Patent classifications
C08K5/5419
THERMALLY CONDUCTIVE CURABLE COMPOSITION
A moisture-curable composition, including between 0.6 and 15.0 wt.-% of at least one organic polymer containing reactive silane groups, between 70 and 95 wt.-% of at least one filler, at least one dispersion additive, optionally at least one catalyst for the curing of silane-functional polymers and up to 10 wt.-% of at least one plasticizer, characterized in that said filler is selected from the list consisting of aluminium oxide, aluminium hydroxide, boron nitride, aluminium nitride, zinc oxide, silver, copper, aluminium, chalk, aluminosilicate, graphite, and any mixture of these fillers; with the proviso that the amount of chalk in the filler does not exceed 25 wt.-% of the total amount of filler. The moisture-curable composition shows excellent thermal conductivity and is particularly suitable as adhesive, gap filler, or sealant suitable for e-coat applications and battery bonding especially in electric automobile assembly.
CURABLE COMPOSITIONS COMPRISING UNSATURATED POLYOLEFINS
The present disclosure relates to unsaturated polyolefins and processes for preparing the same. The present disclosure further relates to curable formulations comprising the unsaturated polyolefins that show improved crosslinking.
CURABLE COMPOSITIONS COMPRISING UNSATURATED POLYOLEFINS
Disclosed relates to unsaturated polyolefins and processes for preparing the same. Disclosed further relates to curable formulations comprising the unsaturated polyolefins that show improved crosslinking.
CURABLE COMPOSITIONS COMPRISING UNSATURATED POLYOLEFINS
The present disclosure relates to unsaturated polyolefins and processes for preparing the same. The present disclosure further relates to curable formulations comprising the unsaturated polyolefins that show improved crosslinking.
CURABLE COMPOSITIONS COMPRISING UNSATURATED POLYOLEFINS
The present disclosure relates to unsaturated polyolefins and processes for preparing the same. The present disclosure further relates to curable formulations comprising the unsaturated polyolefins that show improved crosslinking.
CURABLE ORGANOPOLYSILOXANE COMPOSITION FOR FORMING FILM AND PRODUCTION METHOD FOR ORGANOPOLYSILOXANE CURED PRODUCT FILM
Provided is a curable organopolysiloxane composition for forming a film capable of uniform and thin film formation, and a method of manufacturing an organopolysiloxane cured film using the same. The curable organopolysiloxane composition for forming a film, comprises: a curing reactive organopolysiloxane, a curing agent, and one or more type of organic solvent selected from (D1) organic polar solvents, (D2) low molecular weight siloxane solvents, and (D3) halogen solvents, or a mixed solvent thereof. The viscosity of the entire composition measured at a shear rate of 0.1 (s.sup.−1) at 25° C. is 100,000 mPa.Math.s or less, the viscosity of the entire composition measured at a shear rate of 10.0 (s.sup.−1) is within a range of 5 to 10,000 mPa.Math.s, and a thixotropic ratio thereof is 25.0 or less.
CURABLE ORGANOPOLYSILOXANE COMPOSITION FOR FORMING FILM AND PRODUCTION METHOD FOR ORGANOPOLYSILOXANE CURED PRODUCT FILM
Provided is a curable organopolysiloxane composition for forming a film capable of uniform and thin film formation, and a method of manufacturing an organopolysiloxane cured film using the same. The curable organopolysiloxane composition for forming a film, comprises: a curing reactive organopolysiloxane, a curing agent, and one or more type of organic solvent selected from (D1) organic polar solvents, (D2) low molecular weight siloxane solvents, and (D3) halogen solvents, or a mixed solvent thereof. The viscosity of the entire composition measured at a shear rate of 0.1 (s.sup.−1) at 25° C. is 100,000 mPa.Math.s or less, the viscosity of the entire composition measured at a shear rate of 10.0 (s.sup.−1) is within a range of 5 to 10,000 mPa.Math.s, and a thixotropic ratio thereof is 25.0 or less.
CURABLE SILICONE-BASED COMPOSITIONS AND APPLICATIONS THEREOF
The present technology provides a curable silicone-based composition comprising a hybrid silicone polymer, a catalyst, and a filler. The present technology provides a curable silicone composition comprising a polymer A comprising an organic molecule or a siloxane molecule comprising an alkoxy radical, a hydroxyl radical, an isocyanate radical, a primary amine, or a carboxylic radical; optionally a polymer B comprising an organic molecule, a siloxane molecule, or a hybrid-siloxane molecule; a catalyst; and a filler.
CURABLE SILICONE-BASED COMPOSITIONS AND APPLICATIONS THEREOF
The present technology provides a curable silicone-based composition comprising a hybrid silicone polymer, a catalyst, and a filler. The present technology provides a curable silicone composition comprising a polymer A comprising an organic molecule or a siloxane molecule comprising an alkoxy radical, a hydroxyl radical, an isocyanate radical, a primary amine, or a carboxylic radical; optionally a polymer B comprising an organic molecule, a siloxane molecule, or a hybrid-siloxane molecule; a catalyst; and a filler.
POLYARYLATE RESIN COMPOSITION AND MOLDED ARTICLE USING THE SAME
The present invention provides a polyarylate resin composition sufficiently excellent in heat resistance, transparency, heat discoloration resistance and moist heat resistance, and a molded article made of the same. The present invention relates to a polyarylate resin composition containing 0.005˜5 parts by mass of a silane compound (C) with a boiling point of 200° C. or more, based on 100 parts by mass of the total of a polyarylate resin (A) and a polycarbonate resin (B), a content ratio of the polyarylate resin (A) and the polycarbonate resin (B) being 5/95 to 95/5 (mass ratio).