SEALING OPTICAL SEMICONDUCTOR, OPTICAL SEMICONDUCTOR SEALING MATERIAL, AND OPTICAL SEMICONDUCTOR DEVICE
Provided are a resin composition for sealing an optical semiconductor providing both UV transmission and heat resistance, and a molded resin product for sealing an optical semiconductor, an optical semiconductor-sealing material, and an optical semiconductor device each including the same. The resin composition satisfies the relationship X=(A1×A2)/A3+(B1×B2)/B3+ . . . <0.0005 wherein A1 represents the mass ratio of an aromatic compound, A2 represents the number of aromatic rings per molecule of the aromatic compound, A3 represents the molecular weight of the aromatic compound, and A, B, . . . each represent an aromatic compound. The composition contains an epoxy, an alicyclic acid anhydride, and an antioxidant. When formed into a cured product (size: 50 mm in width×50 mm in length×1 mm in thickness), a linear transmittance at 300 nm is 80% or higher and a linear transmittance at 400 nm is 95% or higher.
RESIN COMPOSITION FOR SEALING OPTICAL SEMICONDUCTOR, RESIN MOLDED PRODUCT FOR SEALING OPTICAL SEMICONDUCTOR, OPTICAL SEMICONDUCTOR SEALING MATERIAL, AND OPTICAL SEMICONDUCTOR DEVICE
Provided are a resin composition for sealing an optical semiconductor providing both UV transmission and heat resistance, and a molded resin product for sealing an optical semiconductor, an optical semiconductor-sealing material, and an optical semiconductor device each including the same. The resin composition satisfies the relationship X=(A1×A2)/A3+(B1×B2)/B3+ . . . <0.0005 wherein A1 represents the mass ratio of an aromatic compound, A2 represents the number of aromatic rings per molecule of the aromatic compound, A3 represents the molecular weight of the aromatic compound, and A, B, . . . each represent an aromatic compound. The composition contains an epoxy, an alicyclic acid anhydride, and an antioxidant. When formed into a cured product (size: 50 mm in width×50 mm in length×1 mm in thickness), a linear transmittance at 300 nm is 80% or higher and a linear transmittance at 400 nm is 95% or higher.