A dually curable resin composition is provided. The composition comprises: (A) a first polyorganosiloxane comprising at least one alkenyl group and at least one alkoxy group in one molecule; (B) a second polyorganosiloxane comprising at least two photoreactive functional groups in one molecule on its side chain of siloxane backbone; (C) at least one silane compound represented by a particular chemical formula herein or its partially hydrolyzed compound; (D) at least one photoinitiator; and (E) at least one condensation reaction catalyst. A cured body prepared by curing the dually curable resin composition, and an electronic device comprising the cured body, are also provided.

A dually curable resin composition is provided. The composition comprises: (A) a first polyorganosiloxane comprising at least one alkenyl group and at least one alkoxy group in one molecule; (B) a second polyorganosiloxane comprising at least two photoreactive functional groups in one molecule on its side chain of siloxane backbone; (C) at least one silane compound represented by a particular chemical formula herein or its partially hydrolyzed compound; (D) at least one photoinitiator; and (E) at least one condensation reaction catalyst. A cured body prepared by curing the dually curable resin composition, and an electronic device comprising the cured body, are also provided.

Disclosed is a polymer composition having a semi-homogeneous phase that exhibits excellent electrical, mechanical and thermal properties while satisfying flexibility, bendability and impact resistance. More specifically, disclosed is a polymer composition having a morphology in which a rubber-phase filler of a propylene copolymer is dispersed in a matrix of polypropylene, wherein an elution rate of the rubber-phase filler in a xylene-based solvent is less than 50%, based on the content of the rubber-phase filler such that the rubber-phase filler forms a semi-homogeneous phase with the matrix.

Disclosed is a polymer composition having a semi-homogeneous phase that exhibits excellent electrical, mechanical and thermal properties while satisfying flexibility, bendability and impact resistance. More specifically, disclosed is a polymer composition having a morphology in which a rubber-phase filler of a propylene copolymer is dispersed in a matrix of polypropylene, wherein an elution rate of the rubber-phase filler in a xylene-based solvent is less than 50%, based on the content of the rubber-phase filler such that the rubber-phase filler forms a semi-homogeneous phase with the matrix.

One embodiment relates to a water-based ink for an inkjet containing a pigment, a fixing resin, an organic solvent and water, wherein the fixing resin includes an A-B block polymer having an A block and a B block, the A block contains a structural unit (P-1) having an anionic functional group, and the acid value of the A-B block polymer is from 5 to 80 mgKOH/g.

One embodiment relates to a water-based ink for an inkjet containing a pigment, a fixing resin, an organic solvent and water, wherein the fixing resin includes an A-B block polymer having an A block and a B block, the A block contains a structural unit (P-1) having an anionic functional group, and the acid value of the A-B block polymer is from 5 to 80 mgKOH/g.

An insulation or jacket layer for a coated conductor is composed of (A) a crosslinked silane-functionalized polyolefin, (B) a filler, (C) a reactive branched polysiloxane, and (D) from 0.00 wt % to 20 wt % of a silanol condensation catalyst.

An organic silicon compound-modified copolymer having structural units represented by formula (1) and formula (2) and having a hydroxyl group at at least one end has excellent compatibility with alcohol compounds and isocyanate compounds and also gives a cured product having excellent water repellency and moisture resistance.

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(In the formulas, an asterisk * represents a bond to an adjacent structural unit, each R.sup.1 independently represents a C1-10 alkyl group or C6-10 aryl group, and n represents an integer of 1 or higher.)

A transparent coating film forming composition contains: (A) a polysilazane having units represented by the following formulae (1) and (2), and having predetermined modification rate and weight average molecular weight,

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(B) an organic solvent containing (B-1) and (B-2), (B-1) an organic solvent having a dielectric constant of 2.1 to 15.0 on average and a higher boiling point under atmospheric pressure (1013 hPa) than that of an organic solvent contained as the component (B-2), and (B-2) a saturated aliphatic hydrocarbon organic solvent; and (C) a predetermined curing catalyst. The mixing ratio of the component (A) and the component (B) satisfies a predetermined range. This provides a transparent coating film forming composition using an organic solvent having high polysilazane solubility, volatility at an appropriate speed during application, high safety and workability, the composition enabling formation of a coating film that is uniform and has high transparency and hardness after curing.

A transparent coating film forming composition contains: (A) a polysilazane having units represented by the following formulae (1) and (2), and having predetermined modification rate and weight average molecular weight,

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(B) an organic solvent containing (B-1) and (B-2), (B-1) an organic solvent having a dielectric constant of 2.1 to 15.0 on average and a higher boiling point under atmospheric pressure (1013 hPa) than that of an organic solvent contained as the component (B-2), and (B-2) a saturated aliphatic hydrocarbon organic solvent; and (C) a predetermined curing catalyst. The mixing ratio of the component (A) and the component (B) satisfies a predetermined range. This provides a transparent coating film forming composition using an organic solvent having high polysilazane solubility, volatility at an appropriate speed during application, high safety and workability, the composition enabling formation of a coating film that is uniform and has high transparency and hardness after curing.