Patent classifications
C08K5/5419
High modulus curable composition
The invention relates to a curable composition comprising a) at least one polymer having at least one terminal group of the general formula (I)
-A.sub.n-RSiXYZ(I),
wherein A is a divalent bonding group containing at least one heteroatom, R is selected from divalent hydrocarbon residues having 1 to 12 carbon atoms, X, Y, Z are, independently of one another, selected from the group consisting of a hydroxyl group and C.sub.1 to C.sub.8 alkyl, C.sub.1 to C.sub.8 alkoxy, and C.sub.1 to C.sub.8 acyloxy groups, wherein X, Y, Z are substituents directly bound with the Si atom or the two of the substituents X, Y, Z form a ring together with the Si atom to which they are bound, and at least one of the substituents X, Y, Z is selected from the group consisting of a hydroxyl group, C.sub.1 to C.sub.8 alkoxy or C.sub.1 to C.sub.8 acyloxy groups, and n is 0 or 1; and b) at least one compound of the general formula (II) ##STR00001##
wherein R is same or different and is, independently from one another, selected from the group consisting of a hydrogen atom and hydrocarbon residues having 1 to 12 carbon atoms, and Ar is selected from aryl groups, and adhesive, sealant, or coating materials comprising the composition and use thereof.
High modulus curable composition
The invention relates to a curable composition comprising a) at least one polymer having at least one terminal group of the general formula (I)
-A.sub.n-RSiXYZ(I),
wherein A is a divalent bonding group containing at least one heteroatom, R is selected from divalent hydrocarbon residues having 1 to 12 carbon atoms, X, Y, Z are, independently of one another, selected from the group consisting of a hydroxyl group and C.sub.1 to C.sub.8 alkyl, C.sub.1 to C.sub.8 alkoxy, and C.sub.1 to C.sub.8 acyloxy groups, wherein X, Y, Z are substituents directly bound with the Si atom or the two of the substituents X, Y, Z form a ring together with the Si atom to which they are bound, and at least one of the substituents X, Y, Z is selected from the group consisting of a hydroxyl group, C.sub.1 to C.sub.8 alkoxy or C.sub.1 to C.sub.8 acyloxy groups, and n is 0 or 1; and b) at least one compound of the general formula (II) ##STR00001##
wherein R is same or different and is, independently from one another, selected from the group consisting of a hydrogen atom and hydrocarbon residues having 1 to 12 carbon atoms, and Ar is selected from aryl groups, and adhesive, sealant, or coating materials comprising the composition and use thereof.
High modulus curable composition
The invention relates to a curable composition comprising a) at least one polymer having at least one terminal group of the general formula (I)
-A.sub.n-RSiXYZ(I),
wherein A is a divalent bonding group containing at least one heteroatom, R is selected from divalent hydrocarbon residues having 1 to 12 carbon atoms, X, Y, Z are, independently of one another, selected from the group consisting of a hydroxyl group and C.sub.1 to C.sub.8 alkyl, C.sub.1 to C.sub.8 alkoxy, and C.sub.1 to C.sub.8 acyloxy groups, wherein X, Y, Z are substituents directly bound with the Si atom or the two of the substituents X, Y, Z form a ring together with the Si atom to which they are bound, and at least one of the substituents X, Y, Z is selected from the group consisting of a hydroxyl group, C.sub.1 to C.sub.8 alkoxy or C.sub.1 to C.sub.8 acyloxy groups, and n is 0 or 1; and b) at least one compound of the general formula (II) ##STR00001##
wherein R is same or different and is, independently from one another, selected from the group consisting of a hydrogen atom and hydrocarbon residues having 1 to 12 carbon atoms, and Ar is selected from aryl groups, and adhesive, sealant, or coating materials comprising the composition and use thereof.
METAL APROTIC ORGANOSILANOXIDE COMPOUND
A metal aprotic organosilanoxide compound of formula (I): {R.sup.1Si(R.sup.2)(R.sup.3)[OSi(R.sup.4)(R.sup.5)].sub.mO}.sub.n-M.sup.1(L).sub.o(X.sup.1)p (I), wherein M.sup.1 is a metal atom Al, Ce, Fe, or V, a composition or formulation containing or prepared from it, and methods of making and using them. Each molecule of the metal aprotic organosilanoxide compound is composed of at least one metal atom and at least one aprotic organosilanoxide ligand. The metal aprotic organosilanoxide compound may be used as such or as a constituent in a variety of silicone formulations for adhesives, coatings, elastomers, encapsulants, pottants, and sealants.
METAL APROTIC ORGANOSILANOXIDE COMPOUND
A metal aprotic organosilanoxide compound of formula (I): {R.sup.1Si(R.sup.2)(R.sup.3)[OSi(R.sup.4)(R.sup.5)].sub.mO}.sub.n-M.sup.1(L).sub.o(X.sup.1)p (I), wherein M.sup.1 is a metal atom Al, Ce, Fe, or V, a composition or formulation containing or prepared from it, and methods of making and using them. Each molecule of the metal aprotic organosilanoxide compound is composed of at least one metal atom and at least one aprotic organosilanoxide ligand. The metal aprotic organosilanoxide compound may be used as such or as a constituent in a variety of silicone formulations for adhesives, coatings, elastomers, encapsulants, pottants, and sealants.
METHOD FOR MANUFACTURING ROOM-TEMPERATURE-CURABLE ORGANOPOLYSILOXANE COMPOSITION, ROOM-TEMPERATURE-CURABLE ORGANOPOLYSILOXANE COMPOSITION, AND ARTICLE
Through the present invention, by undergoing a step in which a straight-chain diorganopolysiloxane having silanol groups at both terminal ends of the molecular chain thereof, a hydrolyzable silane and/or a partial hydrolysis condensate thereof having a hydrolyzable group capable of detaching a lactic acid ester, and an amino-group-containing hydrolyzable organosilane and/or a partial hydrolysis condensate thereof are pre-mixed/reacted in advance and silanol groups at both terminal ends of the molecular chain of a main agent (base polymer) are blocked by specific hydrolyzable silyl groups, it is possible to manufacture a lactic-acid-ester-type room-temperature-curable organopolysiloxane composition excellent in all characteristics including curability, adhesive properties, workability, and the like that were not attainable by the conventional lactic-acid-ester-type room-temperature curable (RTV) silicone rubber composition.
METHOD FOR MANUFACTURING ROOM-TEMPERATURE-CURABLE ORGANOPOLYSILOXANE COMPOSITION, ROOM-TEMPERATURE-CURABLE ORGANOPOLYSILOXANE COMPOSITION, AND ARTICLE
Through the present invention, by undergoing a step in which a straight-chain diorganopolysiloxane having silanol groups at both terminal ends of the molecular chain thereof, a hydrolyzable silane and/or a partial hydrolysis condensate thereof having a hydrolyzable group capable of detaching a lactic acid ester, and an amino-group-containing hydrolyzable organosilane and/or a partial hydrolysis condensate thereof are pre-mixed/reacted in advance and silanol groups at both terminal ends of the molecular chain of a main agent (base polymer) are blocked by specific hydrolyzable silyl groups, it is possible to manufacture a lactic-acid-ester-type room-temperature-curable organopolysiloxane composition excellent in all characteristics including curability, adhesive properties, workability, and the like that were not attainable by the conventional lactic-acid-ester-type room-temperature curable (RTV) silicone rubber composition.
Epoxy resin composition for sealing semiconductor device, and semiconductor device sealed using same
The present invention relates to an epoxy resin composition for sealing a semiconductor device, a preparation method therefor, and a semiconductor device sealed by using the same, the epoxy resin composition, which comprises an epoxy resin, a curing agent, an inorganic filler, and one or more additives selected from the group consisting of a curing accelerator, a coupling agent, a release agent, and a colorant, and has a gel content of approximately 1 ppm or less.
Epoxy resin composition for sealing semiconductor device, and semiconductor device sealed using same
The present invention relates to an epoxy resin composition for sealing a semiconductor device, a preparation method therefor, and a semiconductor device sealed by using the same, the epoxy resin composition, which comprises an epoxy resin, a curing agent, an inorganic filler, and one or more additives selected from the group consisting of a curing accelerator, a coupling agent, a release agent, and a colorant, and has a gel content of approximately 1 ppm or less.
POLYMERIC COMPOSITIONS PREPARED WITH A CONTROLLED RADICAL INITIATOR
Crosslinkable polymeric materials, crosslinked polymeric materials, articles containing the crosslinkable polymeric materials or crosslinked polymeric materials, and methods of making the articles and various compositions are provided. More particularly, the crosslinkable composition contains a) a first polymeric material, which has terminal dithiocarbamate or dithiocarbonate groups, b) a crosslinking composition containing a chlorinated triazine crosslinking agent and/or a crosslinking monomer having two or more ethylenically unsaturated groups, and c) a thixotropic agent containing metal oxide particles. The crosslinkable composition may be printable or dispensed. In some embodiments, the crosslinked composition is a pressure-sensitive adhesive.