A mixed composition including an organosilicon compound (A) in which at least one trialkylsilyl group-containing molecular chain and at least one hydrolyzable group are bonded to a silicon atom, a metal compound (B), an acid (C), and water (D), in which a ratio [D/(A+B)] of a molar amount of the water (D) to a total molar amount of the organosilicon compound (A) and the metal compound (B) is 3.1 to 130.

An insulation or jacket layer for a coated conductor is composed of (A) a crosslinked silane-functional polyolefin, (B) a filler composed of greater than 50 wt % silica, based on the total weight of the filler, (C) a silicone-containing polymer selected from the group consisting of reactive linear silicone-containing polymers, non-reactive linear silicone-containing polymers, and non-reactive branched silicone-containing polymers, and (D) from 0.00 wt % to 20 wt % of a silanol condensation catalyst, based on the total weight of the insulation or jacket layer.

The present invention relates to a thermally conductive polysiloxane composition comprising: (A) a thermally conductive filler, (B) a siloxane compound having a specified structure; (C) an alkoxysilane compound having a specified structure; (D) a polyorganosiloxane containing at least one aliphatic unsaturated group per molecule; (E) a polyorganohydrogensiloxane having two or more hydrogen atoms bonded to silicon atoms per molecule; and (F) a platinum-based catalyst.

The present invention relates to a thermally conductive polysiloxane composition comprising: (A) a thermally conductive filler, (B) a siloxane compound having a specified structure; (C) an alkoxysilane compound having a specified structure; (D) a polyorganosiloxane containing at least one aliphatic unsaturated group per molecule; (E) a polyorganohydrogensiloxane having two or more hydrogen atoms bonded to silicon atoms per molecule; and (F) a platinum-based catalyst.

The invention relates to the use of a polyethylene composition comprising one or more ethylene copolymer(s) wherein the ethylene copolymer is a terpolymer containing monomer units with polar groups and monomer units with hydrolysable silane groups, wherein the monomer units with polar groups are present in an amount of more than 5 mol. % based on the total polyethylene composition, and a silanol condensation catalyst in an amount of 0.0001 to 5 wt. %, based on the total polyethylene composition for improving the adhesion between a layer of a cable comprising the polyethylene composition and a polyurethane resin.

The invention relates to the use of a polyethylene composition comprising one or more ethylene copolymer(s) wherein the ethylene copolymer is a terpolymer containing monomer units with polar groups and monomer units with hydrolysable silane groups, wherein the monomer units with polar groups are present in an amount of more than 5 mol. % based on the total polyethylene composition, and a silanol condensation catalyst in an amount of 0.0001 to 5 wt. %, based on the total polyethylene composition for improving the adhesion between a layer of a cable comprising the polyethylene composition and a polyurethane resin.

Curable condensation compounds are useful, obtainable by the reaction of end-equilibrated acetoxy group-bearing siloxanes with at least one alkoxy-functional polysiloxane, in the presence of a catalyst.

Curable condensation compounds are useful, obtainable by the reaction of end-equilibrated acetoxy group-bearing siloxanes with at least one alkoxy-functional polysiloxane, in the presence of a catalyst.

To provide Provided is a curable silicone composition and applications thereof. The curable silicone composition has hot-melt properties, excellent workability, and curing characteristics such as overmolding, and a cured product obtained therefrom does not become hard or brittle, even if left at a temperature of 150° C. or higher for a long time. A The curable silicone composition comprises: an organopolysiloxane resin component which is non-hot-meltable, comprises a siloxane unit represented by SiO.sub.4/2 making up at least 20 mol % or more of the total siloxane units, and has a mass loss of 2.0 mass % or less when exposed to 200° C. for 1 hour; a liquid straight-chain or branched chain organopolysiloxane; and a curing agent.

To provide Provided is a curable silicone composition and applications thereof. The curable silicone composition has hot-melt properties, excellent workability, and curing characteristics such as overmolding, and a cured product obtained therefrom does not become hard or brittle, even if left at a temperature of 150° C. or higher for a long time. A The curable silicone composition comprises: an organopolysiloxane resin component which is non-hot-meltable, comprises a siloxane unit represented by SiO.sub.4/2 making up at least 20 mol % or more of the total siloxane units, and has a mass loss of 2.0 mass % or less when exposed to 200° C. for 1 hour; a liquid straight-chain or branched chain organopolysiloxane; and a curing agent.