A process of preparing a compounded hydrostable poly(aliphatic ester-carbonate) includes providing a hydrostable poly(aliphatic ester-carbonate), compounding in an extruder the hydrostable poly(aliphatic ester-carbonate) and 0.05 wt % to 0.60 wt % of a multifunctional epoxide compounding stabilizer, based on the total weight of the compounded hydrostable poly(aliphatic ester-carbonate), under vacuum of 17000 to 85000 Pascals, and a torque of 30% to 75%, to provide the compounded hydrostable poly(aliphatic ester-carbonate). After compounding, at least one of the following apply: the inter-sample variability in molecular weight is less than 5%, wherein inter-sample variability is determined by comparing five 100 mil chips of the compounded hydrostable poly(aliphatic ester-carbonate); the % weight average molecular weight (MW) difference is less than 5% after hydroaging at 85° C. and 85% humidity; or the compounded poly(aliphatic ester-carbonate) has less than 75 ppm of unreacted —COOH end groups measured by .sup.31P NMR.

A process of preparing a compounded hydrostable poly(aliphatic ester-carbonate) includes providing a hydrostable poly(aliphatic ester-carbonate), compounding in an extruder the hydrostable poly(aliphatic ester-carbonate) and 0.05 wt % to 0.60 wt % of a multifunctional epoxide compounding stabilizer, based on the total weight of the compounded hydrostable poly(aliphatic ester-carbonate), under vacuum of 17000 to 85000 Pascals, and a torque of 30% to 75%, to provide the compounded hydrostable poly(aliphatic ester-carbonate). After compounding, at least one of the following apply: the inter-sample variability in molecular weight is less than 5%, wherein inter-sample variability is determined by comparing five 100 mil chips of the compounded hydrostable poly(aliphatic ester-carbonate); the % weight average molecular weight (MW) difference is less than 5% after hydroaging at 85° C. and 85% humidity; or the compounded poly(aliphatic ester-carbonate) has less than 75 ppm of unreacted —COOH end groups measured by .sup.31P NMR.

An epoxy dual cure resin useful for additive manufacturing of three-dimensional objects includes: (i) a photoinitiator; (ii) monomers and/or prepolymers that are polymerizable by exposure to actinic radiation or light; (iii) optionally, a light absorbing pigment or dye; (iv) an epoxy resin; (v) optionally, but in some embodiments preferably, an organic hardener co-polymerizable with the epoxy resin; (vi) optionally but preferably a dual reactive compound having substituted thereon a first reactive group reactive with said monomers and/or prepolymers that are polymerizable by exposure to actinic radiation or light, and a second reactive group reactive with said epoxy resin (e.g., an epoxy acrylate); (vii) optionally a diluent; (viii) optionally a filler; and (ix) optionally, a co-monomer and/or a co-prepolymer. Methods of using the same in additive manufacturing are also described.

An epoxy dual cure resin useful for additive manufacturing of three-dimensional objects includes: (i) a photoinitiator; (ii) monomers and/or prepolymers that are polymerizable by exposure to actinic radiation or light; (iii) optionally, a light absorbing pigment or dye; (iv) an epoxy resin; (v) optionally, but in some embodiments preferably, an organic hardener co-polymerizable with the epoxy resin; (vi) optionally but preferably a dual reactive compound having substituted thereon a first reactive group reactive with said monomers and/or prepolymers that are polymerizable by exposure to actinic radiation or light, and a second reactive group reactive with said epoxy resin (e.g., an epoxy acrylate); (vii) optionally a diluent; (viii) optionally a filler; and (ix) optionally, a co-monomer and/or a co-prepolymer. Methods of using the same in additive manufacturing are also described.

A polymerizable composition, which includes (a) at least one radically polymerizable oligomer, (b) at least one radically polymerizable monomer and (c) at least one initiator for the radical polymerization, characterized in that the radically polymerizable oligomer (a) is selected from the group consisting of aliphatic urethane (meth)acrylate oligomers, epoxy (meth)acrylate oligomers and polyether urethane (meth)acrylate oligomers, and the radically polymerizable monomer (b) is polyfunctional.

Disclosed in the present disclosure are a quantum dot dispersed resin molded body, a quantum dot dispersed colloid, and a light emitting device. The quantum dot dispersed resin molded body includes quantum dots dispersed in an acrylate polymer, at least a portion of repeating units of the acrylate polymer comprise a C═C double bond, and the degree of polymerization n of the repeating units is greater than or equal to 2, the quantum dot dispersed resin molded body is formed by cross-linking and curing the quantum dot dispersed colloid.

Disclosed in the present disclosure are a quantum dot dispersed resin molded body, a quantum dot dispersed colloid, and a light emitting device. The quantum dot dispersed resin molded body includes quantum dots dispersed in an acrylate polymer, at least a portion of repeating units of the acrylate polymer comprise a C═C double bond, and the degree of polymerization n of the repeating units is greater than or equal to 2, the quantum dot dispersed resin molded body is formed by cross-linking and curing the quantum dot dispersed colloid.

Described herein are polymer compositions including (i) a polymer blend containing an amorphous polyester copolymer and a semi-crystalline polyamide polymer (“polyester/polyamide blend”), (ii) 1 weight percent (wt. %) to 5 wt. % of an epoxy functionalized impact modifier and optionally (iii) one or more additives. It was surprisingly found that incorporation of a specific amount of an epoxy functionalized impact modifier into polymer compositions including a polyester/polyamide blend provided for significantly improved impact performance, relative to corresponding polymer compositions incorporating non-epoxy functionalized impact modifiers or corresponding polymer compositions free of impact modifiers. Due at least in part to the significantly improved impact performance and outstanding chemical resistance, the polymer compositions described herein can be incorporated in a wide variety of application settings, including but not limited to mobile electronic application settings.

Described herein are polymer compositions including (i) a polymer blend containing an amorphous polyester copolymer and a semi-crystalline polyamide polymer (“polyester/polyamide blend”), (ii) 1 weight percent (wt. %) to 5 wt. % of an epoxy functionalized impact modifier and optionally (iii) one or more additives. It was surprisingly found that incorporation of a specific amount of an epoxy functionalized impact modifier into polymer compositions including a polyester/polyamide blend provided for significantly improved impact performance, relative to corresponding polymer compositions incorporating non-epoxy functionalized impact modifiers or corresponding polymer compositions free of impact modifiers. Due at least in part to the significantly improved impact performance and outstanding chemical resistance, the polymer compositions described herein can be incorporated in a wide variety of application settings, including but not limited to mobile electronic application settings.

A powder coating having ultra-high weather-resistant and matting effects includes a first powder coating component A and a second powder coating component B which are dry-mixed into a whole and have different curing speeds. The raw materials of the first powder coating component A include a first polyester resin and a curing agent capable of undergoing a curing reaction with the first polyester resin; raw materials of the second powder coating component B include a second polyester resin and an acrylic resin containing epoxy groups, and the acrylic resin is capable of undergoing a curing reaction with the second polyester resin; an acid value of the first polyester resin is not less than 15, and an acid value of the second polyester resin is not less than 15.