C08K5/5419

THERMALLY CONDUCTIVE POLYSILOXANE COMPOSITION

A thermally conductive polysiloxane composition includes (A) a thermally conductive filler, and (B) at least one member selected from the group consisting of an alkoxysilyl group-containing compound and a dimethylpolysiloxane. The component (A) includes at least two thermally conductive fillers having different average particle diameters, and (A-1) indefinite-shaped aluminum nitride particles having an average particle diameter of 30 μm to 150 μm in an amount of at least 20% by mass, based on the mass of a total of the component (A).

OPTICAL TRANSPARENT RESIN AND ELECTRONIC ELEMENT FORMED USING SAME

The present invention relates to an optical transparent resin comprising: 1) a polyorganosiloxane resin represented by chemical formula 1 above; and 2) at least one light initiator, the optical transparent resin having a refractive index of 1.41-1.55, and to an electronic element formed by using the optical transparent resin.

OPTICAL TRANSPARENT RESIN AND ELECTRONIC ELEMENT FORMED USING SAME

The present invention relates to an optical transparent resin comprising: 1) a polyorganosiloxane resin represented by chemical formula 1 above; and 2) at least one light initiator, the optical transparent resin having a refractive index of 1.41-1.55, and to an electronic element formed by using the optical transparent resin.

OPTICAL TRANSPARENT RESIN AND ELECTRONIC ELEMENT FORMED USING SAME

The present invention relates to an optical transparent resin comprising: 1) a polyorganosiloxane resin represented by chemical formula 1 above; and 2) at least one light initiator, the optical transparent resin having a refractive index of 1.41-1.55, and to an electronic element formed by using the optical transparent resin.

Metal-polyorganosiloxanes

Metal-polyorganosiloxane materials, methods of making and using them, and manufactured articles and devices containing them are disclosed. The metal-polyorganosiloxane materials have improved thermal stability and comprises a metal-polyorganosiloxane mixture that is free of condensation-curable polyorganosiloxane and solid particles other than metal particles and ceramic particles, the metal-organosiloxane mixture otherwise comprising: (A) a polyorganosiloxane that is free of silicon-bonded organoheteryl groups; (B) a hydrocarbylene-based multipodal silane; and (C) metal particles.

Metal-polyorganosiloxanes

Metal-polyorganosiloxane materials, methods of making and using them, and manufactured articles and devices containing them are disclosed. The metal-polyorganosiloxane materials have improved thermal stability and comprises a metal-polyorganosiloxane mixture that is free of condensation-curable polyorganosiloxane and solid particles other than metal particles and ceramic particles, the metal-organosiloxane mixture otherwise comprising: (A) a polyorganosiloxane that is free of silicon-bonded organoheteryl groups; (B) a hydrocarbylene-based multipodal silane; and (C) metal particles.

Metal-polyorganosiloxanes

Metal-polyorganosiloxane materials, methods of making and using them, and manufactured articles and devices containing them are disclosed. The metal-polyorganosiloxane materials have improved thermal stability and comprises a metal-polyorganosiloxane mixture that is free of condensation-curable polyorganosiloxane and solid particles other than metal particles and ceramic particles, the metal-organosiloxane mixture otherwise comprising: (A) a polyorganosiloxane that is free of silicon-bonded organoheteryl groups; (B) a hydrocarbylene-based multipodal silane; and (C) metal particles.

Process for producing compositions crosslinkable to elastomers

Neutral moisture curable organopolysiloxane compositions are prepared from silanol-stopped organopolysiloxanes, alkoxysilanes, aminosilanes, and ketoximino silanes, and contain less than 1 weight percent oximes upon storage.

Process for producing compositions crosslinkable to elastomers

Neutral moisture curable organopolysiloxane compositions are prepared from silanol-stopped organopolysiloxanes, alkoxysilanes, aminosilanes, and ketoximino silanes, and contain less than 1 weight percent oximes upon storage.

Non-Polar Ethylene-Based Polymer Compositions for Encapsulant Films

An encapsulant film is made from a composition comprising (A) a non-polar ethylene-based polymer; (B) an organic peroxide; (C) a silane coupling agent; and (D) a co-agent comprising a compound of Structure I wherein R.sub.1-R.sub.6 each is independently selected from the group consisting of hydrogen, a C.sub.1-C.sub.8 hydrocarbyl group, a C.sub.1-C.sub.36 substituted hydrocarbyl group, and combinations thereof.

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