A method of making a polymer with stable Mooney viscosity and molecular weight is described. A conjugated diolefin is reacted in a hydrocarbon solvent in the presence of an initiator to form a polymer. After forming the polymer, alkoxy silane terminal functionalizing groups are bonded to the polymer. A dialkoxysilane stabilizing agent is then added to the polymer in combination with a base material. The polymer is then desolvatizing, resulting in a polymer with stable Mooney viscosity and molecular weight, even over prolonged periods of time. Compositions and articles containing the polymer are also described.

A method of making a polymer with stable Mooney viscosity and molecular weight is described. A conjugated diolefin is reacted in a hydrocarbon solvent in the presence of an initiator to form a polymer. After forming the polymer, alkoxy silane terminal functionalizing groups are bonded to the polymer. A dialkoxysilane stabilizing agent is then added to the polymer in combination with a base material. The polymer is then desolvatizing, resulting in a polymer with stable Mooney viscosity and molecular weight, even over prolonged periods of time. Compositions and articles containing the polymer are also described.

A siloxane compound comprises a plurality of siloxane repeating units and at least a portion of the siloxane repeating units are cyclosiloxane repeating units conforming to a specified structure. A process for producing such siloxane compounds is also provided. A process and kit for producing a cross-linked silicone polymer using the described siloxane compounds is also provided. A light emitting diode (LED) comprises an encapsulant, and the encapsulant comprises a cross-linked silicone polymer produced from the described siloxane compounds.

A siloxane compound comprises a plurality of siloxane repeating units and at least a portion of the siloxane repeating units are cyclosiloxane repeating units conforming to a specified structure. A process for producing such siloxane compounds is also provided. A process and kit for producing a cross-linked silicone polymer using the described siloxane compounds is also provided. A light emitting diode (LED) comprises an encapsulant, and the encapsulant comprises a cross-linked silicone polymer produced from the described siloxane compounds.

A siloxane compound comprises a plurality of siloxane repeating units and at least a portion of the siloxane repeating units are cyclosiloxane repeating units conforming to a specified structure. A process for producing such siloxane compounds is also provided. A process and kit for producing a cross-linked silicone polymer using the described siloxane compounds is also provided. A light emitting diode (LED) comprises an encapsulant, and the encapsulant comprises a cross-linked silicone polymer produced from the described siloxane compounds.

The present invention is directed to polyamides that are crosslinkable in the presence of water having desirable properties including long open time, good adhesion and cold flexibility. Notably, the polyamides of the present invention are suitable for structural and semi-structural bonding applications utilizing a hot melt process, roll coater or bead extrusion process.

A thermoplastic composition which comprises at least one polyamide, which preferably has a melting point of less than 185° C., and at least one liquid polysiloxane compound which preferably has a viscosity of 750 to 100,000 mPas at 25° C. and is OH terminated, wherein the thermoplastic composition is obtainable by a process comprising the steps: 1a) heating the at least one polyamide to a temperature above the melting point of the at least one polyamide and preferably below 185° C.; 2a) adding under stirring the at least one liquid polysiloxane compound to the heated compound(s) of step 1a), wherein the temperature is kept above the melting point of the at least one polyamide and preferably below 185° C.; and 3a) mixing the obtained mixture of step 2a) preferably at 80° to 180° C., more preferably 110 to 140° C.

Use of this the thermoplastic composition according to the present invention in sealants, adhesives, or as rheological modifier or surface modifier. Furthermore, to a hot melt adhesive comprising the thermoplastic composition according to the present invention. And use of this hot melt in vehicle parts, constructions, windows, glazing, sanitary applications, fittings, roofing, plumbing, appliance application and bonding of panes.

Provided are a one-pack addition curable silicone composition compatible with both a good long-term storage property at room temperature under conditions whereby air is blocked to a constant level and the advance of an addition curing reaction at room temperature by being applied in a thin film of 1500 μm or less and exposed to air, which could not be obtained by conventional curable heat-dissipating grease, and a method for storing the same, and a method for curing this composition. A one-pack addition curable silicone composition having as essential ingredients: (A) organopolysiloxane having silicon-atom-bonded aliphatic unsaturated hydrocarbon groups and a specific kinematic viscosity; (B) one or more thermally conductive fillers selected from metals, metal oxides, metal hydroxides, metal nitrides, metal carbides, and allotropes of carbon; (C) organohydrogenpolysiloxane; and (D) a platinum group metal complex having an organic phosphorus compound represented by formula (1)

R.sup.1.sub.x—P—(OR.sup.1).sub.3-x   (1)

(R.sup.1 is a monovalent hydrocarbon group, x is 0-3) as a ligand.

A composition includes a solvent, a catalyst, a polysiloxane including methyl and phenyl pendant groups, and a crosslinker comprising at least one of a phenylene disilyl group and para-disilyl phenylene group. Exemplary crosslinkers include bis silyl benzene, bis alkoxysilane, 1,3 bistriethoxysilyl benzene, and 1,4 bistriethoxysilyl benzene 2,6-bis(triethoxysilyl)-naphthalene, 9,10-bis(triethoxysilyl)-anthracene, and 1,6-bis(trimethoxysilyl)-pyrene.

A composition includes a solvent, a catalyst, a polysiloxane including methyl and phenyl pendant groups, and a crosslinker comprising at least one of a phenylene disilyl group and para-disilyl phenylene group. Exemplary crosslinkers include bis silyl benzene, bis alkoxysilane, 1,3 bistriethoxysilyl benzene, and 1,4 bistriethoxysilyl benzene 2,6-bis(triethoxysilyl)-naphthalene, 9,10-bis(triethoxysilyl)-anthracene, and 1,6-bis(trimethoxysilyl)-pyrene.