Described herein is a two-part condensation curable adhesive composition suitable for adhering a front lens having an inner surface coated with an anti-haze coating to a lamp body to create a sealed lamp unit. In general, once cured in place, residual ingredients from the adhesive composition or by-products of cure reactions thereof do not visibly inhibit functionality of the anti-haze coating of the sealed lamp unit.

Described herein is a two-part condensation curable adhesive composition suitable for adhering a front lens having an inner surface coated with an anti-haze coating to a lamp body to create a sealed lamp unit. In general, once cured in place, residual ingredients from the adhesive composition or by-products of cure reactions thereof do not visibly inhibit functionality of the anti-haze coating of the sealed lamp unit.

A thermally conductive silicone composition is provided. The composition comprises: (A) an alkenyl group-containing organopolysiloxane; (B) an organohydrogenpolysiloxane having an average of two to four silicon-bonded hydrogen atoms in a molecule, wherein an amount of the silicon-bonded hydrogen atoms in component (B) is 0.2 to 5 moles per mole of the alkenyl groups in component (A), and at least two of the silicon-bonded hydrogen atoms are located on the side chains of the molecule; (C) a hydrosilylation reaction catalyst; (D) a thermally conductive filler; (E) an alkoxysilane having an alkyl group containing 6 or more carbon atoms in a molecule; and (F) glass beads. A thermally conductive member is produced from the thermally conductive silicone composition. An electronic device has the thermally conductive member and a manufacturing method of the electronic device includes using the thermally conductive silicone composition.

A thermally conductive silicone composition is provided. The composition comprises: (A) an alkenyl group-containing organopolysiloxane; (B) an organohydrogenpolysiloxane having an average of two to four silicon-bonded hydrogen atoms in a molecule, wherein an amount of the silicon-bonded hydrogen atoms in component (B) is 0.2 to 5 moles per mole of the alkenyl groups in component (A), and at least two of the silicon-bonded hydrogen atoms are located on the side chains of the molecule; (C) a hydrosilylation reaction catalyst; (D) a thermally conductive filler; (E) an alkoxysilane having an alkyl group containing 6 or more carbon atoms in a molecule; and (F) glass beads. A thermally conductive member is produced from the thermally conductive silicone composition. An electronic device has the thermally conductive member and a manufacturing method of the electronic device includes using the thermally conductive silicone composition.

A curable silicone composition is provided. The composition comprises: (A) an epoxy-functional silicone resin having monovalent aromatic hydrocarbon groups; (B) an epoxy-functional silicone; (C) a cationic photoinitiator; and (D) a silatrane derivative or a carbasilatrane derivative, wherein each derivative has at least one silicon atom-bonded alkoxy group per molecule. The composition has excellent curability with UV radiation, and further with heating, generally forms a cured product with excellent thermal and light resistance, and adhesion properties.

A curable silicone composition is provided. The composition comprises: (A) an epoxy-functional silicone resin having monovalent aromatic hydrocarbon groups; (B) an epoxy-functional silicone; (C) a cationic photoinitiator; and (D) a silatrane derivative or a carbasilatrane derivative, wherein each derivative has at least one silicon atom-bonded alkoxy group per molecule. The composition has excellent curability with UV radiation, and further with heating, generally forms a cured product with excellent thermal and light resistance, and adhesion properties.

Provided is a composite encapsulating material and a photovoltaic module encapsulated with the composite encapsulating material, which relate to the technical field of photovoltaic modules. At least a partial area of the composite encapsulating material includes a high insulation material, and the high insulation material includes polyimide, modifier and modified polyimide. The above technical solution can improve an insulation performance of the encapsulating material, reduce a blank area of an edge of the module, reduce a weight of the photovoltaic module, and further reduce comprehensive cost of the photovoltaic module.

Provided is a composite encapsulating material and a photovoltaic module encapsulated with the composite encapsulating material, which relate to the technical field of photovoltaic modules. At least a partial area of the composite encapsulating material includes a high insulation material, and the high insulation material includes polyimide, modifier and modified polyimide. The above technical solution can improve an insulation performance of the encapsulating material, reduce a blank area of an edge of the module, reduce a weight of the photovoltaic module, and further reduce comprehensive cost of the photovoltaic module.

A silicone pressure sensitive adhesive composition is curable to form a silicone pressure sensitive adhesive. The silicone pressure sensitive adhesive composition can be coated on a substrate and cured to form a protective film. The protective film can be adhered to an anti-fingerprint coating on display glass, such as cover glass for a smartphone.

A silicone pressure sensitive adhesive composition is curable to form a silicone pressure sensitive adhesive. The silicone pressure sensitive adhesive composition can be coated on a substrate and cured to form a protective film. The protective film can be adhered to an anti-fingerprint coating on display glass, such as cover glass for a smartphone.