The present disclosure relates to a super absorbent polymer exhibiting improved rewetting property and excellent absorption property, and a preparation method of the same. This preparation method of a super absorbent polymer includes the steps of: preparing a base resin in which an acrylic acid-based monomer having at least partially neutralized acidic groups and an internal cross-linking agent are cross-linked and polymerized; and heating the base resin in the presence of a surface cross-linking agent to carry out surface modification, wherein the internal cross-linking agent includes a poly(meth)acrylate of polyols-based first internal cross-linking agent and a polyglycidyl ether of polyols-based second internal cross-linking agent in a specific weight ratio.

A method of manufacturing copolymer includes mixing and reacting a polyester, an aliphatic polyol or an aliphatic polyol oligomer, and a first catalyst in a first region of a screw to form a polyester polyol, and side-feeding a lactone or a lactam to a second region of the screw to copolymerize the lactone or a lactam and the polyester polyol to form a copolymer, wherein the first region and the second region are continuous connecting regions.

A method of manufacturing copolymer includes mixing and reacting a polyester, an aliphatic polyol or an aliphatic polyol oligomer, and a first catalyst in a first region of a screw to form a polyester polyol, and side-feeding a lactone or a lactam to a second region of the screw to copolymerize the lactone or a lactam and the polyester polyol to form a copolymer, wherein the first region and the second region are continuous connecting regions.

A technical problem to be achieved by the present disclosure is to provide an adhesive resin composition for a conductor, which contains inorganic fillers having different average particle diameters and has enhanced thermal conductivity as a result of controlling the content of the inorganic fillers, and an adhesive film for a semiconductor produced using the same.

A technical problem to be achieved by the present disclosure is to provide an adhesive resin composition for a conductor, which contains inorganic fillers having different average particle diameters and has enhanced thermal conductivity as a result of controlling the content of the inorganic fillers, and an adhesive film for a semiconductor produced using the same.

A curable coating composition is provided having multi-functionalized acrylic copolymer and amino-functional silicone resin curing agents. The acrylic copolymer of the curable coating composition has, in polymerized form, epoxy functionalized groups and cure compatibility groups. The coating compositions are useful in the field of superior weatherable and durable coatings and are useful to replace isocyanate-containing polyurethane based coatings. Also provided are coated articles produced from the curable composition.

An asphalt modifier comprising a polyolefin-based copolymer comprising an ethylene-derived monomer unit and a monomer unit having an epoxy group is disclosed. The content of the monomer unit having an epoxy group is 13% by mass or more based on the mass of the polyolefin-based copolymer.

To provide an antistatic laminate and an antistatic adhesive agent capable of maintaining antistatic performance and adhesive force necessary during high-temperature heat treatment, easily removable from an adherend after heat treatment, and capable of reducing or eliminating contaminants such as an antistatic agent and an adhesive agent residue present on an adherend obtained after the removal.

To provide an antistatic laminate and an antistatic adhesive agent capable of maintaining antistatic performance and adhesive force necessary during high-temperature heat treatment, easily removable from an adherend after heat treatment, and capable of reducing or eliminating contaminants such as an antistatic agent and an adhesive agent residue present on an adherend obtained after the removal.

The present invention is a negative photosensitive resin composition including: (A) an alkali-soluble resin containing at least one or more structures selected from a polyimide structure, a polybenzoxazole structure, a polyamide-imide structure, and a precursor structure thereof; (B) a crosslinkable polymer compound containing a structural unit represented by the following general formula (1) and having a group crosslinked with the component (A); (C) a compound that generates an acid by light; and (D) a heat crosslinking agent. An object of the present invention is to provide a negative photosensitive resin composition that enables formation of a fine pattern with high rectangularity and high resolution, has excellent mechanical characteristics even when cured at low temperatures, and furthermore, has no degradation in adhesive force between before and after a high temperature and high humidity test.

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