Patent classifications
C08K5/5419
Photoactivatable crosslinker
Described herein is a degradable linking agent of formula Photo.sup.1-LG-Photo.sup.2, wherein Photo.sup.1 and Photo.sup.2 independently represent at least one photoreactive group and LG represents a linking group comprising one or more silicon atoms or one or more phosphorous atoms. The degradable linking agent includes a covalent linkage between at least one photoreactive group and the linking group, wherein the covalent linkage between at least one photoreactive group and the linking group is interrupted by at least one heteroatom. A method for coating a support surface with the degradable linking agent, coated support surfaces and medical devices are also described.
Photoactivatable crosslinker
Described herein is a degradable linking agent of formula Photo.sup.1-LG-Photo.sup.2, wherein Photo.sup.1 and Photo.sup.2 independently represent at least one photoreactive group and LG represents a linking group comprising one or more silicon atoms or one or more phosphorous atoms. The degradable linking agent includes a covalent linkage between at least one photoreactive group and the linking group, wherein the covalent linkage between at least one photoreactive group and the linking group is interrupted by at least one heteroatom. A method for coating a support surface with the degradable linking agent, coated support surfaces and medical devices are also described.
LUBRICIOUS COATINGS FOR SKIS AND SNOWBOARDS AND RELATED METHODS OF USE
Coatings for skis and snowboards are provided. The coatings may be lubricious coatings including one or more fluorinated compounds, adhesion agents, shape memory polymers, free-radical initiators, and/or carrying solvents. Methods of applying the coatings to skis and snowboards are also provided. The coatings may be applied in a single layer or in multiple layers.
Anti-soiling compositions comprising silica nanoparticles and functional silane compounds and coated articles thereof
Provided is a coated article comprising a substrate and a dried coating which comprises a first set of spherical silica nanoparticles having an average diameter of less than 20 nm and a second set of spherical silica nanoparticles having an average diameter of 20 nm to 120 nm. The alkoxy silane compound comprises an epoxy functional group or a carboxylic acid functional group. Also provided is a coating composition comprising an acidic aqueous dispersion which comprises the described first and second set of spherical silica nanoparticles and silane compound.
Anti-soiling compositions comprising silica nanoparticles and functional silane compounds and coated articles thereof
Provided is a coated article comprising a substrate and a dried coating which comprises a first set of spherical silica nanoparticles having an average diameter of less than 20 nm and a second set of spherical silica nanoparticles having an average diameter of 20 nm to 120 nm. The alkoxy silane compound comprises an epoxy functional group or a carboxylic acid functional group. Also provided is a coating composition comprising an acidic aqueous dispersion which comprises the described first and second set of spherical silica nanoparticles and silane compound.
HOT MELT COMPOSITION, HOT MELT COMPOSITION PRODUCTION METHOD, SEAL MATERIAL, ELECTRONIC DEVICE, AND LAMP
One aspect of the present invention is a hot melt composition containing a silane coupling agent, a thermoplastic polymer, a softener, and a catalyst, wherein the silane coupling agent is hydrolyzed to a compound having a boiling point of 70 to 180 C.
THERMALLY-CONDUCTIVE SILICONE GEL COMPOSITION, THERMALLY-CONDUCTIVE MEMBER, AND HEAT DISSIPATION STRUCTURE
Provided is: a thermally conductive silicone gel composition which has a high thermal conductivity, and has excellent gap-filling ability and repairability; a thermally conductive member comprising the thermally conductive silicone gel composition; and a heat dissipation structure using the same. The thermally conductive silicone gel composition comprises: (A) an alkenyl group-containing organopolysiloxane; (B) a straight-chain organohydrogenpolysiloxane containing an average of 2 to 4 silicon-bonded hydrogen atoms per molecule, at least two of the hydrogen atoms are being located on a side chain of the molecular chain, wherein the amount of silicon-bonded hydrogen atoms in component (B) is 0.2 to 5 mol with respected to 1 mol of an alkenyl group contained in component (A); (C) a catalyst for hydrosilylation reaction; (D) a thermally conductive filler; and (E) an alkoxysilane having an alkyl group with 6 or more carbon atoms per molecule.
THERMALLY-CONDUCTIVE SILICONE GEL COMPOSITION, THERMALLY-CONDUCTIVE MEMBER, AND HEAT DISSIPATION STRUCTURE
Provided is: a thermally conductive silicone gel composition which has a high thermal conductivity, and has excellent gap-filling ability and repairability; a thermally conductive member comprising the thermally conductive silicone gel composition; and a heat dissipation structure using the same. The thermally conductive silicone gel composition comprises: (A) an alkenyl group-containing organopolysiloxane; (B) a straight-chain organohydrogenpolysiloxane containing an average of 2 to 4 silicon-bonded hydrogen atoms per molecule, at least two of the hydrogen atoms are being located on a side chain of the molecular chain, wherein the amount of silicon-bonded hydrogen atoms in component (B) is 0.2 to 5 mol with respected to 1 mol of an alkenyl group contained in component (A); (C) a catalyst for hydrosilylation reaction; (D) a thermally conductive filler; and (E) an alkoxysilane having an alkyl group with 6 or more carbon atoms per molecule.
PROCESS FOR PRODUCING COMPOSITIONS CROSSLINKABLE TO ELASTOMERS
Neutral moisture curable organopolysiloxane compositions are prepared from silanol-stopped organopolysiloxanes, alkoxysilanes, aminosilanes, and ketoximino silanes, and contain less than 1 weight percent oximes upon storage.
PROCESS FOR PRODUCING COMPOSITIONS CROSSLINKABLE TO ELASTOMERS
Neutral moisture curable organopolysiloxane compositions are prepared from silanol-stopped organopolysiloxanes, alkoxysilanes, aminosilanes, and ketoximino silanes, and contain less than 1 weight percent oximes upon storage.