Patent classifications
C08K5/5419
Cross linked surface coating and interfacial layer for a perovskite material photovoltaic device
A photovoltaic device includes a photoactive material comprising a perovskite material and an interfacial layer comprising a cross-linked polymer that comprises a fullerene or fullerene derivative, a cross-linking agent, and one or more polymers selected from the group consisting of polystyrene, [6,6]-phenyl-C61-butyric acid methyl ester, poly(4-vinylphenol), [6,6]-phenyl-C61-butyric acid, and any combination thereof.
Cross linked surface coating and interfacial layer for a perovskite material photovoltaic device
A photovoltaic device includes a photoactive material comprising a perovskite material and an interfacial layer comprising a cross-linked polymer that comprises a fullerene or fullerene derivative, a cross-linking agent, and one or more polymers selected from the group consisting of polystyrene, [6,6]-phenyl-C61-butyric acid methyl ester, poly(4-vinylphenol), [6,6]-phenyl-C61-butyric acid, and any combination thereof.
Compound having alkoxysilyl group and active ester group, method for preparing same, composition comprising same, and use
The present invention relates to a novel compound having an alkoxysilyl group and an active ester group, a method for preparing the same, a composition comprising the same, and a use, wherein the novel compound exhibits improved low moisture absorption and/or low dielectric properties when cured as an epoxy composition, but is not accompanied by loss of thermal expansion characteristics. Disclosed are a novel compound of formulae AF to LF having an alkoxysilyl group and an active ester group, and a method for preparing the same, a composition comprising the same, and a use of same.
Compound having alkoxysilyl group and active ester group, method for preparing same, composition comprising same, and use
The present invention relates to a novel compound having an alkoxysilyl group and an active ester group, a method for preparing the same, a composition comprising the same, and a use, wherein the novel compound exhibits improved low moisture absorption and/or low dielectric properties when cured as an epoxy composition, but is not accompanied by loss of thermal expansion characteristics. Disclosed are a novel compound of formulae AF to LF having an alkoxysilyl group and an active ester group, and a method for preparing the same, a composition comprising the same, and a use of same.
Coating Composition
A coating composition comprising a resin material comprising polyester imide polymer one or more titanate material; and one or more OH reactive cross linking material.
Coating Composition
A coating composition comprising a resin material comprising polyester imide polymer one or more titanate material; and one or more OH reactive cross linking material.
One-part room-temperature curable compositions on the basis of organosilicon compounds and titanium curing catalysts
One-part room-temperature curable compositions (RTV-1 compositions) based on organosilicon compounds are less toxic compared to conventional compositions containing organotin compounds and, at the same time, have excellent curing properties, a skin formation time which allows proper handling and tooling, and excellent storage stability. The compositions contain: at least one organosilicon compound containing condensable groups; at least one curing agent having the formula R′Si(OOCR″).sub.3, wherein R′ is C.sub.3-C.sub.6 alkyl, and R″ is C.sub.1-C.sub.6 alkyl; at least one organotitanium compound curing catalyst; and at least one filler.
One-part room-temperature curable compositions on the basis of organosilicon compounds and titanium curing catalysts
One-part room-temperature curable compositions (RTV-1 compositions) based on organosilicon compounds are less toxic compared to conventional compositions containing organotin compounds and, at the same time, have excellent curing properties, a skin formation time which allows proper handling and tooling, and excellent storage stability. The compositions contain: at least one organosilicon compound containing condensable groups; at least one curing agent having the formula R′Si(OOCR″).sub.3, wherein R′ is C.sub.3-C.sub.6 alkyl, and R″ is C.sub.1-C.sub.6 alkyl; at least one organotitanium compound curing catalyst; and at least one filler.
Silicone formulation comprising an oxime crosslinker, cured silicone formulation and uses thereof
The present invention relates to a silicone formulation comprising an oxime silane crosslinker comprising 2-heptanoneoxime which exhibits significantly improved early cracking behaviour and/or skin formation time compared to silicone formulations employing conventional oxime silane crosslinkers, the corresponding cured silicone formulation, uses of the cured silicone formulation and uses of such oxime crosslinkers in the area of silicone formulations.
Silicone formulation comprising an oxime crosslinker, cured silicone formulation and uses thereof
The present invention relates to a silicone formulation comprising an oxime silane crosslinker comprising 2-heptanoneoxime which exhibits significantly improved early cracking behaviour and/or skin formation time compared to silicone formulations employing conventional oxime silane crosslinkers, the corresponding cured silicone formulation, uses of the cured silicone formulation and uses of such oxime crosslinkers in the area of silicone formulations.