Provided is a thermal interface material containing a divinyl polydimethylsiloxane, a chain extender, a crosslinker, 80 volume-percent or more thermally conductive filler, treating agent composition, platinum hydrosilylation catalyst, and up to 0.2 weight-percent hydrosilylation inhibitor; where the wherein weight-percent values are relative to thermal interface material composition weight, volume-percent values are relative to thermal interface material composition volume, the molar ratio of silyl hydride groups to vinyl groups in the thermal interface material composition is 0.4 or more and at the same time is 1.0 or less, and the molar ratio of silyl hydride functionality from the chain extender to silyl hydride functionality from the crosslinker is 13 or more and at the same time 70 or less.

Provided is a thermal interface material containing a divinyl polydimethylsiloxane, a chain extender, a crosslinker, 80 volume-percent or more thermally conductive filler, treating agent composition, platinum hydrosilylation catalyst, and up to 0.2 weight-percent hydrosilylation inhibitor; where the wherein weight-percent values are relative to thermal interface material composition weight, volume-percent values are relative to thermal interface material composition volume, the molar ratio of silyl hydride groups to vinyl groups in the thermal interface material composition is 0.4 or more and at the same time is 1.0 or less, and the molar ratio of silyl hydride functionality from the chain extender to silyl hydride functionality from the crosslinker is 13 or more and at the same time 70 or less.

Provided is a thermal interface material containing a divinyl polydimethylsiloxane, a chain extender, a crosslinker, 80 volume-percent or more thermally conductive filler, treating agent composition, platinum hydrosilylation catalyst, and up to 0.2 weight-percent hydrosilylation inhibitor; where the wherein weight-percent values are relative to thermal interface material composition weight, volume-percent values are relative to thermal interface material composition volume, the molar ratio of silyl hydride groups to vinyl groups in the thermal interface material composition is 0.4 or more and at the same time is 1.0 or less, and the molar ratio of silyl hydride functionality from the chain extender to silyl hydride functionality from the crosslinker is 13 or more and at the same time 70 or less.

This invention provides a readily adhesive polyester film that has fewer flaws and in which no appearance defects occur due to tight winding during the storage of rolled products, and a method for efficiently producing the readily adhesive polyester film. More specifically, this invention provides a readily adhesive polyester film comprising a polyester film as a base film and a readily adhesive layer on at least one side of the base film, wherein the base film contains particles with an average particle diameter of 0.1-2 μm or more in an amount of 1 mass % or less based on the mass of the base film, and the readily adhesive layer is a cured product of a composition comprising a copolymerized polyester resin (A), a blocked isocyanate group-containing urethane resin (B), and a silicone surfactant (C). This invention also provides a method for producing a readily adhesive polyester film.

This invention provides a readily adhesive polyester film that has fewer flaws and in which no appearance defects occur due to tight winding during the storage of rolled products, and a method for efficiently producing the readily adhesive polyester film. More specifically, this invention provides a readily adhesive polyester film comprising a polyester film as a base film and a readily adhesive layer on at least one side of the base film, wherein the base film contains particles with an average particle diameter of 0.1-2 μm or more in an amount of 1 mass % or less based on the mass of the base film, and the readily adhesive layer is a cured product of a composition comprising a copolymerized polyester resin (A), a blocked isocyanate group-containing urethane resin (B), and a silicone surfactant (C). This invention also provides a method for producing a readily adhesive polyester film.

Disclosed herein is a silicone gel having a surface treated with an additive. The additive comprises a synthetic, micronized hydrocarbon wax selected from a polyethylene, a polytetrafluoroethylene, a polypropylene, an amide wax, and any combination thereof. Alternatively, the additive comprises a micronized metallic stearate. The additive has a melting point of at least 90° C., or from about 90° C. to about 160° C.

Disclosed herein is a silicone gel having a surface treated with an additive. The additive comprises a synthetic, micronized hydrocarbon wax selected from a polyethylene, a polytetrafluoroethylene, a polypropylene, an amide wax, and any combination thereof. Alternatively, the additive comprises a micronized metallic stearate. The additive has a melting point of at least 90° C., or from about 90° C. to about 160° C.

Crosslinkable compositions based on organopolysiloxanes containing organyloxy groups which have improved wetting behavior, and especially improved early stability, contain (A) organopolysiloxanes composed of units
R.sub.aR.sup.1.sub.b(OR.sup.2).sub.cSiO.sub.(4−a−b−c)/2  (I), (B) organosilicon compounds
(R.sup.4O).sub.dSiR.sup.3.sub.(4−d)  (II),
and/or their partial hydrolysates,
and (C) organosilicon compounds containing basic nitrogen
(R.sup.6O).sub.eSiR.sup.5.sub.(4−e)  (III),
and/or their partial hydrolysates.

Crosslinkable compositions based on organopolysiloxanes containing organyloxy groups which have improved wetting behavior, and especially improved early stability, contain (A) organopolysiloxanes composed of units
R.sub.aR.sup.1.sub.b(OR.sup.2).sub.cSiO.sub.(4−a−b−c)/2  (I), (B) organosilicon compounds
(R.sup.4O).sub.dSiR.sup.3.sub.(4−d)  (II),
and/or their partial hydrolysates,
and (C) organosilicon compounds containing basic nitrogen
(R.sup.6O).sub.eSiR.sup.5.sub.(4−e)  (III),
and/or their partial hydrolysates.

Crosslinkable compositions based on organopolysiloxanes containing organyloxy groups which have improved wetting behavior, and especially improved early stability, contain (A) organopolysiloxanes composed of units
R.sub.aR.sup.1.sub.b(OR.sup.2).sub.cSiO.sub.(4−a−b−c)/2  (I), (B) organosilicon compounds
(R.sup.4O).sub.dSiR.sup.3.sub.(4−d)  (II),
and/or their partial hydrolysates,
and (C) organosilicon compounds containing basic nitrogen
(R.sup.6O).sub.eSiR.sup.5.sub.(4−e)  (III),
and/or their partial hydrolysates.