Provided is: a multicomponent curable thermally conductive silicone gel composition which has a high thermal conductivity, has excellent gap-filling ability and repairability, and has superior storage stability; a thermally conductive member comprising the composition; and a heat dissipating structure using the same. The thermally conductive silicone gel composition comprises: (A) an alkenyl group-containing organopolysiloxane; (B) an organohydrogenpolysiloxane; (C) a catalyst for hydrosilylation reaction; (D) a thermally conductive filler; (E) a silane-coupling agent or a hydrolysis condensation product thereof; and (F) a specific organopolysiloxane having a hydrolyzable silyl group at one end thereof. The thermally conductive silicone gel composition includes (I) a liquid composition that includes components (A), (C), (D), (E), and (F), but does not include component (B) and (II) a liquid composition that includes components (B), (D), (E), and (F), but does not include component (C) which are individually stored.

A thermally conductive polysiloxane composition includes (A) a thermally conductive filler, and (B) at least one member selected from the group consisting of an alkoxysilyl group-containing compound and a dimethylpolysiloxane. The component (A) includes at least two thermally conductive fillers having different average particle diameters, and (A-1) indefinite-shaped aluminum nitride particles having an average particle diameter of 30 μm to 150 μm in an amount of at least 20% by mass, based on the mass of a total of the component (A).

A thermally conductive polysiloxane composition includes (A) a thermally conductive filler, and (B) at least one member selected from the group consisting of an alkoxysilyl group-containing compound and a dimethylpolysiloxane. The component (A) includes at least two thermally conductive fillers having different average particle diameters, and (A-1) indefinite-shaped aluminum nitride particles having an average particle diameter of 30 μm to 150 μm in an amount of at least 20% by mass, based on the mass of a total of the component (A).

The purpose of the present invention is to provide a curable resin composition which forms a cured product having excellent heat resistance, light resistance, and flexibility. The present invention provides a curable resin composition comprising the following components: (A): a polyorganosiloxane represented by the average unit formula: (SiO.sub.4/2).sub.a1(R.sup.1SiO.sub.3/2).sub.a2(R.sup.1.sub.2SiO.sub.2/2).sub.a3(R.sup.1.sub.3SiO.sub.1/2).sub.a4 wherein each R.sup.1 is alkyl, aryl, alkenyl, etc., a percentage of the alkyl is 50 to 98 mol %, a percentage of the aryl is 1 to 50 mol %, and a percentage of the alkenyl is 1 to 35 mol % based on the total amount of R.sup.1, and a1>0, a2>0, a3≥0, a4>0, 0.01≤a1/a2≤10, and a1+a2+a3+a4=1; (B) a polyorganosiloxane represented by the average composition formula:
R.sup.2.sub.mH.sub.nSiO.sub.[(4-m-n)/2]
wherein R.sup.2 is alkyl or aryl, and 0.7≤m≤2.1, 0.001≤n≤1.5, and 0.8≤m+n≤3; (C): a zirconium compound; and (D): a hydrosilylation catalyst.

The purpose of the present invention is to provide a curable resin composition which forms a cured product having excellent heat resistance, light resistance, and flexibility. The present invention provides a curable resin composition comprising the following components: (A): a polyorganosiloxane represented by the average unit formula: (SiO.sub.4/2).sub.a1(R.sup.1SiO.sub.3/2).sub.a2(R.sup.1.sub.2SiO.sub.2/2).sub.a3(R.sup.1.sub.3SiO.sub.1/2).sub.a4 wherein each R.sup.1 is alkyl, aryl, alkenyl, etc., a percentage of the alkyl is 50 to 98 mol %, a percentage of the aryl is 1 to 50 mol %, and a percentage of the alkenyl is 1 to 35 mol % based on the total amount of R.sup.1, and a1>0, a2>0, a3≥0, a4>0, 0.01≤a1/a2≤10, and a1+a2+a3+a4=1; (B) a polyorganosiloxane represented by the average composition formula:
R.sup.2.sub.mH.sub.nSiO.sub.[(4-m-n)/2]
wherein R.sup.2 is alkyl or aryl, and 0.7≤m≤2.1, 0.001≤n≤1.5, and 0.8≤m+n≤3; (C): a zirconium compound; and (D): a hydrosilylation catalyst.

Provided is a resin composition for a foam that may include a base resin having a reactive silicon group (A), a chemical foaming agent (B), and a silanol condensation catalyst (D), wherein the chemical foaming agent (B) comprises a dicarbonate diester (B-1). Further provided is a method for producing a foam, that may include: a mixing step of mixing a liquid, which may include a base resin having a reactive silicon group (A) and a dicarbonate diester (B-1), with a silanol condensation catalyst (D) to obtain a mixed liquid, wherein in the mixed liquid, a rate of foaming effected by decomposition of the dicarbonate diester (B-1), and a rate of a curing reaction of the mixed liquid effected by a reaction between the reactive silicon groups may each be adjusted, such that a foam having an expansion ratio of 2-fold or more and 60-fold or less is obtained.

Provided is a resin composition for a foam that may include a base resin having a reactive silicon group (A), a chemical foaming agent (B), and a silanol condensation catalyst (D), wherein the chemical foaming agent (B) comprises a dicarbonate diester (B-1). Further provided is a method for producing a foam, that may include: a mixing step of mixing a liquid, which may include a base resin having a reactive silicon group (A) and a dicarbonate diester (B-1), with a silanol condensation catalyst (D) to obtain a mixed liquid, wherein in the mixed liquid, a rate of foaming effected by decomposition of the dicarbonate diester (B-1), and a rate of a curing reaction of the mixed liquid effected by a reaction between the reactive silicon groups may each be adjusted, such that a foam having an expansion ratio of 2-fold or more and 60-fold or less is obtained.

The present invention relates to a coating composition comprising (A) hydrophobically modified fumed silica particles, (B) one or more compounds of hydrolyzed organosilanes, and (C) a solvent or mixture of solvents. The coating composition may be used to treat substrates such as glass surface to make the substrate surfaces possess valuable properties such as water repellency, dirt repellency and self-cleaning with water.

The present invention relates to a coating composition comprising (A) hydrophobically modified fumed silica particles, (B) one or more compounds of hydrolyzed organosilanes, and (C) a solvent or mixture of solvents. The coating composition may be used to treat substrates such as glass surface to make the substrate surfaces possess valuable properties such as water repellency, dirt repellency and self-cleaning with water.

A thermally conductive silicone composition is provided. The composition comprises: (A) an alkenyl group-containing organopolysiloxane; (B) an organohydrogenpolysiloxane having an average of two to four silicon-bonded hydrogen atoms in a molecule, wherein an amount of the silicon-bonded hydrogen atoms in component (B) is 0.2 to 5 moles per mole of the alkenyl groups in component (A), and at least two of the silicon-bonded hydrogen atoms are located on the side chains of the molecule; (C) a hydrosilylation reaction catalyst; (D) a thermally conductive filler; (E) an alkoxysilane having an alkyl group containing 6 or more carbon atoms in a molecule; and (F) glass beads. A thermally conductive member is produced from the thermally conductive silicone composition. An electronic device has the thermally conductive member and a manufacturing method of the electronic device includes using the thermally conductive silicone composition.