A flame retardant epoxy resin composition for preparing a flame retardant fiber composite including: (a) at least one epoxy resin; (b) at least one flame retardant agent for improving the flammability performance of carbon fiber-reinforced epoxy composites; (c) at least one mold release agent; (d) at least one curing agent; and (e) at least one catalyst; a prepreg prepared using the above epoxy resin composition; and a flame retardant fiber composite prepared using the above prepreg.

A flame retardant epoxy resin composition for preparing a flame retardant fiber composite including: (a) at least one epoxy resin; (b) at least one flame retardant agent for improving the flammability performance of carbon fiber-reinforced epoxy composites; (c) at least one mold release agent; (d) at least one curing agent; and (e) at least one catalyst; a prepreg prepared using the above epoxy resin composition; and a flame retardant fiber composite prepared using the above prepreg.

A flame retardant epoxy resin composition for preparing a flame retardant fiber composite including: (a) at least one epoxy resin; (b) at least one flame retardant agent for improving the flammability performance of carbon fiber-reinforced epoxy composites; (c) at least one mold release agent; (d) at least one curing agent; and (e) at least one catalyst; a prepreg prepared using the above epoxy resin composition; and a flame retardant fiber composite prepared using the above prepreg.

For the purpose of providing a POM resin composition containing a conductive filler, the conductive POM resin composition suppressing the amount of the curing accelerator to be added, having excellent low thermal decomposition mechanical physical properties, and having no practical problem for injection molding applications, and a resin molded article, provided is a resin composition including a polyacetal resin, polyethylene, carbon black, a reaction product of an oxazoline group-containing polymer represented by formula (1), and a tertiary aromatic phosphine represented by formula (3) and/or a tertiary aromatic phosphine oxide represented by formula (4), wherein a content of the polyacetal resin is 50% by mass or more, and a sum of the content of the tertiary aromatic phosphine and the content of the tertiary aromatic phosphine oxide is 0.2% by mass or more and less than 0.5% by mass.

For the purpose of providing a POM resin composition containing a conductive filler, the conductive POM resin composition suppressing the amount of the curing accelerator to be added, having excellent low thermal decomposition mechanical physical properties, and having no practical problem for injection molding applications, and a resin molded article, provided is a resin composition including a polyacetal resin, polyethylene, carbon black, a reaction product of an oxazoline group-containing polymer represented by formula (1), and a tertiary aromatic phosphine represented by formula (3) and/or a tertiary aromatic phosphine oxide represented by formula (4), wherein a content of the polyacetal resin is 50% by mass or more, and a sum of the content of the tertiary aromatic phosphine and the content of the tertiary aromatic phosphine oxide is 0.2% by mass or more and less than 0.5% by mass.

The present invention relates to a filament for 3D printing, comprising (A) at least one semicrystalline polyamide, (B) at least one amorphous polyamide (C) at least one flame retardant of formula (I), wherein R.sup.1 and R.sup.2 are independently of each other a linear or branched C.sub.1-C.sub.8alkyl group, or an optionally substituted aryl group, M represents is an alkali metal ion, an alkaline earth metal ion, an aluminum ion, a zinc ion, an iron ion or a boron ion; m represents 1, 2 or 3; and n represents 1, 2 or 3, a process for the preparation of the filament and its use in a process for preparation of a three-dimensional object, by a fused filament fabrication process.

The present invention relates to a filament for 3D printing, comprising (A) at least one semicrystalline polyamide, (B) at least one amorphous polyamide (C) at least one flame retardant of formula (I), wherein R.sup.1 and R.sup.2 are independently of each other a linear or branched C.sub.1-C.sub.8alkyl group, or an optionally substituted aryl group, M represents is an alkali metal ion, an alkaline earth metal ion, an aluminum ion, a zinc ion, an iron ion or a boron ion; m represents 1, 2 or 3; and n represents 1, 2 or 3, a process for the preparation of the filament and its use in a process for preparation of a three-dimensional object, by a fused filament fabrication process.

The present disclosure relates to a weather resistance improver including a compound (A) and a compound (B), wherein the compound (A) is a compound having the following structure (1), and the compound (B) is a compound having the following structure (2) or a salt thereof. According to the weather resistance improver, it is possible to suppress deterioration of a transparent conductive film using metal nanowires even under any conditions of long-term exposure to sunlight, long-term exposure to artificial light, and high-temperature/high-humidity. ##STR00001##

The present disclosure relates to a weather resistance improver including a compound (A) and a compound (B), wherein the compound (A) is a compound having the following structure (1), and the compound (B) is a compound having the following structure (2) or a salt thereof. According to the weather resistance improver, it is possible to suppress deterioration of a transparent conductive film using metal nanowires even under any conditions of long-term exposure to sunlight, long-term exposure to artificial light, and high-temperature/high-humidity. ##STR00001##

Disclosed are a thermoplastic resin composition and a molded product including the same, and based on 100 parts by weight of a base resin including (A) 70 wt % to 90 wt % of a polybutylene terephthalate resin and (B) 10 wt % to 30 wt % of an acrylate-based graft copolymer, the thermoplastic resin composition includes: (C) 1 part by weight to 5 parts by weight of an epoxy group-containing methacrylate-aromatic vinyl-unsaturated nitrile copolymer; (D) 15 parts by weight to 20 parts by weight of a carbon fiber; (E) 1 part by weight to 5 parts by weight of carbon nanotubes; and (F) 18 parts by weight to 20 parts by weight of aluminum diethyl phosphinate (ADEP).