The invention relates to flame-retardant polyamide compositions comprising polyamide having a melting point of not more than 290 C. as component A, fillers and/or reinforcers as component B, phosphinic salt of the formula (I) as component C

##STR00001##

in which R.sub.1 and R.sub.2 are ethyl,
M is Al, Fe, TiO.sub.p or Zn,
m is 2 to 3, and
p=(4m)/2 compound selected from the group of the Al, Fe, TiO.sub.p and Zn salts of ethylbutylphosphinic acid, of dibutylphosphinic acid, of ethylhexylphosphinic acid, of butylhexylphosphinic acid and/or of dihexylphosphinic acid as component D phosphonic salt of the formula (II) as component E

##STR00002##

in which R.sub.3 is ethyl,
Met is Al, Fe, TiO.sub.q or Zn,
n is 2 to 3, and
q=(4n)/2 melamine polyphosphate having an average degree of condensation of 2 to 200 as component F, sterically hindered phenolic antioxidant as component G, and/or organic phosphite and/or organic phosphonite as component H.

The polyamide compositions can be used for production of fibers, films and shaped bodies, especially for applications in the electricals and electronics sector.

The invention relates to flame-retardant polyamide compositions comprising polyamide having a melting point of not more than 290 C. as component A, fillers and/or reinforcers as component B, phosphinic salt of the formula (I) as component C

##STR00001##

in which R.sub.1 and R.sub.2 are ethyl,
M is Al, Fe, TiO.sub.p or Zn,
m is 2 to 3, and
p=(4m)/2 compound selected from the group of the Al, Fe, TiO.sub.p and Zn salts of ethylbutylphosphinic acid, of dibutylphosphinic acid, of ethylhexylphosphinic acid, of butylhexylphosphinic acid and/or of dihexylphosphinic acid as component D phosphonic salt of the formula (II) as component E

##STR00002##

in which R.sub.3 is ethyl,
Met is Al, Fe, TiO.sub.q or Zn,
n is 2 to 3, and
q=(4n)/2 melamine polyphosphate having an average degree of condensation of 2 to 200 as component F, sterically hindered phenolic antioxidant as component G, and/or organic phosphite and/or organic phosphonite as component H.

The polyamide compositions can be used for production of fibers, films and shaped bodies, especially for applications in the electricals and electronics sector.

A polymer composition includes a low ethylene random copolymer that can be used to form a meltspun or spunbond article at high spinning velocities. The polymer composition has a low xylene soluble content, a high crystallinity, or both, while having reduced spin-break at high spinning velocities. The polymer composition also exhibits good fiber tenacity and fabric softness.

A polymer composition includes a low ethylene random copolymer that can be used to form a meltspun or spunbond article at high spinning velocities. The polymer composition has a low xylene soluble content, a high crystallinity, or both, while having reduced spin-break at high spinning velocities. The polymer composition also exhibits good fiber tenacity and fabric softness.

The invention relates to a composition comprising an organic material susceptible to oxidative, thermal or light-induced degradation and a compound of formula (I-P), (I-O) or (I-M). Further embodiments are a compound of formula (I-P), (I-O) or (I-M), a process for protection of the organic material by the compound, the use of the compound for stabilizing the organic material, an additive composition comprising the compound and a process for manufacturing the compound. The organic material is for example a polymer. ##STR00001##

The invention relates to a composition comprising an organic material susceptible to oxidative, thermal or light-induced degradation and a compound of formula (I-P), (I-O) or (I-M). Further embodiments are a compound of formula (I-P), (I-O) or (I-M), a process for protection of the organic material by the compound, the use of the compound for stabilizing the organic material, an additive composition comprising the compound and a process for manufacturing the compound. The organic material is for example a polymer. ##STR00001##

Provided are a one-pack addition curable silicone composition compatible with both a good long-term storage property at room temperature under conditions whereby air is blocked to a constant level and the advance of an addition curing reaction at room temperature by being applied in a thin film of 1500 m or less and exposed to air, which could not be obtained by conventional curable heat-dissipating grease, and a method for storing the same, and a method for curing this composition. A one-pack addition curable silicone composition having as essential ingredients: (A) organopolysiloxane having silicon-atom-bonded aliphatic unsaturated hydrocarbon groups and a specific kinematic viscosity; (B) one or more thermally conductive fillers selected from metals, metal oxides, metal hydroxides, metal nitrides, metal carbides, and allotropes of carbon; (C) organohydrogenpolysiloxane; and (D) a platinum group metal complex having an organic phosphorus compound represented by formula (1)

R.sup.1.sub.xP(OR.sup.1).sub.3-x (1)

(R.sup.1 is a monovalent hydrocarbon group, x is 0-3) as a ligand.

Provided are a one-pack addition curable silicone composition compatible with both a good long-term storage property at room temperature under conditions whereby air is blocked to a constant level and the advance of an addition curing reaction at room temperature by being applied in a thin film of 1500 m or less and exposed to air, which could not be obtained by conventional curable heat-dissipating grease, and a method for storing the same, and a method for curing this composition. A one-pack addition curable silicone composition having as essential ingredients: (A) organopolysiloxane having silicon-atom-bonded aliphatic unsaturated hydrocarbon groups and a specific kinematic viscosity; (B) one or more thermally conductive fillers selected from metals, metal oxides, metal hydroxides, metal nitrides, metal carbides, and allotropes of carbon; (C) organohydrogenpolysiloxane; and (D) a platinum group metal complex having an organic phosphorus compound represented by formula (1)

R.sup.1.sub.xP(OR.sup.1).sub.3-x (1)

(R.sup.1 is a monovalent hydrocarbon group, x is 0-3) as a ligand.

The invention relates to a powder coating composition containing a binder combination. The binder combination comprises the following components: A) 15 to 70 wt. % of the binder of one or more amorphous carboxyl group-containing polyester resins, having an arithmetically averaged acid number of 50 to 100 mg KOH/g, B) 20 to 50 wt. % of the binder of one or more epoxide group-containing polymers with an arithmetically averaged epoxide equivalent weight of 350 to 650 g/eq, preferably 400 to 650 g/eq, preferably based on bisphenol A and phenol novolak, C) 5 to 55 wt. % of the binder of one or more crystalline or semi-crystalline carboxyl group-containing polyester resins, having an arithmetically averaged acid number of 15 to 00 mg KOH/g, D) 0.5 to 6 wt. % (based on the entire formulation) of one or more catalysts (accelerants) for the crosslinking reaction(s), and optionally E) 0 to 10 wt. % (based on the entire formulation) of one or more components with reactive groups for the crosslinking reaction(s) with the carboxyl groups and/or epoxide groups of the components A), B), and C). The polyester resins according to A) and. C) contain a sum of 15 to 75 wt. %, preferably 15 to 60 wt. % and particularly preferably 20 to 50 wt. %, based on the monomers used for the synthesis, of linear and unbranched aliphatic diols or the derivatives thereof and/or linear and unbranched aliphatic dicarboxylic acids or the derivatives thereof. The invention additionally relates to a method for producing such a powder coating composition and to the use thereof.

A polycarbonate composition comprising: 35 to 98 wt % of a poly(carbonate-co-monoarylate ester) comprising aromatic carbonate units, monoaryl carbonate units, or a combination thereof and monoaryl ester units, and optionally aromatic ester units; to less than 50 wt % of a poly(ester) composition comprising greater than 20 to less than 50 wt % of poly(ethylene terephthalate), or 2 to less than 50 wt % of a poly(ester) different from poly(ethylene terephthalate), or a combination of 1-49 wt % of poly(ethylene terephthalate) and 1-49 wt % of a poly(ester) different from poly(ethylene terephthalate); 1 to 50 wt % of a homopolycarbonate, a poly(aliphatic ester-carbonate), or a combination thereof; optionally, 0.001 to 10 wt % of an additive composition; and optionally, 0.5 to 6 wt % of an organophosphorous flame retardant.