Provided are a thermosetting epoxy resin composition and a prepreg, laminated board and printed circuit board using the thermosetting epoxy resin composition. The thermosetting epoxy resin composition comprises the following components in parts by weight: 2-10 parts of a phosphorus-containing anhydride, 5-40 parts of a phosphorus-free anhydride, 5-45 parts of an epoxy resin, 40-70 parts of a filler, and 0-15 parts of a phosphorus-containing flame retardant, with the total part by weight of all these components being 100 parts, wherein the phosphorus-containing anhydride has a structure as represented by formula I or II, and the epoxy resin is selected from one of or a combination of at least two of a bisphenol A epoxy resin, a bisphenol F epoxy resin and a biphenyl epoxy resin. The thermosetting epoxy resin composition also has good heat resistance, discoloration resistance and dimensional stability after curing while ensuring V-0 grade flame resistance, and can be used for the preparation of printed circuit board substrates in the field of LEDs.

Provided are a thermosetting epoxy resin composition and a prepreg, laminated board and printed circuit board using the thermosetting epoxy resin composition. The thermosetting epoxy resin composition comprises the following components in parts by weight: 2-10 parts of a phosphorus-containing anhydride, 5-40 parts of a phosphorus-free anhydride, 5-45 parts of an epoxy resin, 40-70 parts of a filler, and 0-15 parts of a phosphorus-containing flame retardant, with the total part by weight of all these components being 100 parts, wherein the phosphorus-containing anhydride has a structure as represented by formula I or II, and the epoxy resin is selected from one of or a combination of at least two of a bisphenol A epoxy resin, a bisphenol F epoxy resin and a biphenyl epoxy resin. The thermosetting epoxy resin composition also has good heat resistance, discoloration resistance and dimensional stability after curing while ensuring V-0 grade flame resistance, and can be used for the preparation of printed circuit board substrates in the field of LEDs.

The invention relates to a composition comprising an organic material susceptible to oxidative, thermal or light-induced degradation and a compound of formula 1-P, 1-O or I-M. Further embodiments are a compound of formula 1-P, 1-O or 1-M, a process for protection of the organic material by the compound, the use of the compound for stabilizing the organic material, an additive composition comprising the compound, a process for manufacturing the compound and intermediates involved therein.

##STR00001##

The invention relates to a composition comprising an organic material susceptible to oxidative, thermal or light-induced degradation and a compound of formula 1-P, 1-O or I-M. Further embodiments are a compound of formula 1-P, 1-O or 1-M, a process for protection of the organic material by the compound, the use of the compound for stabilizing the organic material, an additive composition comprising the compound, a process for manufacturing the compound and intermediates involved therein.

##STR00001##

The present invention provides a heterophasic polypropylene composition with good response to nucleating agents, increased crystallisation temperature, good mechanical properties The present invention further relates to articles made thereof, and the use of the heterophasic polypropylene composition for specific applications and producing these.

The present invention provides a heterophasic polypropylene composition with good response to nucleating agents, increased crystallisation temperature, good mechanical properties The present invention further relates to articles made thereof, and the use of the heterophasic polypropylene composition for specific applications and producing these.

Provided is a resin composition for obtaining a resin molded product which simultaneously exhibits three excellent effects of flame retardance, heat resistance, and mechanical strength. One aspect of the resin composition of the present invention is obtained by radically polymerizing a monomer mixture containing methyl methacrylate, a phosphorus atom-containing compound (C), and a phosphine compound (D), where the phosphorus atom-containing compound (C) comprises at least one selected from a phosphoric acid ester compound and a phosphonic acid ester compound, and the phosphine compound (D) is represented by Formula (I). ##STR00001## [In Formula (I), R.sup.1, R.sup.2, and R.sup.3 each independently represent an aromatic hydrocarbon group having 6 to 12 carbon atoms, or the like].

Provided is a resin composition for obtaining a resin molded product which simultaneously exhibits three excellent effects of flame retardance, heat resistance, and mechanical strength. One aspect of the resin composition of the present invention is obtained by radically polymerizing a monomer mixture containing methyl methacrylate, a phosphorus atom-containing compound (C), and a phosphine compound (D), where the phosphorus atom-containing compound (C) comprises at least one selected from a phosphoric acid ester compound and a phosphonic acid ester compound, and the phosphine compound (D) is represented by Formula (I). ##STR00001## [In Formula (I), R.sup.1, R.sup.2, and R.sup.3 each independently represent an aromatic hydrocarbon group having 6 to 12 carbon atoms, or the like].